TWI453299B - Base wire for covered wire saws - Google Patents
Base wire for covered wire saws Download PDFInfo
- Publication number
- TWI453299B TWI453299B TW100105985A TW100105985A TWI453299B TW I453299 B TWI453299 B TW I453299B TW 100105985 A TW100105985 A TW 100105985A TW 100105985 A TW100105985 A TW 100105985A TW I453299 B TWI453299 B TW I453299B
- Authority
- TW
- Taiwan
- Prior art keywords
- steel wire
- wire
- plating layer
- base steel
- organic film
- Prior art date
Links
- 229910000831 Steel Inorganic materials 0.000 claims description 163
- 239000010959 steel Substances 0.000 claims description 163
- 238000007747 plating Methods 0.000 claims description 83
- 239000006061 abrasive grain Substances 0.000 claims description 17
- 229910052799 carbon Inorganic materials 0.000 claims description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005886 esterification reaction Methods 0.000 claims 1
- 239000000314 lubricant Substances 0.000 description 23
- 238000005238 degreasing Methods 0.000 description 18
- 239000002966 varnish Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000010949 copper Substances 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 7
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 229910000677 High-carbon steel Inorganic materials 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- YQCIWBXEVYWRCW-UHFFFAOYSA-N methane;sulfane Chemical compound C.S YQCIWBXEVYWRCW-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- 229910017752 Cu-Zn Inorganic materials 0.000 description 2
- 229910017943 Cu—Zn Inorganic materials 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 2
- YYCULGQEKARBDA-UHFFFAOYSA-N copper;formaldehyde Chemical compound [Cu].O=C YYCULGQEKARBDA-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- -1 for example Inorganic materials 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910018100 Ni-Sn Inorganic materials 0.000 description 1
- 229910018532 Ni—Sn Inorganic materials 0.000 description 1
- 239000004972 Polyurethane varnish Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910001566 austenite Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- WXANAQMHYPHTGY-UHFFFAOYSA-N cerium;ethyne Chemical compound [Ce].[C-]#[C] WXANAQMHYPHTGY-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- ZJUWXBLGLGUFMC-UHFFFAOYSA-N copper;ethyl carbamate Chemical compound [Cu].CCOC(N)=O ZJUWXBLGLGUFMC-UHFFFAOYSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Ropes Or Cables (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038016A JP5231471B2 (ja) | 2010-02-23 | 2010-02-23 | ベースワイヤの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201202477A TW201202477A (en) | 2012-01-16 |
| TWI453299B true TWI453299B (zh) | 2014-09-21 |
Family
ID=44506747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100105985A TWI453299B (zh) | 2010-02-23 | 2011-02-23 | Base wire for covered wire saws |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5231471B2 (ja) |
| KR (1) | KR101403228B1 (ja) |
| CN (1) | CN102770237B (ja) |
| TW (1) | TWI453299B (ja) |
| WO (1) | WO2011105339A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201343977A (zh) * | 2012-04-27 | 2013-11-01 | Ritedia Corp | 含有電鍍層之複合線鋸及其製作方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10156584A (ja) * | 1996-11-25 | 1998-06-16 | Nippon Steel Weld Prod & Eng Co Ltd | 溶接用フラックス入りワイヤの製造方法 |
| JP2001225255A (ja) * | 2000-02-16 | 2001-08-21 | Kanai Hiroaki | ワイヤソー用ワイヤ |
| JP2003291056A (ja) * | 2002-04-01 | 2003-10-14 | Sumitomo Mitsubishi Silicon Corp | 被切断物のワイヤ切断方法および切断用のワイヤならびに該ワイヤの製造方法 |
| JP2005095972A (ja) * | 2003-08-26 | 2005-04-14 | Kobe Steel Ltd | 溶接用ソリッドワイヤの製造方法 |
