CN101722581B - 贴合基板之切割方法 - Google Patents

贴合基板之切割方法 Download PDF

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Publication number
CN101722581B
CN101722581B CN2009101788069A CN200910178806A CN101722581B CN 101722581 B CN101722581 B CN 101722581B CN 2009101788069 A CN2009101788069 A CN 2009101788069A CN 200910178806 A CN200910178806 A CN 200910178806A CN 101722581 B CN101722581 B CN 101722581B
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CN
China
Prior art keywords
substrate
line
product
cutting
stress release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2009101788069A
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English (en)
Chinese (zh)
Other versions
CN101722581A (zh
Inventor
川畑孝志
阪口良太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication date
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Publication of CN101722581A publication Critical patent/CN101722581A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN2009101788069A 2008-10-10 2009-09-25 贴合基板之切割方法 Expired - Fee Related CN101722581B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008264523A JP5192977B2 (ja) 2008-10-10 2008-10-10 貼り合せ基板のスクライブ方法
JP2008-264523 2008-10-10

Publications (2)

Publication Number Publication Date
CN101722581A CN101722581A (zh) 2010-06-09
CN101722581B true CN101722581B (zh) 2012-10-17

Family

ID=41491691

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101788069A Expired - Fee Related CN101722581B (zh) 2008-10-10 2009-09-25 贴合基板之切割方法

Country Status (5)

Country Link
EP (1) EP2174762B1 (enExample)
JP (1) JP5192977B2 (enExample)
KR (1) KR101054356B1 (enExample)
CN (1) CN101722581B (enExample)
TW (1) TW201032974A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5156080B2 (ja) * 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板のスクライブ方法
TWI462885B (zh) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
JP5133436B2 (ja) * 2011-03-08 2013-01-30 シャープ株式会社 液晶パネルの製造方法
JP2015034112A (ja) * 2013-08-09 2015-02-19 三星ダイヤモンド工業株式会社 積層セラミックス基板の分断方法
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP6432245B2 (ja) * 2014-09-26 2018-12-05 三星ダイヤモンド工業株式会社 基板分断方法
CN104280922B (zh) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 一种液晶屏玻璃切割方法和装置
CN109079909A (zh) * 2017-06-14 2018-12-25 张家港康得新光电材料有限公司 利用保护膜的产品加工方法
CN117283622B (zh) * 2023-09-28 2025-11-14 广州弘亚数控机械集团股份有限公司 一种释放板材应力的板材切割方法、装置及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1541193A (zh) * 2001-04-02 2004-10-27 三星钻石工业股份有限公司 切刀滚轮及使用该切刀滚轮的刻痕装置、刻痕方法及贴合基板的分断方法、以及制造切刀滚轮的切刀滚轮制造方法和制造装置
CN101152972A (zh) * 2006-09-27 2008-04-02 西山不锈化学股份有限公司 粘合玻璃板的切割分离方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3042192B2 (ja) * 1992-07-29 2000-05-15 三星ダイヤモンド工業株式会社 貼り合せガラス基板の裁断方法及びその装置
JPH11305181A (ja) * 1998-04-17 1999-11-05 Mitsubishi Electric Corp 液晶表示パネルの切断条件設定方法
JP3965902B2 (ja) * 2000-05-23 2007-08-29 株式会社日立製作所 液晶表示装置の製造方法
JP4038431B2 (ja) * 2001-03-16 2008-01-23 三星ダイヤモンド工業株式会社 スクライブ方法及びカッターホィール並びにそのカッターホィールを用いたスクライブ装置、そのカッターホィールを製造するカッターホィール製造装置
JP4502964B2 (ja) * 2001-04-02 2010-07-14 三星ダイヤモンド工業株式会社 貼り合わせ基板の分断方法
TWI226877B (en) * 2001-07-12 2005-01-21 Mitsuboshi Diamond Ind Co Ltd Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates
US20040123717A1 (en) * 2002-04-02 2004-07-01 Kazuya Maekawa Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1541193A (zh) * 2001-04-02 2004-10-27 三星钻石工业股份有限公司 切刀滚轮及使用该切刀滚轮的刻痕装置、刻痕方法及贴合基板的分断方法、以及制造切刀滚轮的切刀滚轮制造方法和制造装置
CN101152972A (zh) * 2006-09-27 2008-04-02 西山不锈化学股份有限公司 粘合玻璃板的切割分离方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-48755A 1994.02.22

Also Published As

Publication number Publication date
TWI357851B (enExample) 2012-02-11
KR101054356B1 (ko) 2011-08-04
TW201032974A (en) 2010-09-16
JP2010090022A (ja) 2010-04-22
JP5192977B2 (ja) 2013-05-08
EP2174762B1 (en) 2014-08-13
EP2174762A1 (en) 2010-04-14
CN101722581A (zh) 2010-06-09
KR20100040662A (ko) 2010-04-20

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Granted publication date: 20121017

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