JP2021138863A - 粘着テープ - Google Patents
粘着テープ Download PDFInfo
- Publication number
- JP2021138863A JP2021138863A JP2020038457A JP2020038457A JP2021138863A JP 2021138863 A JP2021138863 A JP 2021138863A JP 2020038457 A JP2020038457 A JP 2020038457A JP 2020038457 A JP2020038457 A JP 2020038457A JP 2021138863 A JP2021138863 A JP 2021138863A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- meth
- adhesive tape
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 70
- 239000010410 layer Substances 0.000 claims abstract description 129
- 239000003999 initiator Substances 0.000 claims abstract description 61
- 239000000853 adhesive Substances 0.000 claims abstract description 46
- 230000001070 adhesive effect Effects 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 100
- 239000000203 mixture Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000013464 silicone adhesive Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 16
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 66
- 239000000178 monomer Substances 0.000 description 57
- -1 polyethylene terephthalate Polymers 0.000 description 37
- 239000003431 cross linking reagent Substances 0.000 description 34
- 229920000642 polymer Polymers 0.000 description 27
- 235000012431 wafers Nutrition 0.000 description 26
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 17
- 239000011254 layer-forming composition Substances 0.000 description 17
- 229920000178 Acrylic resin Polymers 0.000 description 14
- 239000004925 Acrylic resin Substances 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000012948 isocyanate Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000058 polyacrylate Polymers 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 229920005601 base polymer Polymers 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- BMZZOWWYEBTMBX-UHFFFAOYSA-N 1-ethyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCN1C(=O)CC(=C)C1=O BMZZOWWYEBTMBX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- UXCIJKOCUAQMKD-UHFFFAOYSA-N 2,4-dichlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC(Cl)=C3SC2=C1 UXCIJKOCUAQMKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- TYMZWBMKPLVKSI-UHFFFAOYSA-N 2-[[ethoxy(phenyl)phosphoryl]methyl]-1,3,5-trimethylbenzene Chemical compound C=1C=CC=CC=1P(=O)(OCC)CC1=C(C)C=C(C)C=C1C TYMZWBMKPLVKSI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 description 1
