JP5219331B2 - 固体素子デバイスの製造方法 - Google Patents

固体素子デバイスの製造方法 Download PDF

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Publication number
JP5219331B2
JP5219331B2 JP2005264896A JP2005264896A JP5219331B2 JP 5219331 B2 JP5219331 B2 JP 5219331B2 JP 2005264896 A JP2005264896 A JP 2005264896A JP 2005264896 A JP2005264896 A JP 2005264896A JP 5219331 B2 JP5219331 B2 JP 5219331B2
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JP
Japan
Prior art keywords
glass
sealing
solid
light
solid element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005264896A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007080994A5 (https=
JP2007080994A (ja
Inventor
成人 沢登
正明 大塚
和哉 相田
紘子 坂路
洋己 渡部
誠治 山口
好伸 末広
浩二 田角
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Sumita Optical Glass Inc
Original Assignee
Toyoda Gosei Co Ltd
Sumita Optical Glass Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd, Sumita Optical Glass Inc filed Critical Toyoda Gosei Co Ltd
Priority to JP2005264896A priority Critical patent/JP5219331B2/ja
Priority to US11/517,588 priority patent/US7825575B2/en
Publication of JP2007080994A publication Critical patent/JP2007080994A/ja
Publication of JP2007080994A5 publication Critical patent/JP2007080994A5/ja
Application granted granted Critical
Publication of JP5219331B2 publication Critical patent/JP5219331B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005264896A 2005-09-13 2005-09-13 固体素子デバイスの製造方法 Expired - Fee Related JP5219331B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法
US11/517,588 US7825575B2 (en) 2005-09-13 2006-09-08 Solid-state element device and light-emitting apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005264896A JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2007080994A JP2007080994A (ja) 2007-03-29
JP2007080994A5 JP2007080994A5 (https=) 2008-03-21
JP5219331B2 true JP5219331B2 (ja) 2013-06-26

Family

ID=37883661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005264896A Expired - Fee Related JP5219331B2 (ja) 2005-09-13 2005-09-13 固体素子デバイスの製造方法

Country Status (2)

