JP5188021B2 - ハンダ膜及びその形成方法 - Google Patents

ハンダ膜及びその形成方法 Download PDF

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Publication number
JP5188021B2
JP5188021B2 JP2005362924A JP2005362924A JP5188021B2 JP 5188021 B2 JP5188021 B2 JP 5188021B2 JP 2005362924 A JP2005362924 A JP 2005362924A JP 2005362924 A JP2005362924 A JP 2005362924A JP 5188021 B2 JP5188021 B2 JP 5188021B2
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JP
Japan
Prior art keywords
alloy
substrate
solder film
solder
ausn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2005362924A
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English (en)
Japanese (ja)
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JP2007162107A5 (https=
JP2007162107A (ja
Inventor
元樹 小畑
功 水間
良彦 堀金
純二 土屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Finetech Miyota Co Ltd
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Citizen Finetech Miyota Co Ltd
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Priority to JP2005362924A priority Critical patent/JP5188021B2/ja
Publication of JP2007162107A publication Critical patent/JP2007162107A/ja
Publication of JP2007162107A5 publication Critical patent/JP2007162107A5/ja
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Publication of JP5188021B2 publication Critical patent/JP5188021B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

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  • Die Bonding (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005362924A 2005-12-16 2005-12-16 ハンダ膜及びその形成方法 Expired - Lifetime JP5188021B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005362924A JP5188021B2 (ja) 2005-12-16 2005-12-16 ハンダ膜及びその形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005362924A JP5188021B2 (ja) 2005-12-16 2005-12-16 ハンダ膜及びその形成方法

Publications (3)

Publication Number Publication Date
JP2007162107A JP2007162107A (ja) 2007-06-28
JP2007162107A5 JP2007162107A5 (https=) 2009-02-12
JP5188021B2 true JP5188021B2 (ja) 2013-04-24

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ID=38245355

Family Applications (1)

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JP2005362924A Expired - Lifetime JP5188021B2 (ja) 2005-12-16 2005-12-16 ハンダ膜及びその形成方法

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JP (1) JP5188021B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010261094A (ja) * 2009-05-11 2010-11-18 Mitsubishi Materials Corp Ａｕ−Ｓｎ合金蒸着用粒状材およびその製造方法
JP2010275577A (ja) * 2009-05-27 2010-12-09 Ulvac Japan Ltd 成膜方法
JP6070927B2 (ja) * 2012-09-12 2017-02-01 三菱マテリアル株式会社 Ａｕ−Ｓｎ合金含有ペースト、Ａｕ−Ｓｎ合金薄膜及びその成膜方法
CN103290251A (zh) * 2013-05-17 2013-09-11 江西理工大学 一种金锡箔带材钎料的制备方法
CN104294218B (zh) * 2014-10-23 2016-06-08 中国科学院上海光学精密机械研究所 金锡薄膜的制备装置和方法
JP6720515B2 (ja) * 2015-12-04 2020-07-08 三菱マテリアル株式会社 Ａｕ−Ｓｎはんだ粉末及びこの粉末を含むはんだ用ペースト
CN117107199B (zh) * 2023-08-31 2026-03-24 安徽光智科技有限公司 晶圆级封装中电子束蒸发沉积焊料的工艺以及晶圆级封装工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838485A (https=) * 1971-09-20 1973-06-06
EP0111611B1 (fr) * 1982-10-28 1987-05-13 International Business Machines Corporation Perfectionnements aux procédés et équipements de dépôt par évaporation sous vide mettant en oeuvre un canon à électrons
JPH02145765A (ja) * 1988-11-25 1990-06-05 Hitachi Ltd 膜厚モニタおよびこれを用いた蒸着装置
JPH09115835A (ja) * 1995-10-23 1997-05-02 Sony Corp ウエハ処理装置
JPH09283909A (ja) * 1996-04-19 1997-10-31 Hitachi Ltd 電子回路装置およびその製造方法
JP3303227B2 (ja) * 1996-06-13 2002-07-15 日本航空電子工業株式会社 ＡｕＳｎ多層ハンダ
JP2002224882A (ja) * 2001-01-29 2002-08-13 Hitachi Metals Ltd Ａｕ／Ｓｎ複合箔及びＡｕ／Ｓｎ合金箔並びにそれを用いてなるロウ材、Ａｕ／Ｓｎ複合箔の製造方法及びＡｕ／Ｓｎ合金箔の製造方法、ロウ材の接合方法
JP4208083B2 (ja) * 2004-09-16 2009-01-14 シチズンファインテックミヨタ株式会社 Ａｕ−Ｓｎ合金積層ハンダ及びその製造方法

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JP2007162107A (ja) 2007-06-28

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