- ZWVHTXAYIKBMEE-UHFFFAOYSA-N 2-hydroxyacetophenone Chemical compound OCC(=O)C1=CC=CC=C1 ZWVHTXAYIKBMEE-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHFGGWSXGDWGOY-UHFFFAOYSA-N 2-isocyanatoethyl 2-methylprop-2-enoate 5-isocyanato-2-methylpent-2-enoic acid Chemical compound N(=C=O)CCC=C(C(=O)O)C.C(C(=C)C)(=O)OCCN=C=O VHFGGWSXGDWGOY-UHFFFAOYSA-N 0.000 description 1
- YRNDGUSDBCARGC-UHFFFAOYSA-N 2-methoxyacetophenone Chemical compound COCC(=O)C1=CC=CC=C1 YRNDGUSDBCARGC-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- DOTJTDPXTXRURS-UHFFFAOYSA-N 3-[4-(hydroxymethyl)cyclohexyl]-2-methylprop-2-enoic acid Chemical compound OC(=O)C(C)=CC1CCC(CO)CC1 DOTJTDPXTXRURS-UHFFFAOYSA-N 0.000 description 1
- SCYHXIPBPUIIFY-UHFFFAOYSA-N 3-ethylidenepyrrolidine-2,5-dione Chemical compound CC=C1CC(=O)NC1=O SCYHXIPBPUIIFY-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
1つの実施形態においては、上記中間層を形成する組成物における光重合開始剤の含有量は0.1重量部〜10重量部である。
1つの実施形態においては、上記粘着剤層と上記中間層とが、光重合開始剤を等量含む。
1つの実施形態においては、上記基材は帯電防止機能を有する。
1つの実施形態においては、上記粘着剤層の紫外線照射後のシリコン粘着力とポリイミド粘着力との比は1.0以下である。
1つの実施形態においては、上記粘着剤層の厚みは1μm〜10μmである。
1つの実施形態においては、基材の厚みは10μm〜200μmである。
1つの実施形態においては、上記粘着テープは、半導体ウエハ加工工程に用いられる。
1つの実施形態においては、上記粘着テープは、バックグラインテープとして用いられる。
1つの実施形態においては、上記粘着テープは、凹凸を有する被着体に貼付して用いられる。
図1は、本発明の1つの実施形態による粘着テープの概略断面図である。図示例の粘着テープ100は、基材30と、中間層20と、粘着剤層10とを備える。粘着剤層10は、紫外線硬化型粘着剤および光重合開始剤を含む。中間層20は、光重合開始剤を含み、かつ、紫外線硬化性成分を含まない。そのため、中間層は紫外線を照射されても硬化することなく、柔軟性を維持し得る。また、中間層が光重合開始剤を含むことにより、粘着剤層に含まれる光重合開始剤が中間層に移動し、粘着剤層に含まれる光重合開始剤の含有量が経時的に低下することを防止し得る。そのため、粘着剤層が紫外線照射により適切に硬化し、所望の軽剥離性を発揮し得る。その結果、被着体への糊残り、および、薄型化されたウエハの破損を防止し得る。
基材は、任意の適切な樹脂から構成され得る。基材層を構成する樹脂の具体例としては、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)、ポリブチレンナフタレート(PBN)などのポリエステル系樹脂、エチレン−酢酸ビニル共重合体、エチレン−メタクリル酸メチル共重合体、ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体などのポリオレフィン系樹脂、ポリビニルアルコール、ポリ塩化ビニリデン、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリアミド、ポリイミド、セルロース類、フッ素系樹脂、ポリエーテル、ポリスチレンなどのポリスチレン系樹脂、ポリカーボネート、ポリエーテルスルホン等が挙げられる。好ましくは、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンテレフタレート、および、ポリブチレンナフタレートが用いられる。これらの樹脂を用いることにより、反りの発生がより防止され得る。
