JP5192977B2 - 貼り合せ基板のスクライブ方法 - Google Patents

貼り合せ基板のスクライブ方法 Download PDF

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Publication number
JP5192977B2
JP5192977B2 JP2008264523A JP2008264523A JP5192977B2 JP 5192977 B2 JP5192977 B2 JP 5192977B2 JP 2008264523 A JP2008264523 A JP 2008264523A JP 2008264523 A JP2008264523 A JP 2008264523A JP 5192977 B2 JP5192977 B2 JP 5192977B2
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JP
Japan
Prior art keywords
substrate
scribe line
scribing
scribe
bonded
Prior art date
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Expired - Fee Related
Application number
JP2008264523A
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English (en)
Japanese (ja)
Other versions
JP2010090022A (ja
Inventor
孝志 川畑
良太 阪口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2008264523A priority Critical patent/JP5192977B2/ja
Priority to KR1020090081125A priority patent/KR101054356B1/ko
Priority to CN2009101788069A priority patent/CN101722581B/zh
Priority to EP09171792.6A priority patent/EP2174762B1/en
Priority to TW098133857A priority patent/TW201032974A/zh
Publication of JP2010090022A publication Critical patent/JP2010090022A/ja
Application granted granted Critical
Publication of JP5192977B2 publication Critical patent/JP5192977B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2008264523A 2008-10-10 2008-10-10 貼り合せ基板のスクライブ方法 Expired - Fee Related JP5192977B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008264523A JP5192977B2 (ja) 2008-10-10 2008-10-10 貼り合せ基板のスクライブ方法
KR1020090081125A KR101054356B1 (ko) 2008-10-10 2009-08-31 접합 기판의 스크라이브 방법
CN2009101788069A CN101722581B (zh) 2008-10-10 2009-09-25 贴合基板之切割方法
EP09171792.6A EP2174762B1 (en) 2008-10-10 2009-09-30 Method for scribing bonded substrates
TW098133857A TW201032974A (en) 2008-10-10 2009-10-06 Method for scribing bonded substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008264523A JP5192977B2 (ja) 2008-10-10 2008-10-10 貼り合せ基板のスクライブ方法

Publications (2)

Publication Number Publication Date
JP2010090022A JP2010090022A (ja) 2010-04-22
JP5192977B2 true JP5192977B2 (ja) 2013-05-08

Family

ID=41491691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008264523A Expired - Fee Related JP5192977B2 (ja) 2008-10-10 2008-10-10 貼り合せ基板のスクライブ方法

Country Status (5)

Country Link
EP (1) EP2174762B1 (enExample)
JP (1) JP5192977B2 (enExample)
KR (1) KR101054356B1 (enExample)
CN (1) CN101722581B (enExample)
TW (1) TW201032974A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5156080B2 (ja) * 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
TWI462885B (zh) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
JP5133436B2 (ja) * 2011-03-08 2013-01-30 シャープ株式会社 液晶パネルの製造方法
JP2015034112A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
CN104280922B (zh) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 一种液晶屏玻璃切割方法和装置
CN109079909A (zh) * 2017-06-14 2018-12-25 张家港康得新光电材料有限公司 利用保护膜的产品加工方法
CN117283622B (zh) * 2023-09-28 2025-11-14 广州弘亚数控机械集团股份有限公司 一种释放板材应力的板材切割方法、装置及存储介质

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3042192B2 (ja) * 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
JPH11305181A (ja) * 1998-04-17 1999-11-05 Mitsubishi Electric Corp 液晶表示パネルの切断条件設定方法
JP3965902B2 (ja) * 2000-05-23 2007-08-29 株式会社日立製作所 液晶表示装置の製造方法
JP4038431B2 (ja) * 2001-03-16 2008-01-23 三星ダイヤモンド工業株式会社 スクライブ方法及びカッターホィール並びにそのカッターホィールを用いたスクライブ装置、そのカッターホィールを製造するカッターホィール製造装置
JPWO2002081392A1 (ja) * 2001-04-02 2004-07-29 三星ダイヤモンド工業株式会社 カッターホイール及びそのカッターホイールを用いたスクライブ装置、スクライブ方法及び貼り合わせ基板の分断方法、並びにカッターホイールを製造するカッターホイール製造方法と製造装置
JP4502964B2 (ja) * 2001-04-02 2010-07-14 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法
TWI226877B (en) * 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
US20040123717A1 (en) * 2002-04-02 2004-07-01 Kazuya Maekawa Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
JP4885675B2 (ja) * 2006-09-27 2012-02-29 株式会社Ｎｓｃ 貼合せガラス板の切断分離方法

Also Published As

Publication number Publication date
TWI357851B (enExample) 2012-02-11
KR101054356B1 (ko) 2011-08-04
TW201032974A (en) 2010-09-16
JP2010090022A (ja) 2010-04-22
EP2174762B1 (en) 2014-08-13
CN101722581B (zh) 2012-10-17
EP2174762A1 (en) 2010-04-14
CN101722581A (zh) 2010-06-09
KR20100040662A (ko) 2010-04-20

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