Country Link
US (1) US7825575B2 (https=)
JP (1) JP5219331B2 (https=)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI321857B (en) * 2006-07-21 2010-03-11 Epistar Corp A light emitting device
JP5104490B2 (ja) * 2007-04-16 2012-12-19 豊田合成株式会社 発光装置及びその製造方法
US7781779B2 (en) * 2007-05-08 2010-08-24 Luminus Devices, Inc. Light emitting devices including wavelength converting material
WO2009031684A1 (ja) * 2007-09-07 2009-03-12 Asahi Glass Company, Limited ガラス被覆発光素子及びガラス被覆発光装置
DE102008005345A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Halbleiterbasiertes Bauelement, Aufnahme für ein halbleiterbasiertes Bauelement und Verfahren zur Herstellung eines halbleiterbasierten Bauelements
JP4796031B2 (ja) * 2007-09-28 2011-10-19 パナソニック株式会社 車両前照灯光源および車両前照灯
US8946987B2 (en) * 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
JPWO2009066430A1 (ja) * 2007-11-19 2011-03-31 パナソニック株式会社 半導体発光装置および半導体発光装置の製造方法
JP5302533B2 (ja) * 2007-11-30 2013-10-02 パナソニック株式会社 発光装置
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP2010129615A (ja) * 2008-11-25 2010-06-10 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP5146356B2 (ja) * 2009-02-24 2013-02-20 豊田合成株式会社 発光装置及びその製造方法
US20120177866A1 (en) * 2009-09-23 2012-07-12 Ocean's King Lighting Science & Technology Co,.Ltd Luminescent glass, producing method thereof and luminescent device
CN102574368A (zh) * 2009-09-25 2012-07-11 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
JP5738299B2 (ja) * 2009-09-25 2015-06-24 ▲海▼洋王照明科技股▲ふん▼有限公司 発光ガラスの製造方法
US20120175661A1 (en) * 2009-09-25 2012-07-12 Mingjie Zhou Semiconductor light emitting package and method of manufacturing the same
WO2011035475A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
WO2011035477A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
WO2011035479A1 (zh) * 2009-09-25 2011-03-31 海洋王照明科技股份有限公司 发光玻璃、其制造方法及发光装置
JP5738298B2 (ja) * 2009-09-25 2015-06-24 ▲海▼洋王照明科技股▲ふん▼有限公司 発光ガラス及びその製造方法、並びに発光装置
US8545083B2 (en) 2009-12-22 2013-10-01 Sumita Optical Glass, Inc. Light-emitting device, light source and method of manufacturing the same
JP5330306B2 (ja) * 2010-03-30 2013-10-30 豊田合成株式会社 発光装置
KR20110087579A (ko) * 2010-01-26 2011-08-03 삼성엘이디 주식회사 Ｌｅｄ 모듈과 이를 구비하는 백라이트 유닛
JP5287747B2 (ja) * 2010-01-29 2013-09-11 豊田合成株式会社 線状光源装置
JP2011187587A (ja) * 2010-03-05 2011-09-22 Seiko Instruments Inc 発光デバイス
JP5786278B2 (ja) * 2010-04-07 2015-09-30 日亜化学工業株式会社 発光装置
US8723409B2 (en) 2010-04-07 2014-05-13 Nichia Corporation Light emitting device
KR20140009987A (ko) * 2010-10-28 2014-01-23 코닝 인코포레이티드 Led 광 제품용 유리 프릿 물질을 포함하는 형광체
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
JP5661552B2 (ja) * 2010-12-24 2015-01-28 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
KR101766299B1 (ko) * 2011-01-20 2017-08-08 삼성전자 주식회사 발광소자 패키지 및 그 제조 방법
US8754440B2 (en) * 2011-03-22 2014-06-17 Tsmc Solid State Lighting Ltd. Light-emitting diode (LED) package systems and methods of making the same
JP2012212733A (ja) 2011-03-30 2012-11-01 Toyoda Gosei Co Ltd 発光装置
JP5703997B2 (ja) * 2011-06-29 2015-04-22 豊田合成株式会社 発光装置
TW201312807A (zh) 2011-07-21 2013-03-16 克里股份有限公司 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) * 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
EP2831009B1 (en) 2012-03-30 2017-05-03 Corning Incorporated Bismuth borate glass encapsulant for led phosphors
WO2013168037A1 (en) * 2012-05-08 2013-11-14 Koninklijke Philips N.V. Remote phosphor and led package
JP2013258209A (ja) * 2012-06-11 2013-12-26 Nitto Denko Corp 封止シート、発光ダイオード装置およびその製造方法
JP6205894B2 (ja) * 2012-07-04 2017-10-04 日亜化学工業株式会社 発光装置用パッケージ成形体およびそれを用いた発光装置
TW201415681A (zh) * 2012-10-08 2014-04-16 Lextar Electronics Corp 壓模式發光裝置及其製造方法
KR101977278B1 (ko) * 2012-10-29 2019-09-10 엘지이노텍 주식회사 발광 소자
US10017849B2 (en) 2012-11-29 2018-07-10 Corning Incorporated High rate deposition systems and processes for forming hermetic barrier layers
US9202996B2 (en) * 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
CN103050606A (zh) * 2013-01-11 2013-04-17 华南师范大学 一种高显色指数大功率led封装结构及其制造方法
EP2973699A1 (en) * 2013-03-14 2016-01-20 Corning Incorporated Led lighting devices
CN106195924B (zh) * 2013-06-08 2019-05-03 深圳光峰科技股份有限公司 一种波长转换装置及其制作方法、相关发光装置
EP3030626A2 (en) 2013-08-05 2016-06-15 Corning Incorporated Luminescent coatings and devices
JP6152801B2 (ja) * 2014-01-21 2017-06-28 豊田合成株式会社 発光装置及びその製造方法
WO2015138495A1 (en) * 2014-03-11 2015-09-17 Osram Sylvania Inc. Light converter assemblies with enhanced heat dissipation
DE102015107593A1 (de) * 2015-05-13 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Leuchtmittel
KR102641716B1 (ko) * 2015-08-03 2024-02-29 루미리즈 홀딩 비.브이. 반사성 측면 코팅을 가지는 반도체 발광 디바이스
DE102016114474A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Bauteil mit einem lichtemittierenden Bauelement
KR20180083011A (ko) * 2017-01-11 2018-07-20 삼성디스플레이 주식회사 광원 유닛, 이를 포함하는 표시 장치 및 표시 장치의 제조 방법
JP7035338B2 (ja) * 2017-05-22 2022-03-15 日本電気硝子株式会社 接合体の製造方法
EP3905347B1 (en) 2018-12-27 2024-02-21 Denka Company Limited Light-emitting substrate, and lighting device
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
CN113228316B (zh) 2018-12-27 2025-01-10 电化株式会社 荧光体基板、发光基板以及照明装置
EP3905348B1 (en) 2018-12-27 2024-01-24 Denka Company Limited Light-emitting substrate, and lighting device
US11367812B2 (en) * 2019-06-05 2022-06-21 Ferro Corporation Layered phosphor in glass
CN115135923A (zh) * 2019-12-25 2022-09-30 电化株式会社 灯具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2681861A (en) * 1950-12-12 1954-06-22 Westinghouse Electric Corp Glass for embedding zinc sulfide phosphors
JP3769872B2 (ja) * 1997-05-06 2006-04-26 ソニー株式会社 半導体発光素子
JP3536693B2 (ja) * 1998-11-24 2004-06-14 セイコーエプソン株式会社 半導体記憶装置及びその製造方法
JP2003051622A (ja) * 2001-08-07 2003-02-21 Rohm Co Ltd 白色系半導体発光装置
TW518771B (en) * 2001-09-13 2003-01-21 United Epitaxy Co Ltd LED and the manufacturing method thereof
TW558775B (en) * 2002-06-27 2003-10-21 Solidlite Corp Package of compound type LED
CN1802533B (zh) * 2003-05-05 2010-11-24 吉尔科有限公司 基于led的灯泡
JP4259198B2 (ja) * 2003-06-18 2009-04-30 豊田合成株式会社 発光装置用波長変換部の製造方法及び発光装置の製造方法
CN100511732C (zh) * 2003-06-18 2009-07-08 丰田合成株式会社 发光器件
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP2005223222A (ja) * 2004-02-06 2005-08-18 Toyoda Gosei Co Ltd 固体素子パッケージ
JP4363217B2 (ja) * 2004-02-19 2009-11-11 日亜化学工業株式会社 アルカリ土類金属ホウ酸塩蛍光体及びそれを用いた発光装置

Also Published As

Publication number Publication date
US20070064131A1 (en) 2007-03-22
JP2007080994A (ja) 2007-03-29
US7825575B2 (en) 2010-11-02

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