JP5149178B2 - 熱放散が高められたパッケージ化集積回路 - Google Patents
熱放散が高められたパッケージ化集積回路 Download PDFInfo
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- JP5149178B2 JP5149178B2 JP2008524065A JP2008524065A JP5149178B2 JP 5149178 B2 JP5149178 B2 JP 5149178B2 JP 2008524065 A JP2008524065 A JP 2008524065A JP 2008524065 A JP2008524065 A JP 2008524065A JP 5149178 B2 JP5149178 B2 JP 5149178B2
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Description
当業者であれば理解されるであろうが、図中の要素は、簡素かつ明瞭に示されており、必ずしも寸法比率が等しいものではない。たとえば、本発明の実施形態の理解が容易になるように、図中のいくつかの要素の寸法は、他の要素に対して誇張されている場合がある。
Claims (19)
- パッケージ化された集積回路であって、
基板の上に設けられた半導体ダイであって、アクティブな回路の上に設けられた複数のサーマルボンドパッドを備える半導体ダイと、
複数のサーマルボンドワイヤであって、それぞれが、複数のサーマルボンドパッドの少なくとも1つに接続され、半導体ダイから上方に延びて半導体ダイの周辺部を越えて延びることなく終端する、複数のサーマルボンドワイヤと、
半導体ダイ、複数のサーマルボンドパッド、および複数のサーマルボンドワイヤを包囲する封入材であって、複数のサーマルボンドワイヤは、熱を半導体ダイから封入材の上面へ伝える、前記封入材と
を備え、前記複数のサーマルボンドワイヤのうちの少なくとも1つは、前記複数のサーマルボンドパッドの1つから垂直に延びて前記封入材の上面に至り、屈曲して一部が前記封入材の上面に沿って延び、前記複数のサーマルボンドパッドの1つに垂直に接続されるように屈曲している、パッケージ化された集積回路。 - 複数のサーマルボンドワイヤのうちの1つまたは複数が封入材の上面まで延びる、請求項1に記載のパッケージ化された集積回路。
- 複数のサーマルボンドワイヤのうちの少なくとも1つは、2つのサーマルボンドパッドのうち第1のサーマルボンドパッドから半導体ダイの表面から離れるように延びて、2つのサーマルボンドパッドのうち第2のサーマルボンドパッドに接続するように半導体ダイの表面に向かって戻ることによって、2つのサーマルボンドパッドに接続される、請求項1に記載のパッケージ化された集積回路。
- 複数のサーマルボンドワイヤのうちの少なくとも1つからの熱を伝え、その熱をパッケージ化された集積回路から放射するために、複数のサーマルボンドワイヤのうちの少なくとも1つの上に設けられた少なくとも1つの熱拡散部をさらに含む、請求項1に記載のパッケージ化された集積回路。
- 複数のサーマルボンドワイヤのうちの少なくとも1つが、少なくとも1つの熱拡散部に接続されて、半導体ダイの上に設けられた電力導体またはグラウンド導体として機能する、請求項4に記載のパッケージ化された集積回路。
- 複数のサーマルボンドパッドの一部が、半導体ダイ内のアクティブな回路の何れにも接続されない、請求項1に記載のパッケージ化された集積回路。
- 複数のサーマルボンドパッドのすべてが、半導体ダイ内のアクティブな回路の何れにも接続されない、請求項1に記載のパッケージ化された集積回路。
- 複数のサーマルボンドパッドのうちの少なくとも1つは、アクティブな回路内の電力またはグラウンド端子に接続される、請求項1に記載のパッケージ化された集積回路。
- 半導体ダイの周辺部に位置する複数のアクティブなボンドパッドであって、半導体ダイの周辺部の外側に設けられた各パッケージボンドパッドに電気的に接続される前記複数のアクティブなボンドパッドをさらに含む、請求項1に記載のパッケージ化された集積回路。
- パッケージ化された集積回路であって、
基板の上に設けられた半導体ダイと、
半導体ダイの上に設けられた、電気的な機能が付随する複数のアクティブなボンドパッドおよび電気的な機能が付随しない複数のサーマルボンドパッドと、
複数のサーマルボンドパッドのそれぞれに接続される1つまたは複数の熱伝導体であって、複数の熱伝導体のそれぞれは半導体ダイから上方に延びている、前記複数の熱伝導体と、
半導体ダイ、複数のサーマルボンドパッド、複数のアクティブなボンドパッド、および1つまたは複数の熱伝導体を包囲する封入材と
を備え、前記熱伝導体は、前記封入材よりも高い熱伝導性を有し、熱を半導体ダイから封入材の上面へ伝え、
前記1つまたは複数の熱伝導体のうちの少なくとも1つは、前記複数のサーマルボンドパッドの1つから垂直に延びて前記封入材の上面に至り、屈曲して一部が前記封入材の上面に沿って延び、前記複数のサーマルボンドパッドの1つに垂直に接続されるように屈曲しているサーマルボンドワイヤを含む、パッケージ化された集積回路。 - 1つまたは複数の熱伝導体が、複数のスタッドバンプまたは複数のサーマルボンドワイヤをさらに含む、請求項10に記載のパッケージ化された集積回路。
