JP5242830B1 - 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法 - Google Patents

半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法 Download PDF

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Publication number
JP5242830B1
JP5242830B1 JP2012153087A JP2012153087A JP5242830B1 JP 5242830 B1 JP5242830 B1 JP 5242830B1 JP 2012153087 A JP2012153087 A JP 2012153087A JP 2012153087 A JP2012153087 A JP 2012153087A JP 5242830 B1 JP5242830 B1 JP 5242830B1
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JP
Japan
Prior art keywords
semiconductor wafer
radiation
adhesive tape
sensitive adhesive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012153087A
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English (en)
Japanese (ja)
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JP2014017336A (ja
Inventor
雅人 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2012153087A priority Critical patent/JP5242830B1/ja
Priority to KR1020130078566A priority patent/KR101447378B1/ko
Priority to CN201310279317.9A priority patent/CN103525324B/zh
Priority to TW102124170A priority patent/TWI448531B/zh
Application granted granted Critical
Publication of JP5242830B1 publication Critical patent/JP5242830B1/ja
Publication of JP2014017336A publication Critical patent/JP2014017336A/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2012153087A 2012-07-06 2012-07-06 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法 Active JP5242830B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012153087A JP5242830B1 (ja) 2012-07-06 2012-07-06 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法
KR1020130078566A KR101447378B1 (ko) 2012-07-06 2013-07-04 반도체 웨이퍼 표면 보호용 점착 테이프 및 반도체 웨이퍼의 제조방법
CN201310279317.9A CN103525324B (zh) 2012-07-06 2013-07-04 半导体晶片表面保护用胶带及半导体晶片的制造方法
TW102124170A TWI448531B (zh) 2012-07-06 2013-07-05 半導體晶圓表面保護用黏著帶及半導體晶圓之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012153087A JP5242830B1 (ja) 2012-07-06 2012-07-06 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法

Publications (2)

Publication Number Publication Date
JP5242830B1 true JP5242830B1 (ja) 2013-07-24
JP2014017336A JP2014017336A (ja) 2014-01-30

Family

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Family Applications (1)

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JP2012153087A Active JP5242830B1 (ja) 2012-07-06 2012-07-06 半導体ウェハ表面保護用粘着テープおよび半導体ウェハの製造方法

Country Status (4)

Country Link
JP (1) JP5242830B1 (zh)
KR (1) KR101447378B1 (zh)
CN (1) CN103525324B (zh)
TW (1) TWI448531B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355341A4 (en) * 2015-11-04 2019-05-01 LINTEC Corporation HARDENABLE RESIN FOIL AND FIRST PROTECTIVE FOIL WRAP
JP2019161031A (ja) * 2018-03-14 2019-09-19 マクセルホールディングス株式会社 バックグラインド用粘着テープ
CN113355033A (zh) * 2020-03-06 2021-09-07 日东电工株式会社 压敏粘合带

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5718515B1 (ja) * 2014-01-23 2015-05-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法
JP2015179825A (ja) * 2014-02-26 2015-10-08 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープ
JP2015185691A (ja) * 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
JP6347657B2 (ja) * 2014-04-22 2018-06-27 デクセリアルズ株式会社 保護テープ、及びこれを用いた半導体装置の製造方法
CN108174616B (zh) * 2015-10-05 2022-03-29 琳得科株式会社 半导体加工用片
TWI605502B (zh) * 2015-10-30 2017-11-11 Furukawa Electric Co Ltd Semiconductor wafer surface protection adhesive tape and semiconductor wafer processing method
JP6230761B2 (ja) * 2015-11-04 2017-11-15 リンテック株式会社 第１保護膜形成用シート
JP6627792B2 (ja) 2016-02-04 2020-01-08 信越化学工業株式会社 表面保護フィルム、基板加工体、及び表面保護フィルムの製造方法
KR102630909B1 (ko) * 2018-08-08 2024-01-30 린텍 가부시키가이샤 단자 보호용 테이프 및 전자파 쉴드막을 가지는 반도체 장치의 제조 방법
JP7152233B2 (ja) * 2018-09-25 2022-10-12 日東電工株式会社 半導体保護用粘着テープ
JP6678795B1 (ja) 2019-04-08 2020-04-08 古河電気工業株式会社 電子部品用テープおよび電子部品の加工方法
JP6678796B1 (ja) 2019-04-08 2020-04-08 古河電気工業株式会社 電子部品用テープおよび電子部品の加工方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003173994A (ja) * 2001-09-27 2003-06-20 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及びそれを用いる半導体ウエハの保護方法
JP2008121017A (ja) * 2001-08-27 2008-05-29 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造法
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP2011132354A (ja) * 2009-12-24 2011-07-07 Hitachi Maxell Ltd 紫外線硬化型粘着フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3905356B2 (ja) 2001-11-12 2007-04-18 日東電工株式会社 半導体ウエハ加工用保護シートおよび該シートの使用方法
EP1591504B1 (en) * 2003-02-05 2012-05-23 The Furukawa Electric Co., Ltd. Pressure-sensitive adhesive tape for pasting wafer thereto
JP5057697B2 (ja) * 2006-05-12 2012-10-24 日東電工株式会社 半導体ウエハ又は半導体基板加工用粘着シート
JP2008060151A (ja) * 2006-08-29 2008-03-13 Nitto Denko Corp 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
JP4728380B2 (ja) * 2008-11-26 2011-07-20 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
JP2011174042A (ja) 2010-02-01 2011-09-08 Nitto Denko Corp 半導体装置製造用フィルム及び半導体装置の製造方法
WO2011125683A1 (ja) * 2010-03-31 2011-10-13 古河電気工業株式会社 半導体ウエハ加工用粘着シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008121017A (ja) * 2001-08-27 2008-05-29 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造法
JP2003173994A (ja) * 2001-09-27 2003-06-20 Mitsui Chemicals Inc 半導体ウエハ表面保護用粘着フィルム及びそれを用いる半導体ウエハの保護方法
JP2011054940A (ja) * 2009-08-07 2011-03-17 Nitto Denko Corp 半導体ウェハ保持保護用粘着シート及び半導体ウェハの裏面研削方法
JP2011132354A (ja) * 2009-12-24 2011-07-07 Hitachi Maxell Ltd 紫外線硬化型粘着フィルム

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3355341A4 (en) * 2015-11-04 2019-05-01 LINTEC Corporation HARDENABLE RESIN FOIL AND FIRST PROTECTIVE FOIL WRAP
KR102587310B1 (ko) 2015-11-04 2023-10-10 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
JP2019161031A (ja) * 2018-03-14 2019-09-19 マクセルホールディングス株式会社 バックグラインド用粘着テープ
JP7092526B2 (ja) 2018-03-14 2022-06-28 マクセル株式会社 バックグラインド用粘着テープ
CN113355033A (zh) * 2020-03-06 2021-09-07 日东电工株式会社 压敏粘合带
JP2021138863A (ja) * 2020-03-06 2021-09-16 日東電工株式会社 粘着テープ
JP7426260B2 (ja) 2020-03-06 2024-02-01 日東電工株式会社 粘着テープ

Also Published As

Publication number Publication date
TWI448531B (zh) 2014-08-11
KR20140005812A (ko) 2014-01-15
CN103525324A (zh) 2014-01-22
CN103525324B (zh) 2015-04-15
TW201402769A (zh) 2014-01-16
KR101447378B1 (ko) 2014-10-06
JP2014017336A (ja) 2014-01-30

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