JP5174495B2 - n型及びp型CISを含む薄膜トランジスタ及びその製造方法 - Google Patents
n型及びp型CISを含む薄膜トランジスタ及びその製造方法 Download PDFInfo
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- JP5174495B2 JP5174495B2 JP2008059785A JP2008059785A JP5174495B2 JP 5174495 B2 JP5174495 B2 JP 5174495B2 JP 2008059785 A JP2008059785 A JP 2008059785A JP 2008059785 A JP2008059785 A JP 2008059785A JP 5174495 B2 JP5174495 B2 JP 5174495B2
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- 239000010409 thin film Substances 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 21
- 239000010408 film Substances 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000002161 passivation Methods 0.000 claims description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 6
- 229920005591 polysilicon Polymers 0.000 claims description 6
- -1 ITO Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000011669 selenium Substances 0.000 description 32
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 239000010949 copper Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052798 chalcogen Inorganic materials 0.000 description 2
- 150000001787 chalcogens Chemical class 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 1
- 229910052951 chalcopyrite Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78681—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/24—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
Description
100 基板
110 第1導電層
110a ゲート電極
120 絶縁層
130 n型CIS層
130a,130b n型CIS膜
140 p型CIS層
140a,140b p型CIS膜
150 第2導電層
150a ソース/ドレイン領域
160 パッシベーション層
Claims (14)
- 基板と、
前記基板の一部領域上に形成されているゲート電極と、
前記基板と前記ゲート電極とを覆う絶縁膜と、
前記ゲート電極が形成された領域上を覆うように、前記絶縁膜上に形成されたn型CIS(CuInSe2)膜およびp型CIS膜と、
前記n型または前記p型CIS膜を覆う第2導電層と、
前記第2導電層から、前記n型または前記p型CIS膜のうち、上層のCIS膜を貫通してチャネルを形成する下層のCIS膜に達し、前記チャネルを形成するCIS膜の表面の一部を露出するトレンチを含むように分離されて形成されたソース/ドレイン領域と、
を備えることを特徴とする薄膜トランジスタ。 - 前記n型または前記p型CIS膜は、それぞれIn2Se3とCu2Se3とを利用して形成したことを特徴とする請求項1に記載の薄膜トランジスタ。
- 前記n型または前記p型CIS膜の導電型は、In2Se3とCu2Se3との相対的なモル比率によって決定されることを特徴とする請求項2に記載の薄膜トランジスタ。
- 前記In2Se3とCu2Se3との相対的なモル比率が0.1ないし0.5の範囲である場合には、前記CIS膜は、p型の導電型を有することを特徴とする請求項3に記載の薄膜トランジスタ。
- 前記In2Se3とCu2Se3との相対的なモル比率が0.6ないし0.9の範囲である場合には、前記CIS膜は、n型の導電型を有することを特徴とする請求項3に記載の薄膜トランジスタ。
- 前記ソース/ドレイン領域と前記露出されたCIS膜とを覆うパッシベーション層をさらに備えることを特徴とする請求項1に記載の薄膜トランジスタ。
- 前記基板は、ガラス基板または石英基板であることを特徴とする請求項1に記載の薄膜トランジスタ。
- 前記ゲート電極は、導電性ポリシリコン、ITO、または金属を含むことを特徴とする請求項1に記載の薄膜トランジスタ。
- 前記絶縁膜は、シリコン酸化物(SiO2)または有機物高分子PMMAを含むことを特徴とする請求項1に記載の薄膜トランジスタ。
- 前記ソース/ドレイン領域は、導電性ポリシリコン、ITO、または金属を含むことを特徴とする請求項1に記載の薄膜トランジスタ。
- 基板を準備する工程と、
前記基板の一部領域上にゲート電極を形成する工程と、
前記基板及び前記ゲート電極上を覆う絶縁膜を形成する工程と、
前記ゲート電極が形成された領域上を覆うように、前記絶縁膜上にn型CIS(CuInSe2)膜およびp型CIS膜を形成する工程と、
前記n型または前記p型CIS膜を覆う第2導電層を形成する工程と、
前記第2導電層から、前記n型または前記p型CIS膜のうち、上層のCIS膜を貫通してチャネルを形成する下層のCIS膜に達し、前記チャネルを形成するCIS膜の表面の一部を露出するトレンチを含むように分離してソース/ドレイン領域を形成する工程と、
を含むことを特徴とする薄膜トランジスタの製造方法。 - 前記ソース/ドレイン領域と前記露出されたCIS膜とを覆うパッシベーション層を形成する工程をさらに含むことを特徴とする請求項11に記載の薄膜トランジスタの製造方法。
- 前記n型または前記p型CIS膜は、それぞれIn2Se3とCu2Se3とを利用して形成することを特徴とする請求項11に記載の薄膜トランジスタの製造方法。
- 前記n型または前記p型CIS膜の導電型は、In2Se3とCu2Se3との相対的なモル比率によって決定されることを特徴とする請求項13に記載の薄膜トランジスタの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0023589 | 2007-03-09 | ||
KR1020070023589A KR100809440B1 (ko) | 2007-03-09 | 2007-03-09 | n-형 및 p-형 CIS를 포함하는 박막트랜지스터 및 그제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008227498A JP2008227498A (ja) | 2008-09-25 |
