JP5226695B2 - サファイア基板及びその製造方法 - Google Patents
サファイア基板及びその製造方法 Download PDFInfo
- Publication number
- JP5226695B2 JP5226695B2 JP2009544222A JP2009544222A JP5226695B2 JP 5226695 B2 JP5226695 B2 JP 5226695B2 JP 2009544222 A JP2009544222 A JP 2009544222A JP 2009544222 A JP2009544222 A JP 2009544222A JP 5226695 B2 JP5226695 B2 JP 5226695B2
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- Prior art keywords
- plane
- less
- abrasive
- sapphire
- sapphire substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/20—Aluminium oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Description
Claims (10)
- 第1表面がc面配向を有するように研磨材を用いてそれぞれのサファイア基板の表面を研削加工することを含む、複数のサファイア基板を含むサファイア基板ロットを提供する方法であって、
該研削加工が、第1の固定研磨材を用いてサファイア基板の表面を研削加工すること、及び第2の固定研磨材を用いて該サファイア基板の該表面を研削加工することを含み、
該第2の固定研磨材が該第1の固定研磨材よりも微細であり、該第2の固定研磨材が該第1の固定研磨材よりも小さい平均粒径を有し、該第1及び該第2の固定研磨材が自生発刃性であり、
該サファイア基板ロットが少なくとも20個のサファイア基板を含み、それぞれのサファイア基板が(i)c面配向、(ii)結晶のm面に垂直な正規直交ベクトル(θ M )と前記サファイア基板の前記第1表面によって画定される面上へのθ M の投影として規定されるm面投影(M)との間の角度として規定される結晶のm面ミスオリエンテーション角度、及び(iii)結晶のa面に垂直な正規直交ベクトル(θ A )と前記サファイア基板の前記第1表面によって画定される面上へのθ A の投影として規定されるa面投影(A)との間の角度として規定される結晶のa面ミスオリエンテーション角度を有する第1表面を有し、
(a)前記ロットの全基板についての前記結晶のm面ミスオリエンテーション角度の標準偏差σmが0.0130度以下、及び(b)前記ロットの全基板についての前記結晶のa面ミスオリエンテーション角度の標準偏差σaが0.0325度以下のうち少なくとも1つが成り立つ、
サファイア基板ロットの提供方法。 - σmが0.0110度以下である、請求項1に記載の方法。
- σmが0.0080度以下である、請求項2に記載の方法。
- σaが0.0310度以下である、請求項1に記載の方法。
- 該微細研磨材を用いて該サファイア基板の該表面を研削加工した後に、該基板材料の該表面を研磨加工することをさらに含む、請求項1に記載の方法。
- 該基板の該第1表面を研磨加工することが、研磨材スラリーを用いて該表面を研磨加工することを含む、請求項5に記載の方法。
- 請求項1に記載の方法により提供された少なくとも20個のサファイア基板を含むサファイア基板ロットであって、
それぞれのサファイア基板は(i)c面配向、(ii)結晶のm面に垂直な正規直交ベクトル(θ M )と前記サファイア基板の前記第1表面によって画定される面上へのθ M の投影として規定されるm面投影(M)との間の角度として規定される結晶のm面ミスオリエンテーション角度、及び(iii)結晶のa面に垂直な正規直交ベクトル(θ A )と前記サファイア基板の前記第1表面によって画定される面上へのθ A の投影として規定されるa面投影(A)との間の角度として規定される結晶のa面ミスオリエンテーション角度を有する第1表面を有し、
(a)前記ロットの全基板についての前記結晶のm面ミスオリエンテーション角度の標準偏差σmが0.0130度以下、及び(b)前記ロットの全基板についての前記結晶のa面ミスオリエンテーション角度の標準偏差σaが0.0325度以下のうち少なくとも1つが成り立つ、
サファイア基板ロット。 - σmが0.0110度以下である、請求項7に記載のサファイア基板ロット。
- σmが0.0080度以下である、請求項8に記載のサファイア基板ロット。
- σaが0.0310度以下である、請求項7に記載のサファイア基板ロット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88234806P | 2006-12-28 | 2006-12-28 | |
US60/882,348 | 2006-12-28 | ||
PCT/US2007/088576 WO2008083081A2 (en) | 2006-12-28 | 2007-12-21 | Sapphire substrates and methods of making same |
Related Child Applications (1)
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JP2013052556A Division JP5513647B2 (ja) | 2006-12-28 | 2013-03-14 | サファイア基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2010515270A JP2010515270A (ja) | 2010-05-06 |
JP5226695B2 true JP5226695B2 (ja) | 2013-07-03 |
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JP2009544222A Expired - Fee Related JP5226695B2 (ja) | 2006-12-28 | 2007-12-21 | サファイア基板及びその製造方法 |