- 1つまたは複数の熱伝導体のうちの少なくとも1つがサーマルボンドワイヤを備え、サーマルボンドワイヤは、複数のサーマルボンドパッドのうち第1のサーマルボンドパッドから半導体ダイから離れるように延びて、複数のサーマルボンドパッドのうち第2のサーマルボンドパッドに接続するように半導体ダイに向かって戻る、請求項10に記載のパッケージ化された集積回路。
- 1つまたは複数の熱伝導体からの熱を伝えるために、1つまたは複数の熱伝導体のうちの少なくとも1つの上に設けられた少なくとも1つの熱拡散部をさらに含む、請求項10に記載のパッケージ化された集積回路。
- 熱拡散部は、電源電圧またはグラウンド基準電位を伝えるための信号導体であり、熱拡散部は、1つまたは複数の熱伝導体のうちの1つまたは複数と電気的に接触する、請求項13に記載のパッケージ化された集積回路。
- 複数のアクティブなボンドパッドは、パッケージ化された集積回路の周辺領域内に配置され、複数のサーマルボンドパッドは、パッケージ化された集積回路の中央領域内に配置され、1つまたは複数の熱伝導体は、半導体ダイの周辺縁を越えては延びない、請求項10に記載のパッケージ化された集積回路。
- 集積回路をパッケージングする方法であって、
電気的な機能が付随する複数のアクティブなボンドパッドと複数のサーマルボンドパッドとを備える半導体ダイを提供することであって、複数のサーマルボンドパッドを半導体ダイの内側領域内に配置することを含む、前記半導体ダイを提供すること、
基板の上に前記半導体ダイを配置すること、
1つまたは複数の熱伝導体を複数のサーマルボンドパッドのそれぞれに接続することであって、1つまたは複数の熱伝導体のそれぞれは、半導体ダイから上方に延び、かつ半導体ダイの周辺縁を越えては延びず、前記接続することは、
1つまたは複数の熱伝導体のうちの少なくとも1つを、ループを形成し複数のサーマルボンドパッドのうちの1つまたは複数と接触するサーマルボンドワイヤとして提供すること
を含む、前記接続すること、
半導体ダイ、複数のサーマルボンドパッド、複数のアクティブなボンドパッド、および1つまたは複数の熱伝導体を封入材で包囲して、熱伝導体が熱を半導体ダイから封入材の上面へ伝えることができるようにすること
を含み、前記1つまたは複数の熱伝導体は、前記封入材よりも高い熱伝導性を有し、
前記ループを形成し複数のサーマルボンドパッドのうちの1つまたは複数と接触するサーマルボンドワイヤは、前記複数のサーマルボンドパッドのうちの1つから垂直に延びて前記封入材の上面に至り、屈曲して一部が前記封入材の上面に沿って延び、前記複数のサーマルボンドパッドの1つに垂直に接続されるように屈曲している、方法。 - 半導体ダイ、複数のサーマルボンドパッド、複数のアクティブなボンドパッド、および1つまたは複数の熱伝導体を封入材で包囲した後、1つまたは複数の熱伝導体からの熱を伝えるために、1つまたは複数の熱伝導体の上に設けられた少なくとも1つの熱拡散部を提供することをさらに含む、請求項16に記載の方法。
- 半導体ダイ、複数のサーマルボンドパッド、複数のアクティブなボンドパッド、および1つまたは複数の熱伝導体を封入材で包囲した後、1つまたは複数の熱伝導体のうちの少なくとも1つを介して半導体ダイに対して電源電圧を伝えるかまたはグラウンド基準電位を与えるための信号導体として用いるために、熱拡散部を1つまたは複数の熱伝導体のうちの少なくとも1つに結合することをさらに含む、請求項16に記載の方法。
- 前記半導体ダイを提供することは、
複数のアクティブなボンドパッドのうちの少なくとも1つを半導体ダイの中央領域内に配置すること、
複数のアクティブなボンドパッドのうちの残りを半導体ダイの周辺領域内に配置すること
を含む、請求項16に記載の方法。
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WO2007016088A2 (en) | 2007-02-08 |
US20080136016A1 (en) | 2008-06-12 |
CN101548377A (zh) | 2009-09-30 |
TWI441290B (zh) | 2014-06-11 |
US7572680B2 (en) | 2009-08-11 |
EP1913633B1 (en) | 2018-11-14 |
US20070023880A1 (en) | 2007-02-01 |
WO2007016088A3 (en) | 2009-04-30 |
JP2009503865A (ja) | 2009-01-29 |
TW200707682A (en) | 2007-02-16 |
EP1913633A2 (en) | 2008-04-23 |
EP1913633A4 (en) | 2010-04-14 |
CN101548377B (zh) | 2011-03-09 |
KR20080044235A (ko) | 2008-05-20 |
US7355289B2 (en) | 2008-04-08 |
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