粘着剤層は任意の適切な粘着剤層形成組成物を用いて形成される。粘着剤層形成組成物(結果として形成される粘着剤層)は紫外線硬化型粘着剤および光重合開始剤を含む。紫外線硬化型粘着剤を含むことにより、紫外線照射前は被着体に対する優れた粘着力を、紫外線照射後には優れた剥離性を有する粘着テープを提供することができる。
紫外線硬化型粘着剤としては、任意の適切な粘着剤を用いることができる。例えば、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤、ポリビニルエーテル系粘着剤等の任意の適切な粘着剤に紫外線硬化性のモノマーおよび/またはオリゴマーを添加した粘着剤であってもよく、ベースポリマーとして重合性炭素−炭素二重結合を側鎖または末端に有するポリマーを用いた粘着剤であってもよい。好ましくは、ベースポリマーとして重合性炭素−炭素二重結合を側鎖または末端に有するポリマーを用いた粘着剤が用いられる。
光重合開始剤としては、任意の適切な開始剤を用いることができる。光重合開始剤としては、例えば、エチル2,4,6−トリメチルベンジルフェニルホスフィネート、(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキシド等のアシルホスフィンオキシド系光開始剤;4−(2−ヒドロキシエトキシ)フェニル(2−ヒドロキシ−2−プロピル)ケトン、α−ヒドロキシ−α,α’−ジメチルアセトフェノン、2−メチル−2−ヒドロキシプロピオフェノン、1−ヒドロキシシクロヘキシルフェニルケトン等のα−ケトール系化合物;メトキシアセトフェノン、2,2−ジメトキシ−2−フェニルアセトフェノン、2,2−ジエトキシアセトフェノン、2−メチル−1−[4−(メチルチオ)−フェニル]−2−モルホリノプロパン−1等のアセトフェノン系化合物;ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、アニソインメチルエーテル等のベンゾインエーテル系化合物;ベンジルジメチルケタール等のケタール系化合物;2−ナフタレンスルホニルクロリド等の芳香族スルホニルクロリド系化合物;1−フェノン−1,1−プロパンジオン−2−(o−エトキシカルボニル)オキシム等の光活性オキシム系化合物;ベンゾフェノン、ベンゾイル安息香酸、3,3’−ジメチル−4−メトキシベンゾフェノン等のベンゾフェノン系化合物;チオキサンソン、2−クロロチオキサンソン、2−メチルチオキサンソン、2,4−ジメチルチオキサンソン、イソプロピルチオキサンソン、2,4−ジクロロチオキサンソン、2,4−ジエチルチオキサンソン、2,4−ジイソプロピルチオキサンソン等のチオキサンソン系化合物;カンファーキノン;ハロゲン化ケトン;アシルホスフォナート、2−ヒドロキシ−1−(4−(4−(2−ヒドロキシ−2−メチルプロピオニル)ベンジル)フェニル−2−メチルプロパン−1等のα―ヒドロキシアセトフェノン等が挙げられる。好ましくは、2,2−ジメトキシ−2−フェニルアセトフェノン、2−ヒドロキシ−1−(4−(4−(2−ヒドロキシ−2−メチルプロピオニル)ベンジル)フェニル−2−メチルプロパン−1を用いることができる。光重合開始剤は1種のみを用いてもよく、2種以上を組み合わせて用いてもよい。
上記粘着剤層形成組成物は、必要に応じて、任意の適切な添加剤を含み得る。該添加剤としては、例えば、架橋剤、触媒(例えば、白金触媒)、粘着付与剤、可塑剤、顔料、染料、充填剤、老化防止剤、導電材、紫外線吸収剤、光安定剤、剥離調整剤、軟化剤、界面活性剤、難燃剤、溶剤等が挙げられる。
粘着剤層形成組成物を塗布厚みが5μmとなるようセパレータに塗布し、130℃で2分間乾燥した。次いで、塗布乾燥後の粘着剤層のみを端から丸めて棒状の試料を作製し、厚み(断面積)を計測した。得られた試料を、チャック間距離10mm、引張速度50mm/分、室温の条件で、引張試験機(SHIMADZU社製、商品名「AG−IS」)で引っ張った際の最初期の傾き(ヤング率)を弾性率とした。
中間層は光重合開始剤を含み、かつ、紫外線硬化性成分を含まない。すなわち、光重合開始剤を含むものの、中間層自体は紫外線照射により硬化しない。そのため、中間層は紫外線照射の前後で所望の柔軟性を維持し得る。また、中間層が光重合開始剤を含むことにより、粘着剤層に含まれる光重合開始剤が中間層に移動し、結果として粘着剤層に含まれる光重合開始剤の含有量が経時的に低下することを抑制し得る。そのため、紫外線照射後において、粘着テープが優れた軽剥離性を発揮し得る。本明細書において、紫外線硬化性成分とは、紫外線照射により架橋し、硬化収縮し得る成分をいう。具体的には、上記C項で例示した紫外線硬化性モノマーおよびオリゴマー、重合性炭素−炭素二重結合を側鎖または末端に有するポリマー等が挙げられる。
粘着テープは、任意の適切な方法により製造され得る。粘着テープは、例えば、基材上に、中間層を形成した後、該中間層上に粘着剤層を形成することにより作製され得る。粘着剤層および中間層は、上記粘着剤層を形成する組成物、および、上記中間層を形成する組成物を、基材または中間層に塗工して各層を形成してもよく、任意の適切なセパレーター上に各層を形成した後、転写してもよい。塗工方法としては、バーコーター塗工、エアナイフ塗工、グラビア塗工、グラビアリバース塗工、リバースロール塗工、リップ塗工、ダイ塗工、ディップ塗工、オフセット印刷、フレキソ印刷、スクリーン印刷など種々の方法を採用することができる。また、別途、セパレータに粘着剤層を形成した後、それを基材に貼り合せる方法等を採用してもよい。