JP2013052556A Expired - Fee Related JP5513647B2 (ja) | 2006-12-28 | 2013-03-14 | サファイア基板及びその製造方法 |
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JP2013052556A Expired - Fee Related JP5513647B2 (ja) | 2006-12-28 | 2013-03-14 | サファイア基板及びその製造方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8455879B2 (ja) |
EP (1) | EP2094439A2 (ja) |
JP (2) | JP5226695B2 (ja) |
KR (2) | KR101230941B1 (ja) |
CN (1) | CN101616772B (ja) |
CA (1) | CA2673662C (ja) |
RU (1) | RU2412037C1 (ja) |
TW (1) | TWI350784B (ja) |
UA (1) | UA98314C2 (ja) |
WO (1) | WO2008083081A2 (ja) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8740670B2 (en) | 2006-12-28 | 2014-06-03 | Saint-Gobain Ceramics & Plastics, Inc. | Sapphire substrates and methods of making same |
EP2121242B1 (en) | 2006-12-28 | 2012-02-15 | Saint-Gobain Ceramics & Plastics, Inc. | Method of grinding a sapphire substrate |
UA98314C2 (ru) * | 2006-12-28 | 2012-05-10 | Сейнт-Гобейн Серамикс Энд Пластик, Инк. | Сапфирные подложки и процессы их изготовления |
JP2010103424A (ja) * | 2008-10-27 | 2010-05-06 | Showa Denko Kk | 半導体発光素子の製造方法 |
KR101139481B1 (ko) * | 2010-03-25 | 2012-04-30 | 주식회사 크리스탈온 | 인조 단결정 강옥 잉곳 절단 방법 |
US9064836B1 (en) * | 2010-08-09 | 2015-06-23 | Sandisk Semiconductor (Shanghai) Co., Ltd. | Extrinsic gettering on semiconductor devices |
US8708781B2 (en) * | 2010-12-05 | 2014-04-29 | Ethicon, Inc. | Systems and methods for grinding refractory metals and refractory metal alloys |
US20150044447A1 (en) * | 2012-02-13 | 2015-02-12 | Silicon Genesis Corporation | Cleaving thin layer from bulk material and apparatus including cleaved thin layer |
US10052848B2 (en) | 2012-03-06 | 2018-08-21 | Apple Inc. | Sapphire laminates |
US9950404B1 (en) * | 2012-03-29 | 2018-04-24 | Alta Devices, Inc. | High throughput polishing system for workpieces |
JP2013219215A (ja) * | 2012-04-10 | 2013-10-24 | Disco Abrasive Syst Ltd | サファイアウエーハの加工方法 |
US9221289B2 (en) | 2012-07-27 | 2015-12-29 | Apple Inc. | Sapphire window |
US9232672B2 (en) | 2013-01-10 | 2016-01-05 | Apple Inc. | Ceramic insert control mechanism |
TWI529265B (zh) | 2013-03-15 | 2016-04-11 | 聖高拜陶器塑膠公司 | 以斜角熱遮板製造藍寶石薄片之裝置及方法 |
US9632537B2 (en) | 2013-09-23 | 2017-04-25 | Apple Inc. | Electronic component embedded in ceramic material |
US9678540B2 (en) | 2013-09-23 | 2017-06-13 | Apple Inc. | Electronic component embedded in ceramic material |
US9154678B2 (en) | 2013-12-11 | 2015-10-06 | Apple Inc. | Cover glass arrangement for an electronic device |
US9728415B2 (en) | 2013-12-19 | 2017-08-08 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of wafer thinning involving edge trimming and CMP |
EP3090530A4 (en) * | 2013-12-31 | 2017-10-25 | Saint-Gobain Ceramics & Plastics, Inc. | Article comprising a transparent body including a layer of a ceramic material and a method of forming the same |
