JP5231471B2 - ベースワイヤの製造方法 - Google Patents
ベースワイヤの製造方法 Download PDFInfo
- Publication number
- JP5231471B2 JP5231471B2 JP2010038016A JP2010038016A JP5231471B2 JP 5231471 B2 JP5231471 B2 JP 5231471B2 JP 2010038016 A JP2010038016 A JP 2010038016A JP 2010038016 A JP2010038016 A JP 2010038016A JP 5231471 B2 JP5231471 B2 JP 5231471B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- plating layer
- organic film
- base
- base wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000007747 plating Methods 0.000 claims description 70
- 229910000831 Steel Inorganic materials 0.000 claims description 28
- 239000010959 steel Substances 0.000 claims description 28
- 238000005491 wire drawing Methods 0.000 claims description 26
- 238000005238 degreasing Methods 0.000 claims description 20
- 239000006061 abrasive grain Substances 0.000 claims description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000007921 spray Substances 0.000 claims 1
- 239000003921 oil Substances 0.000 description 34
- 239000000314 lubricant Substances 0.000 description 21
- 239000002966 varnish Substances 0.000 description 18
- 239000010949 copper Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 6
- 229910000677 High-carbon steel Inorganic materials 0.000 description 5
- 239000004962 Polyamide-imide Substances 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920002312 polyamide-imide Polymers 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- YQCIWBXEVYWRCW-UHFFFAOYSA-N methane;sulfane Chemical compound C.S YQCIWBXEVYWRCW-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000011002 quantification Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- 239000004972 Polyurethane varnish Substances 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- ZJUWXBLGLGUFMC-UHFFFAOYSA-N copper;ethyl carbamate Chemical compound [Cu].CCOC(N)=O ZJUWXBLGLGUFMC-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 formal Polymers 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002137 ultrasound extraction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Ropes Or Cables (AREA)
Description
ポリウレタンワニス(「TPU F1」、「TPU F2−NC」、「TPU F2−NCA」、「TPU 6200」、「TPU 5100」、「TPU 5200」、「TPU 5700」、「TPU K5 132」、「TPU 3000K」、「TPU 3000EA」など;東特塗料株式会社製の商品。)
ポリエステルワニス(「LITON 2100S」、「LITON 2100P」、「LITON 3100F」、「LITON 3200BF」、「LITON 3300」、「LITON 3300KF」、「LITON 3500SLD」、「Neoheat 8200K2」など;東特塗料株式会社製の商品。)
ポリアミドイミドワニス(「Neoheat AI−00C」など;東特塗料株式会社製の商品。)
ポリエステルイミドワニス(「Neoheat 8600A」、「Neoheat 8600AY」、「Neoheat 8600」、「Neaheat 8600H3」、「Neoheat 8625」、「Neoheat 8600E2」など;東特塗料株式会社製の商品。)
JIS G3502に規定されるピアノ線(A線、C:0.82質量%、Si:0.19質量%、Mn:0.49質量%を含有し、残部は鉄および不可避不純物。)の圧延線材(直径:5.5mm)を用意し、これを熱処理(550℃で鉛パテンティング処理(LP))した後、直径0.88mmに一次伸線した。一次伸線後、更に熱処理(550℃で鉛パテンティング処理(LP))してから下記表1に示すメッキ層を形成した後、直径0.132mmに二次伸線し、次いで脱脂してベースワイヤを製造した。
捻回値(100D換算)=捻れ回数×(試験片の直径/チャック間距離)×100
《評価基準》
