JP5130197B2 - 半導体装置、インターポーザ、及びそれらの製造方法、並びに半導体パッケージ - Google Patents

半導体装置、インターポーザ、及びそれらの製造方法、並びに半導体パッケージ Download PDF

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JP5130197B2
JP5130197B2 JP2008328257A JP2008328257A JP5130197B2 JP 5130197 B2 JP5130197 B2 JP 5130197B2 JP 2008328257 A JP2008328257 A JP 2008328257A JP 2008328257 A JP2008328257 A JP 2008328257A JP 5130197 B2 JP5130197 B2 JP 5130197B2
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resist film
forming
opening
electrode
semiconductor chip
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JP2010153492A5 (enExample
JP2010153492A (ja
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裕一 田口
光敏 東
晶紀 白石
秀明 坂口
昌宏 春原
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008328257A priority Critical patent/JP5130197B2/ja
Priority to US12/644,390 priority patent/US8304862B2/en
Publication of JP2010153492A publication Critical patent/JP2010153492A/ja
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