JP5167323B2 - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 180
- 238000010992 reflux Methods 0.000 claims description 2
- 238000002955 isolation Methods 0.000 description 85
- 239000010410 layer Substances 0.000 description 43
- 239000000758 substrate Substances 0.000 description 34
- 230000015556 catabolic process Effects 0.000 description 14
- 238000009413 insulation Methods 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 13
- 210000000746 body region Anatomy 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
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- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
すなわち、LIGBTとFWDは、図13に示されるように、全体として四角形状に一巡するように配置される。LIGBTが四角形の角部を含んでいると(図13に示される例では2箇所存在する)、その角部において電流集中が生じる。つまり、角部において、コレクタ部の面積がエミッタ部の面積より小さくなるため、図15に示されるようにコレクタ部に電流集中が生じて短絡耐量が低下してしまう。図15は、LIGBTの角部で電流集中が生じている様子を示す図である。ここで、短絡耐量とは、半導体素子に高電圧大電流を印加した状態で、半導体素子が破壊されるまでの時間を指す。
相異なる種類の半導体素子を備えた半導体装置であって、
半導体層と、
上記半導体層の第1素子領域に配置されており、第1主電極と第2主電極を有し、当該第1主電極と当該第2主電極の間で電流が流れるように構成され、電流のスイッチングを行う第1種類の第1半導体素子と、
上記半導体層の第2素子領域に配置されており、第3主電極と第4主電極を有し、当該第3主電極と当該第4主電極の間で電流が流れるように構成され、還流を行う第2種類の第2半導体素子と、を備え、
上記第1素子領域と上記第2素子領域は、上記半導体層を平面視したときに、上記電流が流れる方向に対して直交する方向に隣接し、かつ、当該第1素子領域と当該第2素子領域を含む素子領域全体で一巡する形に形成され、
上記第1半導体素子の第1主電極と上記第2半導体素子の第3主電極が電気的に接続され、上記第1半導体素子の第2主電極と上記第2半導体素子の第4主電極が電気的に接続され、
前記半導体層を平面視したときに、前記第1素子領域の曲率は、前記第2素子領域の曲率よりも小さい、半導体装置である。
上記第1素子領域の曲率は、上記第1半導体素子に上記過大電流が流れたときに、上記第1主電極と上記第2主電極の間で電流集中が生じない、もしくは、生じにくい曲率であることを特徴とする。
上記第2素子領域に代えて上記第1素子領域に配置された上記第2半導体素子を上記第1半導体素子で両側から挟むように、当該第1半導体素子と当該第2半導体素子を上記第1素子領域に交互に配置することを特徴とする。
上記一巡する形の素子領域は、少なくとも2回往復する形の部分を有することを特徴とする。
第2素子領域は、上記半導体層を平面視したときに円弧状部分であり、上記第1素子領域は、上記半導体層を平面視したときに直線状部分であることを特徴とする。
上記第1半導体素子と上記第2半導体素子は、それぞれ、LIGBTとFWDであることを特徴とする。
上記第1半導体素子と上記第2半導体素子は、それぞれ、LDMOSとFWDであることを特徴とする。
上記第1半導体素子と上記第2半導体素子は、それぞれ、LIGBTとLDMOSであることを特徴とする。
本発明に係る半導体装置の第1実施形態について、図面を参照しつつ説明する。
第1実施形態に係る半導体装置の構成について説明する前に、まず、当該半導体装置を備えたインバータ回路について説明する。
図9は、第2実施形態に係る半導体装置のレイアウトを示す平面図である。第1実施形態に係る半導体装置と共通する構成要素には共通の符号を付して、その説明を省略する。第2実施形態に係る半導体装置では、第1トレンチ絶縁分離部12と第2トレンチ絶縁分離部14で挟まれた素子領域16,18の一部が、SOI基板20を平面視したときに、少なくとも2回往復する形となっている(図示例では、y軸方向に沿って4回往復している)。換言すると、第1トレンチ絶縁分離部12で囲まれた半導体層26の一部52が、SOI基板20を平面視したときに、櫛歯状の形態を有している、ということもできる。このような形態を採用することにより、半導体層26に占める素子領域16,18の面積を大きくすることができ、実装面積を小さく抑えることができる。
