JP5216473B2 - ケミカルメカニカルポリッシングのための相互侵入ネットワーク - Google Patents

ケミカルメカニカルポリッシングのための相互侵入ネットワーク Download PDF

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Publication number
JP5216473B2
JP5216473B2 JP2008209139A JP2008209139A JP5216473B2 JP 5216473 B2 JP5216473 B2 JP 5216473B2 JP 2008209139 A JP2008209139 A JP 2008209139A JP 2008209139 A JP2008209139 A JP 2008209139A JP 5216473 B2 JP5216473 B2 JP 5216473B2
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Japan
Prior art keywords
polishing
transient phase
chemical mechanical
continuous
pad
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JP2008209139A
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English (en)
Japanese (ja)
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JP2009056585A (ja
JP2009056585A5 (https=
Inventor
グレゴリー・ピー・ムルダウニー
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DuPont Electronic Materials Holding Inc
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DuPont Electronic Materials Holding Inc
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Publication of JP2009056585A publication Critical patent/JP2009056585A/ja
Publication of JP2009056585A5 publication Critical patent/JP2009056585A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008209139A 2007-08-15 2008-08-15 ケミカルメカニカルポリッシングのための相互侵入ネットワーク Active JP5216473B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/839,376 US7635290B2 (en) 2007-08-15 2007-08-15 Interpenetrating network for chemical mechanical polishing
US11/839,376 2007-08-15

Publications (3)

Publication Number Publication Date
JP2009056585A JP2009056585A (ja) 2009-03-19
JP2009056585A5 JP2009056585A5 (https=) 2011-09-29
JP5216473B2 true JP5216473B2 (ja) 2013-06-19

Family

ID=40029278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008209139A Active JP5216473B2 (ja) 2007-08-15 2008-08-15 ケミカルメカニカルポリッシングのための相互侵入ネットワーク

Country Status (7)

Country Link
US (2) US7635290B2 (https=)
EP (1) EP2025458B1 (https=)
JP (1) JP5216473B2 (https=)
KR (1) KR101507611B1 (https=)
CN (2) CN102554767B (https=)
SG (1) SG150466A1 (https=)
TW (1) TWI438835B (https=)

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US8740668B2 (en) 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8647171B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
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US10309018B2 (en) * 2011-05-31 2019-06-04 United Technologies Corporation Composite article having layer with co-continuous material regions
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US20160354896A1 (en) * 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
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US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
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JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN105729250B (zh) * 2015-12-29 2018-01-30 广东工业大学 一种自修整磁流变柔性抛光砂轮及其磨抛方法
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR102587473B1 (ko) 2016-02-08 2023-10-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 연마를 위한 시스템들, 장치, 및 방법들
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
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TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
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US20210053056A1 (en) * 2019-08-23 2021-02-25 Lawrence Livermore National Security, Llc Systems and methods for reaction and transport engineering via cellular fluidics
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CN117103107A (zh) * 2022-05-16 2023-11-24 成都高真科技有限公司 还原料浆用抛光装置

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Also Published As

Publication number Publication date
EP2025458A2 (en) 2009-02-18
KR101507611B1 (ko) 2015-03-31
JP2009056585A (ja) 2009-03-19
TWI438835B (zh) 2014-05-21
CN101367204A (zh) 2009-02-18
US7635291B2 (en) 2009-12-22
SG150466A1 (en) 2009-03-30
KR20090017993A (ko) 2009-02-19
EP2025458A3 (en) 2014-04-02
CN102554767A (zh) 2012-07-11
US20090280725A1 (en) 2009-11-12
EP2025458B1 (en) 2015-06-03
US20090047871A1 (en) 2009-02-19
US7635290B2 (en) 2009-12-22
CN102554767B (zh) 2015-11-25
TW200913042A (en) 2009-03-16
CN101367204B (zh) 2012-11-14

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