JP5183340B2 - 表面実装型の発振器およびこの発振器を搭載した電子機器 - Google Patents

表面実装型の発振器およびこの発振器を搭載した電子機器 Download PDF

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Publication number
JP5183340B2
JP5183340B2 JP2008189358A JP2008189358A JP5183340B2 JP 5183340 B2 JP5183340 B2 JP 5183340B2 JP 2008189358 A JP2008189358 A JP 2008189358A JP 2008189358 A JP2008189358 A JP 2008189358A JP 5183340 B2 JP5183340 B2 JP 5183340B2
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Prior art keywords
oscillator
terminals
circuit board
surface mount
terminal
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Expired - Fee Related
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JP2008189358A
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Japanese (ja)
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JP2010028601A5 (enExample
JP2010028601A (ja
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渡辺　　誠
克明 坂元
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Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2008189358A 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器 Expired - Fee Related JP5183340B2 (ja)

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JP2008189358A JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

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JP2008189358A JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

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JP2010028601A JP2010028601A (ja) 2010-02-04
JP2010028601A5 JP2010028601A5 (enExample) 2012-07-12
JP5183340B2 true JP5183340B2 (ja) 2013-04-17

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JP2008189358A Expired - Fee Related JP5183340B2 (ja) 2008-07-23 2008-07-23 表面実装型の発振器およびこの発振器を搭載した電子機器

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791199B2 (en) 2006-11-22 2010-09-07 Tessera, Inc. Packaged semiconductor chips
US8569876B2 (en) 2006-11-22 2013-10-29 Tessera, Inc. Packaged semiconductor chips with array
EP2575166A3 (en) 2007-03-05 2014-04-09 Invensas Corporation Chips having rear contacts connected by through vias to front contacts
CN103178032B (zh) 2007-07-31 2017-06-20 英闻萨斯有限公司 使用穿透硅通道的半导体封装方法
US9640437B2 (en) 2010-07-23 2017-05-02 Tessera, Inc. Methods of forming semiconductor elements using micro-abrasive particle stream
US8796135B2 (en) 2010-07-23 2014-08-05 Tessera, Inc. Microelectronic elements with rear contacts connected with via first or via middle structures
US8791575B2 (en) 2010-07-23 2014-07-29 Tessera, Inc. Microelectronic elements having metallic pads overlying vias
US8847380B2 (en) 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
US8610259B2 (en) 2010-09-17 2013-12-17 Tessera, Inc. Multi-function and shielded 3D interconnects
KR101059490B1 (ko) 2010-11-15 2011-08-25 테세라 리써치 엘엘씨 임베드된 트레이스에 의해 구성된 전도성 패드
US8736066B2 (en) 2010-12-02 2014-05-27 Tessera, Inc. Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
US8637968B2 (en) 2010-12-02 2014-01-28 Tessera, Inc. Stacked microelectronic assembly having interposer connecting active chips
US8587126B2 (en) 2010-12-02 2013-11-19 Tessera, Inc. Stacked microelectronic assembly with TSVs formed in stages with plural active chips
US8610264B2 (en) 2010-12-08 2013-12-17 Tessera, Inc. Compliant interconnects in wafers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151627A (ja) * 2000-11-09 2002-05-24 Hitachi Ltd 半導体装置、その製造方法および実装方法
JP2006019455A (ja) * 2004-06-30 2006-01-19 Nec Electronics Corp 半導体装置およびその製造方法
JP2007067173A (ja) * 2005-08-31 2007-03-15 Kyocera Kinseki Corp 電子部品
JP2008072321A (ja) * 2006-09-13 2008-03-27 Tdk Corp 電子部品
JP4328347B2 (ja) * 2006-11-10 2009-09-09 ホシデン株式会社 マイクロホン及びその実装構造

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