図10は、第3実施形態に係る半導体装置のレイアウトを示す平面図である。第1実施形態に係る半導体装置と共通する構成要素には共通の符号を付して、その説明を省略する。第3実施形態に係る半導体装置では、第1トレンチ絶縁分離部12と第2トレンチ絶縁分離部14で挟まれた一巡する形の素子領域において、第2素子領域18に代えて第1素子領域16(図示例では直線状部分)に配置されたFWD(第2半導体素子)をLIGBT(第1半導体素子)で両側から挟むように、当該LIGBTと当該FWDが第1素子領域16に交互に配置されている。図示例では、各直線状部分に、2つのLIGBTと1つのFWDが配置されている。なお、曲率が相対的に小さい部分においてLIGBT(第1半導体素子)でFWD(第2半導体素子)を両側から挟むようにしていれば、LIGBTおよびFWDの数は特に限定されるものではない。
12 第1トレンチ絶縁分離部
13 第3トレンチ絶縁分離部
14 第2トレンチ絶縁分離部
16 第1素子領域
18 第2素子領域
20 SOI基板
22 半導体支持層
24 埋込み絶縁層
26 半導体層
42 コレクタ電極
142 カソード電極
48 エミッタ電極
148 アノード電極
Claims (7)
- 相異なる種類の半導体素子を備えた半導体装置であって、
半導体層と、
前記半導体層の第1素子領域に配置されており、第1主電極と第2主電極を有し、当該第1主電極と当該第2主電極の間で電流が流れるように構成され、電流のスイッチングを行う第1種類の第1半導体素子と、
前記半導体層の第2素子領域に配置されており、第3主電極と第4主電極を有し、当該第3主電極と当該第4主電極の間で電流が流れるように構成され、還流ダイオードからなる第2種類の第2半導体素子と、を備え、
前記第1素子領域と前記第2素子領域は、前記半導体層を平面視したときに、前記電流が流れる方向に対して直交する方向に隣接し、かつ、当該第1素子領域と当該第2素子領域を含む素子領域全体で、曲率を有する角部と前記半導体層を平面視したときに前記角部よりも曲率の小さい領域とからなるように一巡する形に形成され、
前記第1半導体素子の第1主電極と前記第2半導体素子の第3主電極が電気的に接続され、前記第1半導体素子の第2主電極と前記第2半導体素子の第4主電極が電気的に接続され、
前記角部は前記第2素子領域であり、前記半導体層を平面視したときに、前記第1素子領域は前記角部よりも曲率の小さい領域に形成されている、半導体装置。 - 前記第1素子領域は、前記半導体層を平面視したときに直線状部分であることを特徴とする請求項1に記載の半導体装置。
- 前記角部よりも曲率の小さい領域において、前記第2半導体素子を前記第1半導体素子で両側から挟むように、当該第1半導体素子と当該第2半導体素子を交互に配置することを特徴とする請求項1または2に記載の半導体装置。
- 前記一巡する形の素子領域は、少なくとも2回往復する形の部分を有することを特徴とする請求項1乃至3いずれか1項に記載の半導体装置。
- 前記第2素子領域は、前記半導体層を平面視したときに円弧状部分であることを特徴とする請求項1乃至4いずれか1項に記載の半導体装置。
- 前記第1半導体素子は、LIGBTであることを特徴とする請求項1乃至5いずれか1項に記載の半導体装置。
- 前記第1半導体素子は、LDMOSであることを特徴とする請求項1乃至5いずれか1項に記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010221534A JP5167323B2 (ja) | 2010-09-30 | 2010-09-30 | 半導体装置 |
PCT/IB2011/002361 WO2012042370A1 (en) | 2010-09-30 | 2011-09-26 | Semiconductor device |
US13/876,170 US9048107B2 (en) | 2010-09-30 | 2011-09-26 | Semiconductor device |
EP11776243.5A EP2622640A1 (en) | 2010-09-30 | 2011-09-26 | Semiconductor device |
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JP2010221534A JP5167323B2 (ja) | 2010-09-30 | 2010-09-30 | 半導体装置 |
Publications (2)
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JP2012079799A JP2012079799A (ja) | 2012-04-19 |
JP5167323B2 true JP5167323B2 (ja) | 2013-03-21 |
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JP2010221534A Expired - Fee Related JP5167323B2 (ja) | 2010-09-30 | 2010-09-30 | 半導体装置 |
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US (1) | US9048107B2 (ja) |
EP (1) | EP2622640A1 (ja) |
JP (1) | JP5167323B2 (ja) |
WO (1) | WO2012042370A1 (ja) |
