JP5108270B2 - 変調器およびレーザの集積化構造およびその製造方法 - Google Patents
変調器およびレーザの集積化構造およびその製造方法 Download PDFInfo
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- JP5108270B2 JP5108270B2 JP2006261779A JP2006261779A JP5108270B2 JP 5108270 B2 JP5108270 B2 JP 5108270B2 JP 2006261779 A JP2006261779 A JP 2006261779A JP 2006261779 A JP2006261779 A JP 2006261779A JP 5108270 B2 JP5108270 B2 JP 5108270B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2077—Methods of obtaining the confinement using lateral bandgap control during growth, e.g. selective growth, mask induced
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2222—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties
- H01S5/2224—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special electric properties semi-insulating semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
- H01S5/2272—Buried mesa structure ; Striped active layer grown by a mask induced selective growth
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Description
−リッジ構造および金属パッド配置36を含むレーザ(DFB)区分6、
−リッジ構造および金属パッド配置38を含む変調器(EAM)区分8、
−図2に示すストリップ状マスクパターン対の一方の外側の位置に実質的に対応するレーザ(DFB)パッド36、および
−図2のアイランドパターンの位置に実質的に対応する変調器(EAM)パッド38である。
8 変調器
14 半絶縁層
36、38、40 コンタクトパッド
42 誘電体層
44 絶縁領域
Claims (13)
- 分布帰還型(DFB)レーザ構造と、当該DFBレーザ構造と集積化された電界吸収型変調器(EAM)構造とを含む集積化装置であって、
基板層、
前記基板層上に設けられたバッファ層、
前記バッファ層上に設けられた多重量子井戸(MQW)層、
前記MQW層によって側面が取り囲まれており、少なくとも半絶縁材料を含む、局在化されたEAMアイランド領域、及び
前記局在化されたEAMアイランド領域と整列され、中心決めされるよう前記EAMアイランド領域の上に位置決めされているEAMコンタクトパッド
を備えている前記電界吸収型変調器と、
前記DFBレーザ構造が備えているDFBレーザコンタクトパッドと前記EAMコンタクトパッドとの間に介在する絶縁領域と
を備えている、装置。 - 前記DFB構造が、
前記基板層、
前記バッファ層、及び
前記MQW層、
をさらに備えている、請求項1に記載の装置。 - 前記EAM構造が、前記MQW層上に、少なくともクラッド層及びコンタクト層を含む、請求項1又は2に記載の装置。
- 前記EAMアイランド領域が、Fe−InP層である、請求項1から3のいずれか1項に記載の装置。
- 前記EAMコンタクトパッドと前記EAMアイランド領域との間に介在させた少なくとも1つの誘電体フィルムを備えている、請求項1から4のいずれか1項に記載の装置。
- 垂直サイドウォールリッジ構造の形態をとる導波路を有する、請求項1から5のいずれか1項に記載の装置。
- 逆リッジ構造の形態をとる導波路を有する、請求項1から5のいずれか1項に記載の装置。
- 分布帰還型(DFB)レーザ構造と、当該DFBレーザ構造と集積化された電界吸収型変調器(EAM)構造とを含む集積化装置を製造する方法であって、
前記分布帰還型(DFB)レーザ構造を形成し、
前記電界吸収型変調器(EAM)構造を形成し、当該電界吸収型変調器(EAM)構造が、
基板層、
前記基板層上に設けられたバッファ層、
前記バッファ層上に設けられた多重量子井戸(MQW)層、
前記MQW層によって側面が取り囲まれており、少なくとも半絶縁材料を含む、局在化されたEAMアイランド領域、並びに
前記局在化されたEAMアイランド領域と整列され、中心決めされるよう前記EAMアイランド領域の上に位置決めされているEAMコンタクトパッド、
を備えており、
前記DFBレーザ構造が備えているDFBレーザコンタクトパッドと前記EAMコンタクトパッドとの間に介在する絶縁領域を形成することを含む、方法。 - 前記EAM構造が、前記MQW層上に、少なくともクラッド層及びコンタクト層を含む、請求項8に記載の装置。
- 前記EAMアイランド領域がFe−InP層の形態である、請求項8又は9に記載の方法。
- 前記EAMコンタクトパッドと前記EAMアイランド領域との間に少なくとも1つの誘電体フィルムが介在している、請求項8から10のいずれか1項に記載の方法。
- 前記集積化装置の導波路を、垂直サイドウォールリッジ構造の形態で形成することを含む、請求項8から11のいずれか1項に記載の方法。
- 前記集積化装置の導波路を、逆リッジ構造の形態で形成することを含む、請求項8から11のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0519628.2 | 2005-09-27 | ||
GB0519628A GB2430548B (en) | 2005-09-27 | 2005-09-27 | An integrated modulator-laser structure and a method of producing same |
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JP2007096317A JP2007096317A (ja) | 2007-04-12 |
JP5108270B2 true JP5108270B2 (ja) | 2012-12-26 |
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JP2006261779A Expired - Fee Related JP5108270B2 (ja) | 2005-09-27 | 2006-09-27 | 変調器およびレーザの集積化構造およびその製造方法 |
Country Status (4)
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US (1) | US7564885B2 (ja) |
JP (1) | JP5108270B2 (ja) |
CN (2) | CN1956282A (ja) |
GB (1) | GB2430548B (ja) |