| JP2006179677A (ja) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | ソーワイヤ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62279015A (ja) * | 1986-05-27 | 1987-12-03 | Daido Steel Co Ltd | 線材の伸線加工方法 |
| JP3604351B2 (ja) * | 2001-05-01 | 2004-12-22 | 株式会社ノリタケスーパーアブレーシブ | レジンボンドワイヤソー |
| US6915796B2 (en) * | 2002-09-24 | 2005-07-12 | Chien-Min Sung | Superabrasive wire saw and associated methods of manufacture |
| JP4299604B2 (ja) * | 2003-07-14 | 2009-07-22 | 株式会社神戸製鋼所 | 線引き装置 |
| JP4111928B2 (ja) * | 2004-03-24 | 2008-07-02 | 株式会社ノリタケスーパーアブレーシブ | レジンボンドワイヤソーおよびその製造方法 |
| DE602005014019D1 (de) * | 2005-12-27 | 2009-05-28 | Japan Fine Steel Co Ltd | Fester schleifdraht |
-
2010
- 2010-02-23 JP JP2010038016A patent/JP5231471B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-21 CN CN201180010400.5A patent/CN102770237B/zh not_active Expired - Fee Related
- 2011-02-21 KR KR1020127021958A patent/KR101403228B1/ko active IP Right Grant
- 2011-02-21 WO PCT/JP2011/053748 patent/WO2011105339A1/ja active Application Filing
- 2011-02-23 TW TW100105985A patent/TWI453299B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10156584A (ja) * | 1996-11-25 | 1998-06-16 | Nippon Steel Weld Prod & Eng Co Ltd | 溶接用フラックス入りワイヤの製造方法 |
| JP2001225255A (ja) * | 2000-02-16 | 2001-08-21 | Kanai Hiroaki | ワイヤソー用ワイヤ |
| JP2003291056A (ja) * | 2002-04-01 | 2003-10-14 | Sumitomo Mitsubishi Silicon Corp | 被切断物のワイヤ切断方法および切断用のワイヤならびに該ワイヤの製造方法 |
| JP2005095972A (ja) * | 2003-08-26 | 2005-04-14 | Kobe Steel Ltd | 溶接用ソリッドワイヤの製造方法 |
| JP2006179677A (ja) * | 2004-12-22 | 2006-07-06 | Japan Fine Steel Co Ltd | ソーワイヤ |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120120339A (ko) | 2012-11-01 |
| CN102770237B (zh) | 2015-10-07 |
| JP5231471B2 (ja) | 2013-07-10 |
| WO2011105339A1 (ja) | 2011-09-01 |
| CN102770237A (zh) | 2012-11-07 |
| KR101403228B1 (ko) | 2014-06-02 |
| JP2011173194A (ja) | 2011-09-08 |
| TW201202477A (en) | 2012-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101848100B1 (ko) | 스테인리스 강 제품을 생산하는 방법 | |
| KR100675565B1 (ko) | 도금밀착성이 우수한 합금화용융아연도금강판 및 그제조방법 | |
| EP3251777B1 (en) | Scale-style micro-texture electrode wire material and preparation method therefor and use thereof | |
| JP6487474B2 (ja) | 油を塗ったＺｎ−Ａｌ−Ｍｇコーティングを有する金属シートを製造する方法および対応する金属シート | |
| JP2014042983A (ja) | 被覆ソーワイヤ | |
| AU2004280412B2 (en) | Martensitic stainless steel pipe and method for production thereof | |
| EP3564409A1 (en) | Plated steel sheet for hot pressing, method for manufacturing plated steel sheet for hot pressing, method for manufacturing hot-press-formed article, and method for manufacturing vehicle | |
| JP6691452B2 (ja) | ばね用鋼線 | |
| TWI453299B (zh) | Base wire for covered wire saws | |
| KR101700551B1 (ko) | 연질 금속에 대한 내응착성을 갖는 경질 피막 | |
| JP6490102B2 (ja) | 時計ネジおよびその製造方法 | |
| KR0142648B1 (ko) | 베어본딩용 동합금 리드프레임 | |
| TWI660052B (zh) | Titanium plate | |
| JP4116383B2 (ja) | 弁ばね用またはばね用のオイルテンパー線とその製造方法 | |
| JPH07188894A (ja) | オイルテンパー線及びその製造方法 | |
| US20140079957A1 (en) | Process for tin coating a metallic substrate, process for hardening a tin layer and wire having a tin coating | |
| JP2008019491A (ja) | 均一皮膜を有するステンレス鋼板およびその製造方法 | |
| JP2018119193A (ja) | ゴム製品補強用鋼線、ゴム製品補強用スチールコード及びゴム製品補強用鋼線の製造方法 | |
| JPWO2019193655A1 (ja) | チタン板 | |
| JP2018119192A (ja) | ゴム製品補強用鋼線、ゴム製品補強用スチールコード及びゴム製品補強用鋼線の製造方法 | |
| JP2002069565A (ja) | 耐遅れ破壊性に優れた高強度鋼及びその製造方法 | |
| CN108779822B (zh) | 弹簧用钢丝 | |
| JP2014141716A (ja) | メカニカルデスケーリング性に優れた鋼線材、および鋼線の製造方法 | |
| JP2018119243A (ja) | スチールコード及びゴム−スチールコード複合体 | |
| JP2010065248A (ja) | メッキ部材およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |