JP5217069B2 - 感光性セラミックス組成物及びセラミックス基板 - Google Patents
感光性セラミックス組成物及びセラミックス基板 Download PDFInfo
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- JP5217069B2 JP5217069B2 JP2001252542A JP2001252542A JP5217069B2 JP 5217069 B2 JP5217069 B2 JP 5217069B2 JP 2001252542 A JP2001252542 A JP 2001252542A JP 2001252542 A JP2001252542 A JP 2001252542A JP 5217069 B2 JP5217069 B2 JP 5217069B2
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| WO2011125546A1 (ja) | 2010-03-31 | 2011-10-13 | 京セラ株式会社 | インターポーザー及びそれを用いた電子装置 |
| JP5618651B2 (ja) * | 2010-06-30 | 2014-11-05 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、反射防止膜、光学デバイス、及び、固体撮像素子 |
| JP5622564B2 (ja) * | 2010-06-30 | 2014-11-12 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子 |
| JP5662450B2 (ja) * | 2010-07-30 | 2015-01-28 | 京セラ株式会社 | 絶縁シート、その製造方法及びその絶縁シートを用いた構造体の製造方法 |
| JP5647910B2 (ja) * | 2011-01-31 | 2015-01-07 | 富士フイルム株式会社 | 感光性組成物、パターン形成材料、並びに、これを用いた感光性膜、パターン形成方法、パターン膜、低屈折率膜、光学デバイス、及び、固体撮像素子 |
| WO2024185060A1 (ja) * | 2023-03-08 | 2024-09-12 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法 |
| WO2025115581A1 (ja) * | 2023-11-28 | 2025-06-05 | Ａｇｃ株式会社 | セラミックス基板及びセラミックスグリーンシート |
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| JP3275326B2 (ja) * | 1990-04-24 | 2002-04-15 | 株式会社日立製作所 | 多層セラミック焼結体の製造方法 |
| JP3128910B2 (ja) * | 1991-12-26 | 2001-01-29 | 東レ株式会社 | セラミックス・グリ−ンシ−ト |
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