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US7539228B2 (en) * | 2007-06-26 | 2009-05-26 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Integrated photonic semiconductor devices having ridge structures that are grown rather than etched, and methods for making same |
EP2252469B1 (en) | 2008-03-11 | 2012-10-24 | Rolic Ltd. | Optical biometric security element |
JP2014007295A (ja) * | 2012-06-25 | 2014-01-16 | Mitsubishi Electric Corp | 光半導体装置及びその製造方法 |
CN107306009B (zh) * | 2016-04-25 | 2021-04-13 | 住友电工光电子器件创新株式会社 | 在承载体上提供共面线的光发射器 |
Family Cites Families (20)
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---|---|---|---|---|
US4575919A (en) | 1984-05-24 | 1986-03-18 | At&T Bell Laboratories | Method of making heteroepitaxial ridge overgrown laser |
JPH02244690A (ja) * | 1989-03-16 | 1990-09-28 | Oki Electric Ind Co Ltd | 半導体レーザ装置 |
US4872180A (en) | 1989-06-16 | 1989-10-03 | Gte Laboratories Incorporated | Method for reducing facet reflectivities of semiconductor light sources and device thereof |
JPH06112595A (ja) * | 1992-09-25 | 1994-04-22 | Nec Corp | 半導体光機能素子の製造方法 |
JP3266728B2 (ja) * | 1994-01-31 | 2002-03-18 | 株式会社日立製作所 | 導波路型光素子の製造方法 |
JP3386261B2 (ja) * | 1994-12-05 | 2003-03-17 | 三菱電機株式会社 | 光半導体装置、及びその製造方法 |
JPH0945999A (ja) * | 1995-07-31 | 1997-02-14 | Oki Electric Ind Co Ltd | 半導体デバイス及びその製造方法 |
JPH0964334A (ja) * | 1995-08-28 | 1997-03-07 | Toshiba Corp | 発光素子と外部変調器の集積素子 |
JPH1075009A (ja) * | 1996-08-30 | 1998-03-17 | Nec Corp | 光半導体装置とその製造方法 |
JP2924852B2 (ja) * | 1997-05-16 | 1999-07-26 | 日本電気株式会社 | 光半導体装置及びその製造方法 |
KR100424774B1 (ko) * | 1998-07-22 | 2004-05-17 | 삼성전자주식회사 | 선택영역회절격자형성과선택영역성장을위한마스크및이를이용한반도체소자의제조방법 |
JP3941296B2 (ja) * | 1999-09-20 | 2007-07-04 | 三菱電機株式会社 | 変調器と変調器付き半導体レーザ装置並びにその製造方法 |
JP2001148542A (ja) * | 1999-11-19 | 2001-05-29 | Nec Corp | 光半導体装置及びその製造方法並びに光通信装置 |
JP3339488B2 (ja) * | 2000-02-25 | 2002-10-28 | 日本電気株式会社 | 光半導体装置およびその製造方法 |
US6542533B1 (en) | 2000-04-10 | 2003-04-01 | Triquint Technology Holding Co | Process for obtaining ultra-low reflectivity facets for electro-absorption modulated lasers |
JP4105403B2 (ja) * | 2001-04-26 | 2008-06-25 | 日本オプネクスト株式会社 | 半導体光集積素子の製造方法 |
JP2003060311A (ja) * | 2001-08-21 | 2003-02-28 | Nippon Telegr & Teleph Corp <Ntt> | 半導体光素子及びその製造方法 |
JP4238508B2 (ja) * | 2001-09-28 | 2009-03-18 | 沖電気工業株式会社 | 光導波路型素子およびその製造方法 |
JP2004047743A (ja) * | 2002-07-12 | 2004-02-12 | Furukawa Electric Co Ltd:The | 光集積デバイス |
KR100594063B1 (ko) * | 2004-01-15 | 2006-06-30 | 삼성전자주식회사 | 반도체 광소자와 그를 이용한 반도체 광패키지 |
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2005
- 2005-09-27 GB GB0519628A patent/GB2430548B/en not_active Expired - Fee Related
-
2006
- 2006-09-27 CN CNA2006101278823A patent/CN1956282A/zh active Pending
- 2006-09-27 JP JP2006261779A patent/JP5108270B2/ja not_active Expired - Fee Related
- 2006-09-27 CN CN2012102606962A patent/CN102790352A/zh active Pending
- 2006-09-27 US US11/528,002 patent/US7564885B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US7564885B2 (en) | 2009-07-21 |
CN102790352A (zh) | 2012-11-21 |
US20070081566A1 (en) | 2007-04-12 |
CN1956282A (zh) | 2007-05-02 |
GB0519628D0 (en) | 2005-11-02 |
GB2430548A (en) | 2007-03-28 |
GB2430548B (en) | 2011-08-10 |
JP2007096317A (ja) | 2007-04-12 |
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