JP5233302B2 - 電子装置、共振子、及び電子装置の製造方法 - Google Patents

電子装置、共振子、及び電子装置の製造方法 Download PDF

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JP5233302B2
JP5233302B2 JP2008027304A JP2008027304A JP5233302B2 JP 5233302 B2 JP5233302 B2 JP 5233302B2 JP 2008027304 A JP2008027304 A JP 2008027304A JP 2008027304 A JP2008027304 A JP 2008027304A JP 5233302 B2 JP5233302 B2 JP 5233302B2
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layer
covering
substrate
cavity
functional structure
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JP2009188785A5 (enrdf_load_stackoverflow
JP2009188785A (ja
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正吾 稲葉
彰 佐藤
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2008027304A priority Critical patent/JP5233302B2/ja
Priority to US12/045,990 priority patent/US7994594B2/en
Publication of JP2009188785A publication Critical patent/JP2009188785A/ja
Priority to US13/168,561 priority patent/US8129804B2/en
Priority to US13/359,965 priority patent/US20120127683A1/en
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  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008027304A 2007-03-15 2008-02-07 電子装置、共振子、及び電子装置の製造方法 Active JP5233302B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008027304A JP5233302B2 (ja) 2008-02-07 2008-02-07 電子装置、共振子、及び電子装置の製造方法
US12/045,990 US7994594B2 (en) 2007-03-15 2008-03-11 Electronic device, resonator, oscillator and method for manufacturing electronic device
US13/168,561 US8129804B2 (en) 2007-03-15 2011-06-24 Electronic device, resonator, oscillator and method for manufacturing electronic device
US13/359,965 US20120127683A1 (en) 2007-03-15 2012-01-27 Electronic device, resonator, oscillator and method for manufacturing electronic device

Applications Claiming Priority (1)

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JP2008027304A JP5233302B2 (ja) 2008-02-07 2008-02-07 電子装置、共振子、及び電子装置の製造方法

Related Child Applications (1)

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JP2010092871A Division JP5408447B2 (ja) 2010-04-14 2010-04-14 電子装置

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JP2009188785A JP2009188785A (ja) 2009-08-20
JP2009188785A5 JP2009188785A5 (enrdf_load_stackoverflow) 2012-04-05
JP5233302B2 true JP5233302B2 (ja) 2013-07-10

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5240136B2 (ja) * 2009-09-09 2013-07-17 富士通株式会社 電子部品およびその製造方法
JP2011189423A (ja) 2010-03-12 2011-09-29 Seiko Epson Corp Ｍｅｍｓ素子および発振器
JP5192610B2 (ja) * 2010-03-18 2013-05-08 パナソニック株式会社 Ｍｅｍｓ素子、およびｍｅｍｓ素子の製造方法
JP2011218462A (ja) 2010-04-06 2011-11-04 Seiko Epson Corp Ｍｅｍｓ装置
JP2012096316A (ja) 2010-11-02 2012-05-24 Seiko Epson Corp 電子装置および電子装置の製造方法
JP5630243B2 (ja) * 2010-11-30 2014-11-26 セイコーエプソン株式会社 電子装置、電子機器及び電子装置の製造方法
JP2012195829A (ja) 2011-03-17 2012-10-11 Seiko Epson Corp 発振回路
JP2012222718A (ja) 2011-04-13 2012-11-12 Seiko Epson Corp 発振器
JP5720485B2 (ja) * 2011-08-12 2015-05-20 オムロン株式会社 電子部品
JP6060569B2 (ja) * 2012-09-07 2017-01-18 セイコーエプソン株式会社 電子装置の製造方法
JP2014212410A (ja) * 2013-04-18 2014-11-13 セイコーエプソン株式会社 振動子、発振器、電子機器、移動体、および振動子の製造方法
JP6269113B2 (ja) * 2014-02-03 2018-01-31 セイコーエプソン株式会社 Ｍｅｍｓ素子及びその製造方法
JP6314568B2 (ja) * 2014-03-18 2018-04-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
TWI754586B (zh) * 2021-05-04 2022-02-01 矽品精密工業股份有限公司 電子封裝件及其製法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602791B2 (en) * 2001-04-27 2003-08-05 Dalsa Semiconductor Inc. Manufacture of integrated fluidic devices
JP4544880B2 (ja) * 2003-09-25 2010-09-15 京セラ株式会社 微小電気機械式装置の封止方法
JP2006202918A (ja) * 2005-01-19 2006-08-03 Sony Corp 機能素子パッケージ体及びその製造方法
JP4724488B2 (ja) * 2005-02-25 2011-07-13 日立オートモティブシステムズ株式会社 集積化マイクロエレクトロメカニカルシステム
JP2007125626A (ja) * 2005-11-01 2007-05-24 Toshiba Corp Ｍｅｍｓ素子
JP2007210083A (ja) * 2006-02-13 2007-08-23 Hitachi Ltd Ｍｅｍｓ素子及びその製造方法
JP2007216308A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 電子装置及びその製造方法
JP2008016919A (ja) * 2006-07-03 2008-01-24 Matsushita Electric Ind Co Ltd 音響感応装置

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