US9225056B2 (en) | 2014-02-12 | 2015-12-29 | Apple Inc. | Antenna on sapphire structure |
CN104502175A (zh) * | 2014-12-23 | 2015-04-08 | 信阳同合车轮有限公司 | 车轮钢化学成分试样的分析方法 |
US10406634B2 (en) | 2015-07-01 | 2019-09-10 | Apple Inc. | Enhancing strength in laser cutting of ceramic components |
RU2635132C1 (ru) * | 2017-02-20 | 2017-11-09 | Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") | Полировальная суспензия для сапфировых подложек |
JP6483913B1 (ja) * | 2017-05-26 | 2019-03-13 | 創光科学株式会社 | テンプレートの製造方法 |
CN109719614A (zh) * | 2017-10-31 | 2019-05-07 | 上海新昇半导体科技有限公司 | 一种抛光设备 |
TWI744539B (zh) * | 2018-07-12 | 2021-11-01 | 日商信越化學工業股份有限公司 | 半導體用基板及其製造方法 |
JP7103305B2 (ja) * | 2019-05-29 | 2022-07-20 | 信越半導体株式会社 | インゴットの切断方法 |
CN110744732B (zh) * | 2019-09-03 | 2022-04-15 | 福建晶安光电有限公司 | 一种高性能衬底的制作工艺 |
CN113021180A (zh) * | 2021-03-12 | 2021-06-25 | 长江存储科技有限责任公司 | 一种研磨轮、研磨设备 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56152562A (en) * | 1980-04-24 | 1981-11-26 | Fujitsu Ltd | Grinder |
JPS5795899A (en) | 1980-12-09 | 1982-06-14 | Toshiba Ceramics Co Ltd | Correcting method for deformed sapphire single crystal sheet |
JPS6296400A (ja) | 1985-10-23 | 1987-05-02 | Mitsubishi Metal Corp | ウエハの製造方法 |
JP2509265B2 (ja) | 1987-12-22 | 1996-06-19 | 三菱マテリアル株式会社 | ウェ―ハの製造方法及びその装置 |
JPH05235312A (ja) * | 1992-02-19 | 1993-09-10 | Fujitsu Ltd | 半導体基板及びその製造方法 |
JPH10166259A (ja) | 1996-12-12 | 1998-06-23 | Okamoto Kosaku Kikai Seisakusho:Kk | サファイア基板研削研磨方法および装置 |
JP4264992B2 (ja) * | 1997-05-28 | 2009-05-20 | ソニー株式会社 | 半導体装置の製造方法 |
JPH1174562A (ja) * | 1997-06-30 | 1999-03-16 | Nichia Chem Ind Ltd | 窒化物半導体素子 |
US6102789A (en) * | 1998-03-27 | 2000-08-15 | Norton Company | Abrasive tools |
US6019668A (en) * | 1998-03-27 | 2000-02-01 | Norton Company | Method for grinding precision components |
JP4337132B2 (ja) * | 1998-09-16 | 2009-09-30 | 日亜化学工業株式会社 | 窒化物半導体基板及びそれを用いた窒化物半導体素子 |
TW421091U (en) | 1999-03-18 | 2001-02-01 | Tsung Tsing Tshih | Diamond saw machine structure |
US6394888B1 (en) * | 1999-05-28 | 2002-05-28 | Saint-Gobain Abrasive Technology Company | Abrasive tools for grinding electronic components |
US6685539B1 (en) * | 1999-08-24 | 2004-02-03 | Ricoh Company, Ltd. | Processing tool, method of producing tool, processing method and processing apparatus |
US6495463B2 (en) * | 1999-09-28 | 2002-12-17 | Strasbaugh | Method for chemical mechanical polishing |
US6346036B1 (en) * | 1999-10-28 | 2002-02-12 | Strasbaugh | Multi-pad apparatus for chemical mechanical planarization |
JP4691631B2 (ja) * | 1999-11-29 | 2011-06-01 | 並木精密宝石株式会社 | サファイヤ基板 |
US20020052169A1 (en) * | 2000-03-17 | 2002-05-02 | Krishna Vepa | Systems and methods to significantly reduce the grinding marks in surface grinding of semiconductor wafers |
