JP2008198974A5 - - Google Patents
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- Publication number
- JP2008198974A5 JP2008198974A5 JP2007226126A JP2007226126A JP2008198974A5 JP 2008198974 A5 JP2008198974 A5 JP 2008198974A5 JP 2007226126 A JP2007226126 A JP 2007226126A JP 2007226126 A JP2007226126 A JP 2007226126A JP 2008198974 A5 JP2008198974 A5 JP 2008198974A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- processing
- shearer
- nanobubbles
- supply unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
ナノバブルを発生させ、そのナノバブルを上記処理液に混合させるナノバブル発生手段
を備え、
上記ナノバブル発生手段は、
内部に剪断室が形成された気体剪断器と、
上記気体剪断器の軸方向の一端部に設けられ上記気体を上記剪断室に旋回させて供給する気体供給部と、
上記気体剪断器の一端部の外周面に設けられ上記処理液を上記剪断室に旋回させて供給し、上記気体との旋回速度の差によって上記気体から上記ナノバブルを発生させる液体供給部と
によって構成されていることを特徴とする基板の処理装置。 A processing apparatus for processing a substrate with a processing liquid,
A nanobubble generating means for generating nanobubbles and mixing the nanobubbles with the processing solution;
The nanobubble generating means is:
A gas shearer having a shear chamber formed therein;
A gas supply unit provided at one end of the gas shearer in the axial direction to supply the gas by swirling the gas into the shear chamber;
A liquid supply unit that is provided on the outer peripheral surface of one end of the gas shearer and that rotates and supplies the processing liquid to the shearing chamber and generates the nanobubbles from the gas due to a difference in swirling speed with the gas. A substrate processing apparatus.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007226126A JP5252861B2 (en) | 2007-01-15 | 2007-08-31 | Substrate processing equipment |
| CN2008800019551A CN101578688B (en) | 2007-01-15 | 2008-01-11 | Apparatus and method for processing substrate |
| TW97101146A TWI415694B (en) | 2007-01-15 | 2008-01-11 | Substrate processing device and processing method thereof |
| PCT/JP2008/050264 WO2008087903A1 (en) | 2007-01-15 | 2008-01-11 | Apparatus and method for processing substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007006061 | 2007-01-15 | ||
| JP2007006061 | 2007-01-15 | ||
| JP2007226126A JP5252861B2 (en) | 2007-01-15 | 2007-08-31 | Substrate processing equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008198974A JP2008198974A (en) | 2008-08-28 |
| JP2008198974A5 true JP2008198974A5 (en) | 2010-10-14 |
| JP5252861B2 JP5252861B2 (en) | 2013-07-31 |
Family
ID=39757617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007226126A Active JP5252861B2 (en) | 2007-01-15 | 2007-08-31 | Substrate processing equipment |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5252861B2 (en) |
| CN (1) | CN101578688B (en) |
| TW (1) | TWI415694B (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010153475A (en) * | 2008-12-24 | 2010-07-08 | Sokudo Co Ltd | Substrate treatment apparatus and substrate treatment method |
| JP5666086B2 (en) | 2008-12-25 | 2015-02-12 | ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ | Silicon wafer cleaning equipment |
| JP2010221069A (en) * | 2009-03-19 | 2010-10-07 | Kanto Auto Works Ltd | Washing method of coating machine and coating apparatus |
| JP5656245B2 (en) * | 2010-06-17 | 2015-01-21 | 芝浦メカトロニクス株式会社 | Cleaning method and cleaning device |
| JP2012170872A (en) * | 2011-02-21 | 2012-09-10 | Shibaura Mechatronics Corp | Substrate cleaning apparatus, substrate cleaning method and apparatus and method for manufacturing display |
| JP2013191779A (en) * | 2012-03-14 | 2013-09-26 | Toshiba Corp | Processor and processing method |
| CN104898324B (en) * | 2014-03-07 | 2017-11-17 | 芝浦机械电子株式会社 | Connect liquid processing device, connect liquid processing method, substrate board treatment and substrate processing method using same |
| KR101519630B1 (en) * | 2014-03-31 | 2015-05-14 | (주) 에스엠씨 | An etching system |
| TWI648098B (en) * | 2017-11-14 | 2019-01-21 | 亞智科技股份有限公司 | Gas-liquid mixing apparauts, process equipment and gas-liquid mixing method |
| CN107952741A (en) * | 2017-11-30 | 2018-04-24 | 江苏维仪工业科技有限公司 | A kind of application method of micro-nano generator in plating is washed |
| JPWO2019156180A1 (en) * | 2018-02-09 | 2021-04-30 | 国立大学法人 東京大学 | Dissolution system for poorly water-soluble organic compounds, dissolution method for poorly water-soluble organic compounds, and odor detection system |
| CN110153057A (en) * | 2018-02-14 | 2019-08-23 | 特铨股份有限公司 | Substrate cleaning apparatus and substrate-cleaning method |
| CN110045522A (en) * | 2019-03-22 | 2019-07-23 | 湖南飞优特电子科技有限公司 | A kind of undesirable control device of LCD processing procedure PI dust stain |
| CN110473773B (en) * | 2019-08-22 | 2022-03-22 | 北京北方华创微电子装备有限公司 | Wafer cleaning method and wafer cleaning equipment |
| JP7265467B2 (en) * | 2019-12-17 | 2023-04-26 | 株式会社荏原製作所 | Resist removal system and resist removal method |
| JP7265466B2 (en) * | 2019-12-17 | 2023-04-26 | 株式会社荏原製作所 | Resist removal system and resist removal method |
| KR102303107B1 (en) * | 2020-03-31 | 2021-09-16 | 주식회사 디엠에스 | Apparatus for melting of carbon dioxide gas and apparatus for treating substrate comprising the same |
| KR20230043947A (en) * | 2020-10-23 | 2023-03-31 | 가부시키가이샤 사무코 | Cleaning method of piping of single-wafer type wafer cleaning equipment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6382601B1 (en) * | 1997-12-30 | 2002-05-07 | Hirofumi Ohnari | Swirling fine-bubble generator |
| JP3397154B2 (en) * | 1997-12-30 | 2003-04-14 | 博文 大成 | Revolving microbubble generator |
| JP2001269631A (en) * | 2000-03-27 | 2001-10-02 | Dainippon Screen Mfg Co Ltd | Substrate cleaning device |
| JP2004121962A (en) * | 2002-10-01 | 2004-04-22 | National Institute Of Advanced Industrial & Technology | Method and apparatus for using nanometer-bubble |
| JP2006147617A (en) * | 2004-11-16 | 2006-06-08 | Dainippon Screen Mfg Co Ltd | Substrate processor and particle removing method |
| JP2006179765A (en) * | 2004-12-24 | 2006-07-06 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and particle removing method |
| US7392814B2 (en) * | 2004-12-24 | 2008-07-01 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and method |
-
2007
- 2007-08-31 JP JP2007226126A patent/JP5252861B2/en active Active
-
2008
- 2008-01-11 TW TW97101146A patent/TWI415694B/en active
- 2008-01-11 CN CN2008800019551A patent/CN101578688B/en active Active
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