JP5122192B2 - 半導体素子実装装置 - Google Patents

半導体素子実装装置 Download PDF

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Publication number
JP5122192B2
JP5122192B2 JP2007176209A JP2007176209A JP5122192B2 JP 5122192 B2 JP5122192 B2 JP 5122192B2 JP 2007176209 A JP2007176209 A JP 2007176209A JP 2007176209 A JP2007176209 A JP 2007176209A JP 5122192 B2 JP5122192 B2 JP 5122192B2
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JP
Japan
Prior art keywords
semiconductor element
elastomer
heating
pressing
mounting apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007176209A
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English (en)
Japanese (ja)
Other versions
JP2009016544A5 (enrdf_load_stackoverflow
JP2009016544A (ja
Inventor
一博 登
善広 戸村
雄一郎 山田
鉄平 岩瀬
謙太郎 熊澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2007176209A priority Critical patent/JP5122192B2/ja
Publication of JP2009016544A publication Critical patent/JP2009016544A/ja
Publication of JP2009016544A5 publication Critical patent/JP2009016544A5/ja
Application granted granted Critical
Publication of JP5122192B2 publication Critical patent/JP5122192B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
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    • H01L2224/75315—Elastomer inlay
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    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
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    • H01L2224/75316—Elastomer inlay with retaining mechanisms
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    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
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    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
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    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
JP2007176209A 2007-07-04 2007-07-04 半導体素子実装装置 Expired - Fee Related JP5122192B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007176209A JP5122192B2 (ja) 2007-07-04 2007-07-04 半導体素子実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007176209A JP5122192B2 (ja) 2007-07-04 2007-07-04 半導体素子実装装置

Publications (3)

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JP2009016544A JP2009016544A (ja) 2009-01-22
JP2009016544A5 JP2009016544A5 (enrdf_load_stackoverflow) 2010-08-05
JP5122192B2 true JP5122192B2 (ja) 2013-01-16

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Families Citing this family (7)

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Publication number Priority date Publication date Assignee Title
WO2009128206A1 (ja) * 2008-04-18 2009-10-22 パナソニック株式会社 フリップチップ実装方法とフリップチップ実装装置およびそれに使用されるツール保護シート
JP6043058B2 (ja) * 2011-11-07 2016-12-14 デクセリアルズ株式会社 接続装置、接続構造体の製造方法、チップスタック部品の製造方法及び電子部品の実装方法
KR101345037B1 (ko) * 2012-08-23 2013-12-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 제조 장치 및 그 방법
JP6591426B2 (ja) * 2014-08-25 2019-10-16 東レエンジニアリング株式会社 実装用ヘッドおよびそれを用いた実装装置
WO2022013995A1 (ja) * 2020-07-16 2022-01-20 株式会社新川 実装装置
JP7569247B2 (ja) 2021-03-12 2024-10-17 キオクシア株式会社 半導体製造装置
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices

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Publication number Priority date Publication date Assignee Title
JP4684502B2 (ja) * 2001-09-27 2011-05-18 日東電工株式会社 導電接続方法及びそれに用いる離型シート
JP2003258413A (ja) * 2002-03-06 2003-09-12 Nikkiso Co Ltd 回路素子の実装装置および実装方法
JP3921459B2 (ja) * 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置
EP1845556A4 (en) * 2005-02-02 2010-02-10 Sony Chem & Inf Device Corp ATTACHING DEVICE FOR ELECTRICAL COMPONENTS
JP4619209B2 (ja) * 2005-06-28 2011-01-26 パナソニック株式会社 半導体素子実装方法および半導体素子実装装置

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