JP5201181B2 - 接着剤組成物、回路接続構造体及び半導体装置 - Google Patents

接着剤組成物、回路接続構造体及び半導体装置 Download PDF

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JP5201181B2
JP5201181B2 JP2010179753A JP2010179753A JP5201181B2 JP 5201181 B2 JP5201181 B2 JP 5201181B2 JP 2010179753 A JP2010179753 A JP 2010179753A JP 2010179753 A JP2010179753 A JP 2010179753A JP 5201181 B2 JP5201181 B2 JP 5201181B2
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group
adhesive composition
resin
circuit
bis
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JP2011116937A (ja
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直 工藤
征宏 有福
宏治 小林
雅英 久米
克之 増田
貴子 江尻
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2010179753A 2009-11-04 2010-08-10 接着剤組成物、回路接続構造体及び半導体装置 Active JP5201181B2 (ja)

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JP (1) JP5201181B2 (zh)
KR (1) KR101388851B1 (zh)
CN (1) CN102597153B (zh)
TW (1) TWI425064B (zh)
WO (1) WO2011055580A1 (zh)

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KR101721732B1 (ko) * 2014-07-25 2017-04-10 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP2017145382A (ja) * 2016-02-15 2017-08-24 太陽インキ製造株式会社 導電性接着剤とその製造方法、硬化物および電子部品
JP6561912B2 (ja) * 2016-05-16 2019-08-21 東亞合成株式会社 プラスチック製フィルム又はシート用活性エネルギー線硬化型接着剤組成物
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KR101388851B1 (ko) 2014-04-23
JP2011116937A (ja) 2011-06-16

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