JP5193852B2 - 有機高分子眼科基材のスラリー組成物及び研磨方法 - Google Patents

有機高分子眼科基材のスラリー組成物及び研磨方法 Download PDF

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Publication number
JP5193852B2
JP5193852B2 JP2008505303A JP2008505303A JP5193852B2 JP 5193852 B2 JP5193852 B2 JP 5193852B2 JP 2008505303 A JP2008505303 A JP 2008505303A JP 2008505303 A JP2008505303 A JP 2008505303A JP 5193852 B2 JP5193852 B2 JP 5193852B2
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Prior art keywords
pyrrolidone
slurry composition
slurry
polishing
organic polymer
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JP2008505303A
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English (en)
Japanese (ja)
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JP2008537704A (ja
JP2008537704A5 (enExample
Inventor
スティーブン,エー. フェランティ
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フエロ コーポレーション
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Eyeglasses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2008505303A 2005-04-08 2006-02-22 有機高分子眼科基材のスラリー組成物及び研磨方法 Expired - Fee Related JP5193852B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/102,555 US7294044B2 (en) 2005-04-08 2005-04-08 Slurry composition and method for polishing organic polymer-based ophthalmic substrates
US11/102,555 2005-04-08
PCT/US2006/006306 WO2006110224A2 (en) 2005-04-08 2006-02-22 Slurry composition and method for polishing organic polymer-based ophthalmic substrates

Publications (3)

Publication Number Publication Date
JP2008537704A JP2008537704A (ja) 2008-09-25
JP2008537704A5 JP2008537704A5 (enExample) 2012-06-28
JP5193852B2 true JP5193852B2 (ja) 2013-05-08

Family

ID=37083726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008505303A Expired - Fee Related JP5193852B2 (ja) 2005-04-08 2006-02-22 有機高分子眼科基材のスラリー組成物及び研磨方法

Country Status (7)

Country Link
US (1) US7294044B2 (enExample)
EP (1) EP1868769B1 (enExample)
JP (1) JP5193852B2 (enExample)
CN (1) CN101541910B (enExample)
AT (1) ATE527328T1 (enExample)
TW (1) TWI391350B (enExample)
WO (1) WO2006110224A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7467988B2 (en) * 2005-04-08 2008-12-23 Ferro Corporation Slurry composition and method for polishing organic polymer-based ophthalmic substrates
SG10201605686XA (en) * 2008-02-01 2016-08-30 Fujimi Inc Polishing Composition And Polishing Method Using The Same
KR20110013417A (ko) * 2008-04-24 2011-02-09 피피티 리서치 , 인코포레이티드 안정한 수성 슬러리 현탁액
US20100330884A1 (en) * 2009-06-29 2010-12-30 Ferro Corporation Diatomaceous Earth-Containing Slurry Composition And Method For Polishing Organic Polymer-Based Ophthalmic Substrates Using The Same
US8449636B2 (en) * 2010-08-09 2013-05-28 Ferro Corporation Easy rinsing polishing composition for polymer-based surfaces
WO2012119154A2 (en) * 2011-03-03 2012-09-07 Wisys Technology Foundation Thermodynamic solutions of metal oxides and metal chalcogenides and mixed metal oxides and chalcogenides
US8821215B2 (en) * 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method
US9633831B2 (en) 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
WO2017011115A1 (en) 2015-07-10 2017-01-19 Ferro Corporation Slurry composition and additives and method for polishing organic polymer-based ophthalmic substrates
KR102463863B1 (ko) * 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
JP6758984B2 (ja) * 2016-07-29 2020-09-23 キヤノン株式会社 インクジェット記録装置及びクリーニング方法
WO2018038885A1 (en) 2016-08-26 2018-03-01 Ferro Corporation Slurry composition and method of selective silica polishing
US10037889B1 (en) 2017-03-29 2018-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films
CN107299385A (zh) * 2017-05-18 2017-10-27 当涂县宏宇金属炉料有限责任公司 一种改善不锈钢表面特性的电化学处理方法
CN109015204B (zh) * 2018-08-29 2020-11-27 包头市利晨科技有限公司 一种适用于cr39树脂镜片的抛光方法
KR102837555B1 (ko) 2018-12-14 2025-07-24 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 합성 수지 연마 방법
CN113755842B (zh) * 2021-10-18 2024-04-02 德米特(苏州)电子环保材料有限公司 一种金属抛光液及其制备方法和应用
JP2024060831A (ja) 2022-10-20 2024-05-07 山口精研工業株式会社 プラスチックレンズ用研磨剤組成物

