JP5227514B2 - 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 - Google Patents

熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 Download PDF

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JP5227514B2
JP5227514B2 JP2006511766A JP2006511766A JP5227514B2 JP 5227514 B2 JP5227514 B2 JP 5227514B2 JP 2006511766 A JP2006511766 A JP 2006511766A JP 2006511766 A JP2006511766 A JP 2006511766A JP 5227514 B2 JP5227514 B2 JP 5227514B2
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thermosetting resin
resin composition
mol
group
general formula
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JPWO2005095517A1 (ja
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聖夫 有馬
亮 林
弘進 中居
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
JP2006511766A 2004-03-30 2005-03-30 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板 Expired - Lifetime JP5227514B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006511766A JP5227514B2 (ja) 2004-03-30 2005-03-30 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004100866 2004-03-30
JP2004100866 2004-03-30
PCT/JP2005/006164 WO2005095517A1 (ja) 2004-03-30 2005-03-30 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板
JP2006511766A JP5227514B2 (ja) 2004-03-30 2005-03-30 熱硬化性樹脂組成物、及びそれを用いた多層プリント配線板

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JPWO2005095517A1 JPWO2005095517A1 (ja) 2008-02-21
JP5227514B2 true JP5227514B2 (ja) 2013-07-03

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US (1) US7825198B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP5227514B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100790660B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN1938380B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW200602427A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2005095517A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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JP5109258B2 (ja) * 2006-01-18 2012-12-26 住友ベークライト株式会社 半導体装置
JP5326188B2 (ja) * 2006-04-04 2013-10-30 Ｄｉｃ株式会社 樹脂組成物、フェノキシ樹脂、塗料組成物、接着剤組成物、接着フィルム、プリプレグ、多層プリント配線基板及び樹脂付銅箔
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KR101973685B1 (ko) * 2012-12-12 2019-08-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR102012311B1 (ko) 2012-12-12 2019-08-20 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR102034228B1 (ko) 2012-12-14 2019-10-18 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
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JP6620457B2 (ja) * 2015-08-11 2019-12-18 味の素株式会社 樹脂組成物
CN105199320A (zh) * 2015-09-24 2015-12-30 苏州宽温电子科技有限公司 一种高耐热环氧树脂基材料及其制备方法
JP6935402B2 (ja) * 2016-08-05 2021-09-15 日本化薬株式会社 マレイミド樹脂組成物、プリプレグ、その硬化物及び半導体装置
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JP7098881B2 (ja) * 2017-03-31 2022-07-12 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6999459B2 (ja) * 2018-03-22 2022-01-18 太陽インキ製造株式会社 ドライフィルム、硬化物、および、電子部品
TW202142585A (zh) * 2020-03-19 2021-11-16 日商日鐵化學材料股份有限公司 苯氧基樹脂、樹脂組成物、硬化物、電氣電子電路用積層板、及苯氧基樹脂的製造方法
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JPH0954434A (ja) * 1995-06-06 1997-02-25 Taiyo Ink Mfg Ltd アルカリ現像型の光硬化性・熱硬化性樹脂組成物
JP2001181375A (ja) * 1999-10-13 2001-07-03 Ajinomoto Co Inc エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP2002309200A (ja) * 2001-04-17 2002-10-23 Ajinomoto Co Inc 接着フィルム
JP2003127313A (ja) * 2001-10-22 2003-05-08 Ajinomoto Co Inc 接着フィルム及びプリプレグ

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CN1938380B (zh) 2012-01-25
US7825198B2 (en) 2010-11-02
TWI367918B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2012-07-11
TW200602427A (en) 2006-01-16
US20070015872A1 (en) 2007-01-18
WO2005095517A1 (ja) 2005-10-13
CN1938380A (zh) 2007-03-28

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