本発明の粘着テープは、任意の適切な用途に用いることができる。上記の通り、本発明の粘着テープは、紫外線照射前は被着体に対する優れた粘着力を、紫外線照射後には優れた剥離性を有する。そのため、優れた粘着力、および、優れた剥離力が要求される用途に好適に用いることができる。
主モノマーとして、アクリル酸ブチル50重量部と、アクリル酸エチル50重量部を、官能基含有モノマーとして、80%アクリル酸20%トルエン溶液5重量部と、アクリル酸2−ヒドロキシエチル(東亜合成社製、商品名:アクリツクス(登録商標)HEA)0.1重量部と、トリメチロールプロパントリアクリレート(大阪有機化学工業社製、商品名:ビスコート#295)0.3重量部をそれぞれ用い、これらと重合開始剤(日本油脂社製、商品名:ナイパー(登録商標)BW)0.1重量部と、溶媒(トルエン)とを混合してモノマー組成物(固形分濃度:25%)を調製した。該モノマー組成物を、1L丸底セパラブルフラスコに、セパラブルカバー、分液ロート、温度計、窒素導入管、リービッヒ冷却器、バキュームシール、撹拌棒、撹拌羽が装備された重合用実験装置に投入し、撹拌しながら、常温で6時間、窒素置換した。その後、窒素を流入下、撹拌しながら、60℃下で8時間保持して重合し、樹脂溶液(中間層形成組成物用ポリマー溶液)を得た。
アクリル酸−2−エチルヘキシル100重量部と、アクリロイルモルフォリン酸25.5重量部と、アクリル酸−2−ヒドロキシルエチル(東亜合成社製、商品名:アクリツクス(登録商標)HEA)18.5重量部と、重合開始剤(日本油脂社製、商品名:ナイパー(登録商標)BW)0.275重量部と、溶媒(トルエン)とを混合してモノマー組成物(固形分濃度:32%)を調製した。該モノマー組成物を、1L丸底セパラブルフラスコに、セパラブルカバー、分液ロート、温度計、窒素導入管、リービッヒ冷却器、バキュームシール、撹拌棒、撹拌羽が装備された重合用実験装置に投入し、撹拌しながら、常温で6時間、窒素置換した。その後、窒素を流入下、撹拌しながら、60℃下で8時間保持して重合し、樹脂溶液を得た。
製造例2で得られた樹脂溶液の固形分144.262重量部に、重合性炭素−炭素二重結合を有する化合物として、2−イソシアネートエチルメタクリレート(昭和電工社製、商品名「カレンズMOI」)12.3重量部を加えた。さらに、ジラウリン酸ジブチルスズIV(和光純薬工業社製)0.0633重量部を添加し、適宜溶媒(トルエン)を添加し、固形分濃度が34%となるよう調整した。その後、空気雰囲気下、50℃で24時間撹拌し、ポリマー溶液(粘着剤層形成用ポリマー1)を得た。
製造例2で得られた樹脂溶液の固形分144.275重量部に、重合性炭素−炭素二重結合を有する化合物として、2−イソシアネートエチルメタクリレート(昭和電工社製、商品名「カレンズMOI」)22.5重量部を加えた。さらに、ジラウリン酸ジブチルスズIV(和光純薬工業社製)0.0633重量部を添加し、適宜溶媒(トルエン)を添加し、固形分濃度が34%となるよう調整した。その後、空気雰囲気下、50℃で24時間撹拌し、ポリマー溶液(粘着剤層形成用ポリマー2)を得た。
製造例1で得られた中間層形成組成物用ポリマー100重量部、ポリイソシアネート化合物(商品名「コロネートL」、東ソー株式会社製)1重量部、光重合開始剤(IGM Resins社製、商品名:Omnirad 651)3重量部、および、酢酸エチルを含む中間層形成用組成物(固形分濃度:23重量%)を調製した。次いで、得られた中間層形成用組成物を、厚み38μmのポリエステル系セパレータ(商品名「MRF」、三菱樹脂株式会社製)のシリコーン処理を施した面に塗布した後、120℃で120秒間加熱して脱溶媒し、厚み150μmの中間層を形成した。
次いで、厚み50μmの帯電防止性PETフィルムの帯電防止処理面に、セパレータ上に形成した中間層を貼り合わせた。
中間層形成組成物用ポリマーに代えて粘着剤形成用ポリマー1を用いたこと、および、光重合開始剤の添加量を5重量部とした以外は中間層形成組成物と同様にして、粘着剤層形成用組成物(固形分:15重量%)を調製した。得られた粘着剤層形成組成物を、厚み75μmのポリエステル系セパレータのシリコーン処理面に塗布した、120℃で120秒間加熱して脱溶媒し、厚み6μmの粘着剤層を形成した。
次いで、中間層からセパレータを剥離し、中間層に粘着剤層を貼り合わせて転写し、50℃にて72時間保存し、基材/中間層/粘着剤層をこの順に備える粘着テープを得た。
基材として厚み100μmの帯電防止処理されたPETフィルムを用いたこと、および、中間層の厚みを100μmに、粘着剤層の厚みを5μmにそれぞれ変更したこと以外は実施例1と同様にして、粘着テープを得た。
粘着剤層の厚みを5μmとした以外は実施例1と同様にして、粘着テープを得た。
中間層形成組成物に、エポキシ系架橋剤(三菱ガス化学社製、商品名「テトラッドC」)0.5重量部をさらに添加した以外は実施例3と同様にして、粘着テープを得た。
中間層の厚みを100μmとした以外は実施例3と同様にして、粘着テープを得た。
光重合開始剤として、IGM Resins社製、商品名:Omnirad 127Dを用いた以外は実施例1と同様にして、中間層形成用組成物を得た。得られた中間層形成用組成物を用いた以外は実施例1と同様にして、セパレータ上に中間層を形成した。
また、粘着剤層形成用ポリマー1に代えて粘着剤層形成用ポリマー2を用いたこと、および、光重合開始剤としてIGM Resins社製、商品名:Omnirad 127Dを用いた以外は実施例1と同様にして、粘着剤層形成用組成物を得た。
上記中間層および粘着剤層形成用組成物を用いた以外は実施例3と同様にして、粘着テープを得た。
基材として、帯電防止処理されていない厚み50μmのPETフィルム(東レ社製、商品名:ルミラーS105)を用いた以外は実施例6と同様にして、粘着テープを得た。
中間層形成組成物に光重合開始剤を添加しなかったこと以外は実施例6と同様にして、粘着テープを得た。
(1)粘着力
被着体としてSiミラーウエハ(信越化学製)、非感光性ポリイミドがコーティングされたウエハ(KSTワールド製)を用いて、シリコン粘着力(Si粘着力)、および、ポリイミド粘着力(PI粘着力)をそれぞれ測定した。粘着テープは20mm幅にカッターでカットしたものを用いた。ウエハへの貼り付けは、2kgローラーを一往復させることにより行った。測定は、引張試験機(テンシロン)(ミネベアミツミ社製、製品名:TG−1kN)を用いてJIS Z 0237(2000)に準じて行った。具体的には、引張速度300mm/分、室温、剥離角度180°でテープを剥離した。紫外線(UV)照射後のものについては、粘着テープを貼り付け、常温で30分間保管した後、UV照射(1000mJ/cm2)を高圧水銀灯(70mW/cm2、日東精機社製、製品名:UM−810)で約12秒間照射した後測定した。
また、Siミラーウエハに対する粘着力比(対Si)とポリイミドに対する粘着力比(対PI)を下記式から算出した。
粘着力比=(UV前の粘着力−UV後の粘着力)/UV前の粘着力×100
各実施例および比較例で用いた中間層形成用組成物を塗布厚みが5μmとなるようセパレータに塗布し、130℃で2分間乾燥した。次いで、塗布乾燥後の中間層のみを端から丸めて棒状の試料を作製し、厚み(断面積)を計測した。得られた試料を、チャック間距離10mm、引張速度50mm/分、室温の条件で、引張試験機(SHIMADZU社製、商品名「AG−IS」)で引っ張った際の最初期の傾き(ヤング率)を弾性率とした。なお、中間層については、UV照射(1000mJ/cm2)を高圧水銀灯(70mW/cm2、日東精機社製、製品名:UM−810)で照射した前後で弾性率を測定した。
(3)剥離性
貼付装置(日東精機社製、商品名:DR−3000III)を用いて、8インチSiミラーウエハ(厚み750μm)に貼付速度5mm/秒、貼付圧力0.5MPaの条件で、実施例または比較例で得られた粘着テープを貼りつけた。次いで、バックグラインド装置(DISCO社製、商品名:DFG8560)を用いて、仕上げ厚みがそれぞれ50μm、100μm、250μmとなるようSiミラーウエハを研削した。次いで、マウント装置(日東精機社製、商品名:MSA−840)を用いて、ダイシングテープ(日東電工社製、商品名:DU−2187G)に研削したSiミラーウエハをマウントした。粘着テープにUV照射(700mJ/cm2)を行った後、剥離テープ(日東電工社製、商品名:BT−315)を粘着テープに貼りつけ、剥離装置(日東精機社製、商品名:RM300−NV4)を用いて、テーブル温度20℃、バー温度30℃、ピールスタート−1mm、剥離速度10mm/秒の条件で粘着テープを剥離した。剥離後のSiミラーウエハの状態を目視で確認し、剥離性を評価した。
20 中間層
30 基材
100 粘着テープ
Claims (10)
- 紫外線硬化型粘着剤、および、光重合開始剤を含む粘着剤層と、光重合開始剤を含み、かつ、紫外線硬化性成分を含まない中間層と、基材と、を含む粘着テープ。
- 前記中間層を形成する組成物における光重合開始剤の含有量が0.1重量部〜10重量部である、請求項1に粘着テープ。
- 前記粘着剤層と、前記中間層とが、光重合開始剤を等量含む、請求項1または2に記載の粘着テープ。
- 前記基材が帯電防止機能を有する、請求項1から3のいずれかに記載の粘着テープ。
- 前記粘着剤層の紫外線照射後のシリコン粘着力とポリイミド粘着力との比が1.0以下である、請求項1から4のいずれかに記載の粘着テープ。
- 前記粘着剤層の厚みが1μm〜10μmである、請求項1から5のいずれかに記載の粘着テープ。
- 基材の厚みが10μm〜200μmである、請求項1から6のいずれかに記載の粘着テープ。
- 半導体ウエハ加工工程に用いられる、請求項1から7のいずれかに記載の粘着テープ。
- バックグラインテープとして用いられる、請求項8に記載の粘着テープ。
- 凹凸を有する被着体に貼付して用いられる、請求項8または9に記載の粘着テープ。
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