JP5250502B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5250502B2
JP5250502B2 JP2009181832A JP2009181832A JP5250502B2 JP 5250502 B2 JP5250502 B2 JP 5250502B2 JP 2009181832 A JP2009181832 A JP 2009181832A JP 2009181832 A JP2009181832 A JP 2009181832A JP 5250502 B2 JP5250502 B2 JP 5250502B2
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Japan
Prior art keywords
columnar member
conductive paste
pad
face
shield case
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Active
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JP2009181832A
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English (en)
Japanese (ja)
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JP2011035269A (ja
JP2011035269A5 (https=
Inventor
孝 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009181832A priority Critical patent/JP5250502B2/ja
Publication of JP2011035269A publication Critical patent/JP2011035269A/ja
Publication of JP2011035269A5 publication Critical patent/JP2011035269A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2009181832A 2009-08-04 2009-08-04 半導体装置及びその製造方法 Active JP5250502B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009181832A JP5250502B2 (ja) 2009-08-04 2009-08-04 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009181832A JP5250502B2 (ja) 2009-08-04 2009-08-04 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011035269A JP2011035269A (ja) 2011-02-17
JP2011035269A5 JP2011035269A5 (https=) 2012-08-16
JP5250502B2 true JP5250502B2 (ja) 2013-07-31

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ID=43764027

Family Applications (1)

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JP2009181832A Active JP5250502B2 (ja) 2009-08-04 2009-08-04 半導体装置及びその製造方法

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JP (1) JP5250502B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104185360B (zh) * 2014-08-18 2017-05-24 深圳市华星光电技术有限公司 一种印刷电路板及其设计方法
CN112309998B (zh) * 2019-07-30 2023-05-16 华为技术有限公司 封装器件及其制备方法、电子设备
JP2023103693A (ja) * 2022-01-14 2023-07-27 三菱電機株式会社 電子機器
WO2025121100A1 (ja) * 2023-12-04 2025-06-12 株式会社村田製作所 回路モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107055A (ja) * 1986-06-02 1988-05-12 Fujitsu Ltd 集積回路用パッケ−ジ
JP2920066B2 (ja) * 1994-05-19 1999-07-19 株式会社東芝 半導体装置及びその製造方法
JP2809212B2 (ja) * 1996-07-30 1998-10-08 日本電気株式会社 電子装置パッケ−ジ
JP3798620B2 (ja) * 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
JP4494175B2 (ja) * 2004-11-30 2010-06-30 新光電気工業株式会社 半導体装置
JP2007042977A (ja) * 2005-08-05 2007-02-15 Shinko Electric Ind Co Ltd 半導体装置
JP5215587B2 (ja) * 2007-04-27 2013-06-19 ラピスセミコンダクタ株式会社 半導体装置

Also Published As

Publication number Publication date
JP2011035269A (ja) 2011-02-17

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