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US9269765B2 (en) * | 2013-10-21 | 2016-02-23 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device having gate wire disposed on roughened field insulating film |
JP6233012B2 (ja) * | 2013-12-26 | 2017-11-22 | サンケン電気株式会社 | 半導体装置 |
CN105789298B (zh) * | 2014-12-19 | 2019-06-07 | 无锡华润上华科技有限公司 | 横向绝缘栅双极型晶体管及其制造方法 |
US20160247879A1 (en) | 2015-02-23 | 2016-08-25 | Polar Semiconductor, Llc | Trench semiconductor device layout configurations |
JP6633861B2 (ja) * | 2015-07-31 | 2020-01-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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JP2654268B2 (ja) | 1991-05-13 | 1997-09-17 | 株式会社東芝 | 半導体装置の使用方法 |
JP3237555B2 (ja) | 1997-01-09 | 2001-12-10 | 富士電機株式会社 | 半導体装置 |
DE19725091B4 (de) * | 1997-06-13 | 2004-09-02 | Robert Bosch Gmbh | Laterales Transistorbauelement und Verfahren zu seiner Herstellung |
US6133591A (en) * | 1998-07-24 | 2000-10-17 | Philips Electronics North America Corporation | Silicon-on-insulator (SOI) hybrid transistor device structure |
WO2000060670A2 (de) * | 1999-03-31 | 2000-10-12 | Siced Electronics Development Gmbh & Co. Kg | Integrierte halbleitervorrichtung mit einem lateralen leistungselement |
US6794719B2 (en) * | 2001-06-28 | 2004-09-21 | Koninklijke Philips Electronics N.V. | HV-SOI LDMOS device with integrated diode to improve reliability and avalanche ruggedness |
JP2005064472A (ja) * | 2003-07-25 | 2005-03-10 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
JP4815885B2 (ja) * | 2005-06-09 | 2011-11-16 | トヨタ自動車株式会社 | 半導体装置の制御方法 |
JP5151087B2 (ja) * | 2005-11-01 | 2013-02-27 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP4836978B2 (ja) | 2008-03-03 | 2011-12-14 | シチズンマシナリーミヤノ株式会社 | ロックナット及びロックナットを備えた工作機械 |
JP2011061051A (ja) * | 2009-09-11 | 2011-03-24 | Toyota Motor Corp | 半導体装置 |
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2011
- 2011-09-26 WO PCT/IB2011/002361 patent/WO2012042370A1/en active Application Filing
- 2011-09-26 US US13/876,170 patent/US9048107B2/en not_active Expired - Fee Related
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JP2012079799A (ja) | 2012-04-19 |
WO2012042370A1 (en) | 2012-04-05 |
US20130181252A1 (en) | 2013-07-18 |
EP2622640A1 (en) | 2013-08-07 |
US9048107B2 (en) | 2015-06-02 |
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