JP4396793B2 (ja) * | 2000-04-27 | 2010-01-13 | ソニー株式会社 | 基板の製造方法 |
KR100790062B1 (ko) * | 2000-05-09 | 2007-12-31 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 세라믹 연마 복합재를 가진 다공성 연마 제품 |
JP2002052448A (ja) * | 2000-08-07 | 2002-02-19 | Dowa Mining Co Ltd | 半導体ウェハおよびその加工方法 |
EP1261020A4 (en) | 2000-10-26 | 2005-01-19 | Shinetsu Handotai Kk | PROCESS FOR PRODUCING PLATELETS, POLISHING APPARATUS AND PLATELET |
JP4651207B2 (ja) * | 2001-02-26 | 2011-03-16 | 京セラ株式会社 | 半導体用基板とその製造方法 |
JP4522013B2 (ja) * | 2001-03-29 | 2010-08-11 | 京セラ株式会社 | 単結晶サファイア基板の熱処理方法 |
JP4290358B2 (ja) * | 2001-10-12 | 2009-07-01 | 住友電気工業株式会社 | 半導体発光素子の製造方法 |
US6685755B2 (en) * | 2001-11-21 | 2004-02-03 | Saint-Gobain Abrasives Technology Company | Porous abrasive tool and method for making the same |
JP2003165798A (ja) | 2001-11-28 | 2003-06-10 | Hitachi Cable Ltd | 窒化ガリウム単結晶基板の製造方法、窒化ガリウム単結晶のエピタキシャル成長自立基板、及びその上に形成したデバイス素子 |
JP2003165042A (ja) | 2001-11-29 | 2003-06-10 | Okamoto Machine Tool Works Ltd | 基板用乾式研磨装置および基板の乾式研磨方法 |
JP2003236735A (ja) | 2002-02-20 | 2003-08-26 | Sumitomo Electric Ind Ltd | ウエハ研削方法 |
JP3613345B2 (ja) | 2002-09-11 | 2005-01-26 | 株式会社Neomax | 研磨装置および研磨装置用キャリア |
US6921719B2 (en) * | 2002-10-31 | 2005-07-26 | Strasbaugh, A California Corporation | Method of preparing whole semiconductor wafer for analysis |
JP2004165564A (ja) | 2002-11-15 | 2004-06-10 | Showa Denko Kk | 窒化ガリウム結晶基板の製造方法と窒化ガリウム結晶基板及びそれを備えた窒化ガリウム系半導体素子 |
US6869894B2 (en) * | 2002-12-20 | 2005-03-22 | General Chemical Corporation | Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing |
JP4278996B2 (ja) * | 2003-01-29 | 2009-06-17 | 並木精密宝石株式会社 | ステップバンチ単結晶サファイヤ傾斜基板及びその製造方法 |
JP4630970B2 (ja) * | 2003-04-17 | 2011-02-09 | 並木精密宝石株式会社 | サファイヤ基板及びその製造方法 |
US7306748B2 (en) | 2003-04-25 | 2007-12-11 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining ceramics |
KR100550491B1 (ko) * | 2003-05-06 | 2006-02-09 | 스미토모덴키고교가부시키가이샤 | 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법 |
US7115480B2 (en) * | 2003-05-07 | 2006-10-03 | Micron Technology, Inc. | Micromechanical strained semiconductor by wafer bonding |
JP4345357B2 (ja) * | 2003-05-27 | 2009-10-14 | 株式会社Sumco | 半導体ウェーハの製造方法 |
US7439158B2 (en) * | 2003-07-21 | 2008-10-21 | Micron Technology, Inc. | Strained semiconductor by full wafer bonding |
JP4334321B2 (ja) | 2003-11-05 | 2009-09-30 | シャープ株式会社 | 窒化物半導体発光ダイオードチップの作製方法 |
DE102004010377A1 (de) * | 2004-03-03 | 2005-09-22 | Schott Ag | Herstellung von Substratwafern für defektarme Halbleiterbauteile, ihre Verwendung, sowie damit erhaltene Bauteile |
JP2005255463A (ja) | 2004-03-11 | 2005-09-22 | Sumitomo Metal Mining Co Ltd | サファイア基板とその製造方法 |
JP3888374B2 (ja) * | 2004-03-17 | 2007-02-28 | 住友電気工業株式会社 | GaN単結晶基板の製造方法 |