○(合格) :捻回値が25回以上
△(合格) :捻回値が20回以上、25回未満
×(不合格):捻回値が20回未満
上記実験例1において、直径0.88mmに一次伸線した後、更に熱処理(550℃で鉛パテンティング処理(LP))してからCuメッキ層を形成した後、直径0.132mmに二次伸線し、次いで脱脂してベースワイヤを製造した。
上記実験例1において、直径0.88mmに一次伸線した後、更に熱処理(550℃で鉛パテンティング処理(LP))してからCuメッキ層を形成した後、直径0.132mmに二次伸線し、次いで脱脂してベースワイヤを製造した。
Claims (6)
- 表面に有機皮膜を有する被覆ソーワイヤ用のベースワイヤを製造する方法であって、
前記ベースワイヤは、鋼線の表面にメッキ層を有しており、前記メッキ層の厚みが0.1〜0.5μmであるか、および/または、前記メッキ層表面の算術平均粗さRaが0.2μm以下であって、
前記ベースワイヤは、圧延線材を熱処理してから一次伸線し、次いで熱処理した後、メッキを施してから、1〜30m/秒の伸線速度で二次伸線し、脱脂して得ることを特徴とする有機皮膜の耐剥離性に優れたベースワイヤの製造方法。 - 前記メッキ層が、Cuおよび/またはZnを含有する請求項1に記載のベースワイヤの製造方法。
- 前記メッキ層表面に付着している油がベースワイヤ1gあたり70μg以下である請求項1または2に記載のベースワイヤの製造方法。
- 前記メッキ層表面に付着している表面付着物の炭素成分がベースワイヤ1mあたり15μg以下である請求項1〜3のいずれかに記載のベースワイヤの製造方法。
- 請求項1〜4のいずれかに記載の製造方法によって得られるベースワイヤの表面に、有機皮膜を被覆したことを特徴とする被覆ソーワイヤ。
- 請求項5に記載の被覆ソーワイヤに砥粒を吹き付け、ワークを前記被覆ソーワイヤで切断する切断体の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010038016A JP5231471B2 (ja) | 2010-02-23 | 2010-02-23 | ベースワイヤの製造方法 |
CN201180010400.5A CN102770237B (zh) | 2010-02-23 | 2011-02-21 | 被覆锯丝用的基底丝 |
KR1020127021958A KR101403228B1 (ko) | 2010-02-23 | 2011-02-21 | 피복 소우 와이어용의 베이스 와이어 |
PCT/JP2011/053748 WO2011105339A1 (ja) | 2010-02-23 | 2011-02-21 | 被覆ソーワイヤ用のベースワイヤ |
TW100105985A TWI453299B (zh) | 2010-02-23 | 2011-02-23 | Base wire for covered wire saws |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010038016A JP5231471B2 (ja) | 2010-02-23 | 2010-02-23 | ベースワイヤの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011173194A JP2011173194A (ja) | 2011-09-08 |
JP5231471B2 true JP5231471B2 (ja) | 2013-07-10 |
Family
ID=44506747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010038016A Expired - Fee Related JP5231471B2 (ja) | 2010-02-23 | 2010-02-23 | ベースワイヤの製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5231471B2 (ja) |
KR (1) | KR101403228B1 (ja) |
CN (1) | CN102770237B (ja) |
TW (1) | TWI453299B (ja) |
WO (1) | WO2011105339A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201343977A (zh) * | 2012-04-27 | 2013-11-01 | Ritedia Corp | 含有電鍍層之複合線鋸及其製作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62279015A (ja) * | 1986-05-27 | 1987-12-03 | Daido Steel Co Ltd | 線材の伸線加工方法 |
JPH10156584A (ja) * | 1996-11-25 | 1998-06-16 | Nippon Steel Weld Prod & Eng Co Ltd | 溶接用フラックス入りワイヤの製造方法 |
JP3475271B2 (ja) * | 2000-02-16 | 2003-12-08 | 金井 宏彰 | ワイヤソー用ワイヤ |
JP3604351B2 (ja) * | 2001-05-01 | 2004-12-22 | 株式会社ノリタケスーパーアブレーシブ | レジンボンドワイヤソー |
JP2003291056A (ja) * | 2002-04-01 | 2003-10-14 | Sumitomo Mitsubishi Silicon Corp | 被切断物のワイヤ切断方法および切断用のワイヤならびに該ワイヤの製造方法 |
US6915796B2 (en) * | 2002-09-24 | 2005-07-12 | Chien-Min Sung | Superabrasive wire saw and associated methods of manufacture |
JP4299604B2 (ja) * | 2003-07-14 | 2009-07-22 | 株式会社神戸製鋼所 | 線引き装置 |
JP3959385B2 (ja) * | 2003-08-26 | 2007-08-15 | 株式会社神戸製鋼所 | 溶接用ソリッドワイヤの製造方法 |
JP4111928B2 (ja) * | 2004-03-24 | 2008-07-02 | 株式会社ノリタケスーパーアブレーシブ | レジンボンドワイヤソーおよびその製造方法 |
