KR101507611B1 - 화학적 기계적 연마를 위한 상호침투 망상조직 - Google Patents

화학적 기계적 연마를 위한 상호침투 망상조직 Download PDF

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Publication number
KR101507611B1
KR101507611B1 KR1020080079827A KR20080079827A KR101507611B1 KR 101507611 B1 KR101507611 B1 KR 101507611B1 KR 1020080079827 A KR1020080079827 A KR 1020080079827A KR 20080079827 A KR20080079827 A KR 20080079827A KR 101507611 B1 KR101507611 B1 KR 101507611B1
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South Korea
Prior art keywords
polishing
abrasive
chemical mechanical
pad
polishing pad
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KR1020080079827A
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English (en)
Korean (ko)
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KR20090017993A (ko
Inventor
그레고리 피. 멀다우니
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20090017993A publication Critical patent/KR20090017993A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020080079827A 2007-08-15 2008-08-14 화학적 기계적 연마를 위한 상호침투 망상조직 Active KR101507611B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/839,376 US7635290B2 (en) 2007-08-15 2007-08-15 Interpenetrating network for chemical mechanical polishing
US11/839,376 2007-08-15

Publications (2)

Publication Number Publication Date
KR20090017993A KR20090017993A (ko) 2009-02-19
KR101507611B1 true KR101507611B1 (ko) 2015-03-31

Family

ID=40029278

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080079827A Active KR101507611B1 (ko) 2007-08-15 2008-08-14 화학적 기계적 연마를 위한 상호침투 망상조직

Country Status (7)

Country Link
US (2) US7635290B2 (https=)
EP (1) EP2025458B1 (https=)
JP (1) JP5216473B2 (https=)
KR (1) KR101507611B1 (https=)
CN (2) CN102554767B (https=)
SG (1) SG150466A1 (https=)
TW (1) TWI438835B (https=)

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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
JP2016087770A (ja) * 2014-11-11 2016-05-23 株式会社東芝 研磨布および研磨方法
TWI754275B (zh) * 2015-10-16 2022-02-01 美商應用材料股份有限公司 拋光墊及形成其之方法
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
CN105729250B (zh) * 2015-12-29 2018-01-30 广东工业大学 一种自修整磁流变柔性抛光砂轮及其磨抛方法
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR102587473B1 (ko) 2016-02-08 2023-10-11 어플라이드 머티어리얼스, 인코포레이티드 화학적 연마를 위한 시스템들, 장치, 및 방법들
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
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TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
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US20210053056A1 (en) * 2019-08-23 2021-02-25 Lawrence Livermore National Security, Llc Systems and methods for reaction and transport engineering via cellular fluidics
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Also Published As

Publication number Publication date
EP2025458A2 (en) 2009-02-18
JP2009056585A (ja) 2009-03-19
TWI438835B (zh) 2014-05-21
CN101367204A (zh) 2009-02-18
US7635291B2 (en) 2009-12-22
SG150466A1 (en) 2009-03-30
JP5216473B2 (ja) 2013-06-19
KR20090017993A (ko) 2009-02-19
EP2025458A3 (en) 2014-04-02
CN102554767A (zh) 2012-07-11
US20090280725A1 (en) 2009-11-12
EP2025458B1 (en) 2015-06-03
US20090047871A1 (en) 2009-02-19
US7635290B2 (en) 2009-12-22
CN102554767B (zh) 2015-11-25
TW200913042A (en) 2009-03-16
CN101367204B (zh) 2012-11-14

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St.27 status event code: A-4-4-P10-P22-nap-X000