JP2006312716A5 - - Google Patents
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- Publication number
- JP2006312716A5 JP2006312716A5 JP2006068846A JP2006068846A JP2006312716A5 JP 2006312716 A5 JP2006312716 A5 JP 2006312716A5 JP 2006068846 A JP2006068846 A JP 2006068846A JP 2006068846 A JP2006068846 A JP 2006068846A JP 2006312716 A5 JP2006312716 A5 JP 2006312716A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- oxetane
- resin composition
- thermosetting resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000000962 organic group Chemical group 0.000 claims description 16
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 125000003566 oxetanyl group Chemical group 0.000 claims description 8
- -1 oxetane compound Chemical class 0.000 claims description 5
- 229920006015 heat resistant resin Polymers 0.000 claims description 3
- 125000001033 ether group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 2
- 125000000101 thioether group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 4
- 229920001721 polyimide Polymers 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006068846A JP5114854B2 (ja) | 2005-04-05 | 2006-03-14 | 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005108300 | 2005-04-05 | ||
| JP2005108300 | 2005-04-05 | ||
| JP2006068846A JP5114854B2 (ja) | 2005-04-05 | 2006-03-14 | 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006312716A JP2006312716A (ja) | 2006-11-16 |
| JP2006312716A5 true JP2006312716A5 (https=) | 2009-04-09 |
| JP5114854B2 JP5114854B2 (ja) | 2013-01-09 |
Family
ID=37534330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006068846A Expired - Fee Related JP5114854B2 (ja) | 2005-04-05 | 2006-03-14 | 熱硬化性樹脂組成物、耐熱性樹脂の製造方法およびそれを用いた電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5114854B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5293598B2 (ja) * | 2007-04-10 | 2013-09-18 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグ、積層板、多層プリント配線板および半導体装置 |
| JP2010132793A (ja) * | 2008-12-05 | 2010-06-17 | Toray Ind Inc | 熱硬化性樹脂組成物、それを用いたアンダーフィル剤および半導体装置 |
| US9529120B2 (en) | 2011-08-11 | 2016-12-27 | Canon Kabushiki Kaisha | Light-shielding coating, light-shielding film, and optical element |
| CN103073993B (zh) * | 2013-02-05 | 2016-08-31 | 哈尔滨理工大学 | H级聚酰亚胺-环氧浸渍漆 |
| US10723900B2 (en) | 2014-10-21 | 2020-07-28 | Lg Chem, Ltd. | UV curable ink for inkjet, method for manufacturing a bezel using the same, a bezel pattern using the same method and display panel comprising the bezel pattern |
| KR101703166B1 (ko) * | 2014-10-21 | 2017-02-06 | 주식회사 엘지화학 | 잉크젯용 자외선 경화성 잉크, 이를 이용한 베젤의 제조방법, 이에 따라 제조한 배젤 패턴 및 이를 포함하는 디스플레이 기판 |
| KR102143261B1 (ko) * | 2016-04-01 | 2020-08-10 | 주식회사 엘지화학 | 잉크 조성물, 이로 제조된 경화 패턴, 이를 포함하는 발열체 및 이의 제조방법 |
| WO2020066601A1 (ja) * | 2018-09-28 | 2020-04-02 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板および電子部品 |
| CN118613525A (zh) * | 2022-02-24 | 2024-09-06 | 东丽株式会社 | 树脂组合物、树脂组合物被膜、树脂组合物膜、固化膜及使用了它们的半导体装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2514772B1 (fr) * | 1981-10-19 | 1985-09-06 | Inst Francais Du Petrole | Compositions reactives de polyimides thermostables presentant une solubilite elevee et leurs utilisations |
| US4820779A (en) * | 1986-07-01 | 1989-04-11 | National Starch And Chemical Corporation | Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide |
| JP3221756B2 (ja) * | 1992-12-28 | 2001-10-22 | 新日鐵化学株式会社 | プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法 |
| JP5019874B2 (ja) * | 2004-04-19 | 2012-09-05 | 株式会社カネカ | 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板 |
-
2006
- 2006-03-14 JP JP2006068846A patent/JP5114854B2/ja not_active Expired - Fee Related
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