JP2006179677A (ja) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | ソーワイヤ |
DE602005014019D1 (de) * | 2005-12-27 | 2009-05-28 | Japan Fine Steel Co Ltd | Fester schleifdraht |
-
2010
- 2010-02-23 JP JP2010038016A patent/JP5231471B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-21 KR KR1020127021958A patent/KR101403228B1/ko active IP Right Grant
- 2011-02-21 CN CN201180010400.5A patent/CN102770237B/zh not_active Expired - Fee Related
- 2011-02-21 WO PCT/JP2011/053748 patent/WO2011105339A1/ja active Application Filing
- 2011-02-23 TW TW100105985A patent/TWI453299B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN102770237A (zh) | 2012-11-07 |
CN102770237B (zh) | 2015-10-07 |
KR20120120339A (ko) | 2012-11-01 |
KR101403228B1 (ko) | 2014-06-02 |
JP2011173194A (ja) | 2011-09-08 |
WO2011105339A1 (ja) | 2011-09-01 |
TW201202477A (en) | 2012-01-16 |
TWI453299B (zh) | 2014-09-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113166908B (zh) | 镀铝钢板、热冲压部件及热冲压部件的制造方法 | |
US20150197834A1 (en) | Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES | |
KR101464870B1 (ko) | 접속 부품용 도전 재료 | |
JP7221882B2 (ja) | コーティングを備えた鋼部品の製造方法および鋼部品 | |
TW201508098A (zh) | 熱壓印成形體及熱壓印成形體之製造方法 | |
WO2013150855A1 (ja) | 鋳造用部材及びその製造方法、ダイカスト用スリーブ、並びにダイカスト装置 | |
CN112739836A (zh) | 电气电子设备用的Pd合金、Pd合金材料、探针和制造方法 | |
CN110382727A (zh) | 切削加工用线材 | |
JP5231471B2 (ja) | ベースワイヤの製造方法 | |
WO2015173843A1 (ja) | 溶融めっき金属浴用部材 | |
CN110114510A (zh) | 热压用镀覆钢板、热压用镀覆钢板的制造方法、热压成形品的制造方法及车辆的制造方法 | |
KR101700551B1 (ko) | 연질 금속에 대한 내응착성을 갖는 경질 피막 | |
KR102451451B1 (ko) | 와이어 방전 가공용 전극선 | |
JP2005054260A (ja) | スチールコード用極細鋼線の製造方法及びスチールコード | |
JP5658651B2 (ja) | 耐スポーリング性に優れた亜鉛めっき鋼板用圧延ロール用鋼材、及び亜鉛めっき鋼板用圧延ロール | |
JP5522604B2 (ja) | ワイヤー工具 | |
JP2015151615A (ja) | 熱処理用鋼板およびその製造方法 | |
JP5316425B2 (ja) | 表面被覆処理用合金及び摺動部材 | |
JP6119495B2 (ja) | ソーワイヤ及びコアワイヤ | |
JP5099978B2 (ja) | 高強度細線及びその製造方法 | |
JP5225646B2 (ja) | 摺動部材及びその製造方法 | |
EP3100812A1 (en) | Electric discharge machining electrode wire and manufacturing method therefor | |
JP4116383B2 (ja) | 弁ばね用またはばね用のオイルテンパー線とその製造方法 | |
JP3219916B2 (ja) | アーク溶接用メッキソリッドワイヤ | |
JP2023508956A (ja) | 鉄金属製部品の処理方法及び鉄金属製部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110606 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120131 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120522 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120822 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20121016 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130225 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130312 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130321 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160329 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5231471 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |