JP5114854B2 - 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 - Google Patents

熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 Download PDF

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Publication number
JP5114854B2
JP5114854B2 JP2006068846A JP2006068846A JP5114854B2 JP 5114854 B2 JP5114854 B2 JP 5114854B2 JP 2006068846 A JP2006068846 A JP 2006068846A JP 2006068846 A JP2006068846 A JP 2006068846A JP 5114854 B2 JP5114854 B2 JP 5114854B2
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group
bis
thermosetting resin
epoxy
general formula
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JP2006068846A
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Japanese (ja)
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JP2006312716A (ja
JP2006312716A5 (https=
Inventor
博子 三井
竜一郎 谷口
充史 諏訪
宏之 仁王
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Toray Industries Inc
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Toray Industries Inc
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Liquid Crystal (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
JP2006068846A 2005-04-05 2006-03-14 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 Expired - Fee Related JP5114854B2 (ja)

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JP2006068846A JP5114854B2 (ja) 2005-04-05 2006-03-14 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005108300 2005-04-05
JP2005108300 2005-04-05
JP2006068846A JP5114854B2 (ja) 2005-04-05 2006-03-14 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品

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JP2006312716A JP2006312716A (ja) 2006-11-16
JP2006312716A5 JP2006312716A5 (https=) 2009-04-09
JP5114854B2 true JP5114854B2 (ja) 2013-01-09

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5293598B2 (ja) * 2007-04-10 2013-09-18 住友ベークライト株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板および半導体装置
JP2010132793A (ja) * 2008-12-05 2010-06-17 Toray Ind Inc 熱硬化性樹脂組成物、それを用いたアンダーフィル剤および半導体装置
US9529120B2 (en) 2011-08-11 2016-12-27 Canon Kabushiki Kaisha Light-shielding coating, light-shielding film, and optical element
CN103073993B (zh) * 2013-02-05 2016-08-31 哈尔滨理工大学 H级聚酰亚胺-环氧浸渍漆
US10723900B2 (en) 2014-10-21 2020-07-28 Lg Chem, Ltd. UV curable ink for inkjet, method for manufacturing a bezel using the same, a bezel pattern using the same method and display panel comprising the bezel pattern
KR101703166B1 (ko) * 2014-10-21 2017-02-06 주식회사 엘지화학 잉크젯용 자외선 경화성 잉크, 이를 이용한 베젤의 제조방법, 이에 따라 제조한 배젤 패턴 및 이를 포함하는 디스플레이 기판
KR102143261B1 (ko) * 2016-04-01 2020-08-10 주식회사 엘지화학 잉크 조성물, 이로 제조된 경화 패턴, 이를 포함하는 발열체 및 이의 제조방법
WO2020066601A1 (ja) * 2018-09-28 2020-04-02 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品
CN118613525A (zh) * 2022-02-24 2024-09-06 东丽株式会社 树脂组合物、树脂组合物被膜、树脂组合物膜、固化膜及使用了它们的半导体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514772B1 (fr) * 1981-10-19 1985-09-06 Inst Francais Du Petrole Compositions reactives de polyimides thermostables presentant une solubilite elevee et leurs utilisations
US4820779A (en) * 1986-07-01 1989-04-11 National Starch And Chemical Corporation Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JP5019874B2 (ja) * 2004-04-19 2012-09-05 株式会社カネカ 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板

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