JP5174495B2 true JP5174495B2 (ja) | 2013-04-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008059785A Expired - Fee Related JP5174495B2 (ja) | 2007-03-09 | 2008-03-10 | n型及びp型CISを含む薄膜トランジスタ及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7851791B2 (ja) |
JP (1) | JP5174495B2 (ja) |
KR (1) | KR100809440B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100889746B1 (ko) * | 2007-03-09 | 2009-03-24 | 한국전자통신연구원 | 칼코젠 박막 트랜지스터 어레이를 포함하는 전자의료영상장치 |
JP2010245366A (ja) * | 2009-04-08 | 2010-10-28 | Fujifilm Corp | 電子素子及びその製造方法、並びに表示装置 |
KR101948602B1 (ko) * | 2017-10-25 | 2019-02-15 | 고려대학교 산학협력단 | 전이금속 칼코겐 화합물 및 유기 화합물의 하이브리드 구조를 포함하는 나노소자 및 그것의 제조 방법 |
CN114242921B (zh) * | 2021-12-09 | 2024-02-20 | 广东省科学院半导体研究所 | 一种发光场效应晶体管及其制备方法 |
Family Cites Families (15)
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US4040073A (en) * | 1975-08-29 | 1977-08-02 | Westinghouse Electric Corporation | Thin film transistor and display panel using the transistor |
US4145233A (en) * | 1978-05-26 | 1979-03-20 | Ncr Corporation | Method for making narrow channel FET by masking and ion-implantation |
US4818357A (en) * | 1987-05-06 | 1989-04-04 | Brown University Research Foundation | Method and apparatus for sputter deposition of a semiconductor homojunction and semiconductor homojunction products created by same |
JP2592463B2 (ja) * | 1987-09-17 | 1997-03-19 | カシオ計算機株式会社 | 薄膜トランジスタパネル |
JPH04324680A (ja) * | 1991-04-24 | 1992-11-13 | Sanyo Electric Co Ltd | カルコパイライト型化合物多結晶半導体の製造方法 |
US5793072A (en) * | 1996-02-28 | 1998-08-11 | International Business Machines Corporation | Non-photosensitive, vertically redundant 2-channel α-Si:H thin film transistor |
US5948176A (en) | 1997-09-29 | 1999-09-07 | Midwest Research Institute | Cadmium-free junction fabrication process for CuInSe2 thin film solar cells |
JPH11121779A (ja) | 1997-10-14 | 1999-04-30 | Yazaki Corp | Cis系化合物半導体太陽電池 |
JPH11330507A (ja) | 1998-05-12 | 1999-11-30 | Yazaki Corp | 太陽電池 |
JP4886116B2 (ja) | 2001-02-16 | 2012-02-29 | 本田技研工業株式会社 | 電界効果型の太陽電池 |
KR100418379B1 (ko) * | 2001-06-05 | 2004-02-11 | 학교법인고려중앙학원 | 인듐주석산화막 표면개질을 이용한 박막 광전지 및 그 제조방법 |
KR100980008B1 (ko) * | 2002-01-02 | 2010-09-03 | 삼성전자주식회사 | 배선 구조, 이를 이용하는 박막 트랜지스터 기판 및 그제조 방법 |
KR100495924B1 (ko) | 2003-07-26 | 2005-06-16 | (주)인솔라텍 | 태양전지 흡수층의 제조 방법 |
JP4667051B2 (ja) * | 2004-01-29 | 2011-04-06 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
TWI299527B (en) * | 2006-04-11 | 2008-08-01 | Taiwan Tft Lcd Ass | A fabrication method of thin film for active layer by metal chalcogenide precursor solution |
-
2007
- 2007-03-09 KR KR1020070023589A patent/KR100809440B1/ko not_active IP Right Cessation
-
2008
- 2008-02-07 US US12/027,929 patent/US7851791B2/en not_active Expired - Fee Related
- 2008-03-10 JP JP2008059785A patent/JP5174495B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-03 US US12/938,833 patent/US8084295B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7851791B2 (en) | 2010-12-14 |
JP2008227498A (ja) | 2008-09-25 |
KR100809440B1 (ko) | 2008-03-05 |
US20080217610A1 (en) | 2008-09-11 |
US8084295B2 (en) | 2011-12-27 |
US20110045633A1 (en) | 2011-02-24 |
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