JP4583060B2 (ja) | 2004-03-26 | 2010-11-17 | 京セラ株式会社 | 単結晶サファイア基板の製造方法および窒化物半導体発光素子の製造方法 |
US7393790B2 (en) * | 2004-09-10 | 2008-07-01 | Cree, Inc. | Method of manufacturing carrier wafer and resulting carrier wafer structures |
CA2579150C (en) * | 2004-09-17 | 2014-11-25 | Pacific Biosciences Of California, Inc. | Apparatus and method for analysis of molecules |
UA7397U (en) | 2004-12-10 | 2005-06-15 | V M Bakul Inst Of Superhard Ma | Method of finish treatment of plates of mono-corundum (sapphire) |
US7255747B2 (en) * | 2004-12-22 | 2007-08-14 | Sokudo Co., Ltd. | Coat/develop module with independent stations |
JP4646638B2 (ja) * | 2005-01-14 | 2011-03-09 | 株式会社リコー | 表面研磨加工法及び加工装置 |
JP4664693B2 (ja) * | 2005-01-24 | 2011-04-06 | 株式会社ディスコ | ウエーハの研削方法 |
TWI342613B (en) | 2005-02-14 | 2011-05-21 | Showa Denko Kk | Nitride semiconductor light-emitting device and method for fabrication thereof |
JP2006224201A (ja) * | 2005-02-15 | 2006-08-31 | Disco Abrasive Syst Ltd | 研削ホイール |
JP4820108B2 (ja) | 2005-04-25 | 2011-11-24 | コマツNtc株式会社 | 半導体ウエーハの製造方法およびワークのスライス方法ならびにそれらに用いられるワイヤソー |
DE102005021099A1 (de) * | 2005-05-06 | 2006-12-07 | Universität Ulm | GaN-Schichten |
US7459380B2 (en) * | 2006-05-05 | 2008-12-02 | Applied Materials, Inc. | Dislocation-specific dielectric mask deposition and lateral epitaxial overgrowth to reduce dislocation density of nitride films |
EP2082081B1 (en) * | 2006-09-22 | 2015-05-06 | Saint-Gobain Ceramics and Plastics, Inc. | C-plane sapphire method |
EP2121242B1 (en) | 2006-12-28 | 2012-02-15 | Saint-Gobain Ceramics & Plastics, Inc. | Method of grinding a sapphire substrate |
TWI372796B (en) | 2006-12-28 | 2012-09-21 | Saint Gobain Ceramics | Sapphire substrates and methods of making same |
UA98314C2 (ru) * | 2006-12-28 | 2012-05-10 | Сейнт-Гобейн Серамикс Энд Пластик, Инк. | Сапфирные подложки и процессы их изготовления |
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2007
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- 2007-12-21 CN CN2007800486291A patent/CN101616772B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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WO2008083081A3 (en) | 2008-11-06 |
WO2008083081A2 (en) | 2008-07-10 |
KR101230941B1 (ko) | 2013-02-07 |
US20080164458A1 (en) | 2008-07-10 |
TWI350784B (en) | 2011-10-21 |
TW200848204A (en) | 2008-12-16 |
CN101616772A (zh) | 2009-12-30 |
CA2673662C (en) | 2012-07-24 |
US8455879B2 (en) | 2013-06-04 |
KR20090094300A (ko) | 2009-09-04 |
CN101616772B (zh) | 2012-03-21 |
KR20110124355A (ko) | 2011-11-16 |
JP2010515270A (ja) | 2010-05-06 |
EP2094439A2 (en) | 2009-09-02 |
CA2673662A1 (en) | 2008-07-10 |
UA98314C2 (ru) | 2012-05-10 |
RU2412037C1 (ru) | 2011-02-20 |
JP5513647B2 (ja) | 2014-06-04 |
JP2013128147A (ja) | 2013-06-27 |
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