TWI438835B - 用於化學機械研磨之互穿網狀體 - Google Patents

用於化學機械研磨之互穿網狀體 Download PDF

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Publication number
TWI438835B
TWI438835B TW097129622A TW97129622A TWI438835B TW I438835 B TWI438835 B TW I438835B TW 097129622 A TW097129622 A TW 097129622A TW 97129622 A TW97129622 A TW 97129622A TW I438835 B TWI438835 B TW I438835B
Authority
TW
Taiwan
Prior art keywords
abrasive
polishing pad
chemical mechanical
mechanical polishing
phase
Prior art date
Application number
TW097129622A
Other languages
English (en)
Chinese (zh)
Other versions
TW200913042A (en
Inventor
葛列格里Ｐ 莫唐尼
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW200913042A publication Critical patent/TW200913042A/zh
Application granted granted Critical
Publication of TWI438835B publication Critical patent/TWI438835B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097129622A 2007-08-15 2008-08-05 用於化學機械研磨之互穿網狀體 TWI438835B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/839,376 US7635290B2 (en) 2007-08-15 2007-08-15 Interpenetrating network for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW200913042A TW200913042A (en) 2009-03-16
TWI438835B true TWI438835B (zh) 2014-05-21

Family

ID=40029278

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097129622A TWI438835B (zh) 2007-08-15 2008-08-05 用於化學機械研磨之互穿網狀體

Country Status (7)

Country Link
US (2) US7635290B2 (https=)
EP (1) EP2025458B1 (https=)
JP (1) JP5216473B2 (https=)
KR (1) KR101507611B1 (https=)
CN (2) CN102554767B (https=)
SG (1) SG150466A1 (https=)
TW (1) TWI438835B (https=)

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JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
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Also Published As

Publication number Publication date
EP2025458A2 (en) 2009-02-18
KR101507611B1 (ko) 2015-03-31
JP2009056585A (ja) 2009-03-19
CN101367204A (zh) 2009-02-18
US7635291B2 (en) 2009-12-22
SG150466A1 (en) 2009-03-30
JP5216473B2 (ja) 2013-06-19
KR20090017993A (ko) 2009-02-19
EP2025458A3 (en) 2014-04-02
CN102554767A (zh) 2012-07-11
US20090280725A1 (en) 2009-11-12
EP2025458B1 (en) 2015-06-03
US20090047871A1 (en) 2009-02-19
US7635290B2 (en) 2009-12-22
CN102554767B (zh) 2015-11-25
TW200913042A (en) 2009-03-16
CN101367204B (zh) 2012-11-14

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