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127697A (en) * 1975-05-19 1978-11-28 American Optical Corporation Abrasion-resistant lenses and process of making
US4135792A (en) * 1976-02-20 1979-01-23 American Optical Corporation All plastic spectacles
US4108827A (en) * 1976-12-13 1978-08-22 American Optical Corporation Colorless allyl diglycol carbonate
JPS5489389A (en) 1977-12-27 1979-07-16 Fujimi Kenmazai Kougiyou Kk Composition for polishing of moldings in synthetic resin
FR2414071A1 (fr) 1978-01-05 1979-08-03 Essilor Int Materiau de polissage, notamment pour lentille ophtalmique en matiere organique
US4443588A (en) * 1981-02-19 1984-04-17 Toray Industries, Inc. Highly refractive urethane polymers for use in optical lenses and lenses prepared therefrom
US4376751A (en) 1981-05-29 1983-03-15 The United States Of America As Represented By The Department Of Energy Production of super-smooth articles
US4859719A (en) * 1983-09-08 1989-08-22 Minnesota Mining And Manufacturing Company Polymer blends with high water absorption
JPS61182763A (ja) * 1985-02-06 1986-08-15 Sanyo Chem Ind Ltd 研磨加工液
JPS6243482A (ja) * 1985-08-21 1987-02-25 Sanyo Chem Ind Ltd 研磨加工液
FR2604443A1 (fr) * 1986-09-26 1988-04-01 Rhone Poulenc Chimie Composition de polissage a base de cerium destinee au polissage des verres organiques
JPH0818241B2 (ja) * 1987-03-19 1996-02-28 キヤノン株式会社 研磨工具の製造方法
JPH0899268A (ja) * 1994-10-03 1996-04-16 Olympus Optical Co Ltd 研磨用工具とその製造方法
US5989301A (en) * 1998-02-18 1999-11-23 Saint-Gobain Industrial Ceramics, Inc. Optical polishing formulation
JP2000256654A (ja) * 1999-03-04 2000-09-19 Hitachi Chem Co Ltd Cmp研磨剤及び基板の研磨方法
JP4729834B2 (ja) * 1999-06-18 2011-07-20 日立化成工業株式会社 Cmp研磨剤、これを用いた基板の研磨方法及び半導体装置の製造方法並びにcmp研磨剤用添加剤
EP1369906B1 (en) 2001-02-20 2012-06-27 Hitachi Chemical Company, Ltd. Polishing compound and method for polishing substrate
JP2002305198A (ja) * 2001-04-06 2002-10-18 Toshiba Corp 電子デバイスの製造方法
JP4231632B2 (ja) 2001-04-27 2009-03-04 花王株式会社 研磨液組成物
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
WO2003036705A1 (en) * 2001-10-26 2003-05-01 Asahi Glass Company, Limited Polishing compound, method for production thereof and polishing method
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
JP4387708B2 (ja) * 2002-07-04 2009-12-24 Hoya株式会社 プラスチック製眼鏡レンズの研磨方法および製造方法
TWI256971B (en) * 2002-08-09 2006-06-21 Hitachi Chemical Co Ltd CMP abrasive and method for polishing substrate
US7300601B2 (en) * 2002-12-10 2007-11-27 Advanced Technology Materials, Inc. Passivative chemical mechanical polishing composition for copper film planarization
US6916742B2 (en) * 2003-02-27 2005-07-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Modular barrier removal polishing slurry
JP2004311967A (ja) * 2003-03-27 2004-11-04 Nippon Shokubai Co Ltd Cmp研磨剤用ポリマー及び組成物
US6802878B1 (en) * 2003-04-17 2004-10-12 3M Innovative Properties Company Abrasive particles, abrasive articles, and methods of making and using the same
JP2004331852A (ja) 2003-05-09 2004-11-25 Tama Kagaku Kogyo Kk 分散安定性に優れた研磨剤スラリー及び基板の製造方法
JP4138610B2 (ja) * 2003-08-29 2008-08-27 有限会社コスモテック 研磨治具用曲率設定装置および研磨治具曲率設定方法
US7344988B2 (en) * 2003-10-27 2008-03-18 Dupont Air Products Nanomaterials Llc Alumina abrasive for chemical mechanical polishing
US20060216935A1 (en) * 2005-03-28 2006-09-28 Ferro Corporation Composition for oxide CMP in CMOS device fabrication

Also Published As

Publication number Publication date
TW200642978A (en) 2006-12-16
JP2008537704A (ja) 2008-09-25
CN101541910A (zh) 2009-09-23
EP1868769A2 (en) 2007-12-26
WO2006110224A2 (en) 2006-10-19
ATE527328T1 (de) 2011-10-15
CN101541910B (zh) 2012-09-05
EP1868769B1 (en) 2011-10-05
WO2006110224A3 (en) 2009-04-16
US20060228999A1 (en) 2006-10-12
EP1868769A4 (en) 2010-03-10
US7294044B2 (en) 2007-11-13
TWI391350B (zh) 2013-04-01

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