JP5106025B2 - 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 - Google Patents

表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 Download PDF

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Publication number
JP5106025B2
JP5106025B2 JP2007256745A JP2007256745A JP5106025B2 JP 5106025 B2 JP5106025 B2 JP 5106025B2 JP 2007256745 A JP2007256745 A JP 2007256745A JP 2007256745 A JP2007256745 A JP 2007256745A JP 5106025 B2 JP5106025 B2 JP 5106025B2
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Japan
Prior art keywords
group
polymer
substrate
metal film
polymer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007256745A
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English (en)
Japanese (ja)
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JP2009007662A (ja
JP2009007662A5 (enExample
Inventor
丈嘉 加納
秀雄 永▲崎▼
真隆 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2007256745A priority Critical patent/JP5106025B2/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to EP20090008260 priority patent/EP2105451B1/en
Priority to AT09008260T priority patent/ATE545665T1/de
Priority to US12/446,722 priority patent/US20100003533A1/en
Priority to CN2007800394054A priority patent/CN101528458B/zh
Priority to EP07830279.1A priority patent/EP2078607B1/en
Priority to PCT/JP2007/070545 priority patent/WO2008050715A1/ja
Priority to KR1020097001569A priority patent/KR101459515B1/ko
Priority to CN201310298307.XA priority patent/CN103588930B/zh
Publication of JP2009007662A publication Critical patent/JP2009007662A/ja
Priority to US12/433,034 priority patent/US8084564B2/en
Publication of JP2009007662A5 publication Critical patent/JP2009007662A5/ja
Application granted granted Critical
Publication of JP5106025B2 publication Critical patent/JP5106025B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2007256745A 2006-10-23 2007-09-28 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 Expired - Fee Related JP5106025B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2007256745A JP5106025B2 (ja) 2006-10-23 2007-09-28 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物
CN201310298307.XA CN103588930B (zh) 2006-10-23 2007-10-22 含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体
US12/446,722 US20100003533A1 (en) 2006-10-23 2007-10-22 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate
CN2007800394054A CN101528458B (zh) 2006-10-23 2007-10-22 表面金属膜材料及其制造方法、金属模型材料及其制造方法、聚合物层形成用组合物、含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体
EP07830279.1A EP2078607B1 (en) 2006-10-23 2007-10-22 Process for producing a metal film coated material, process for producing a metallic pattern bearing material and use of a composition for polymer layer formation
PCT/JP2007/070545 WO2008050715A1 (fr) 2006-10-23 2007-10-22 Matériau revêtu d'une pellicule métallique, et procédé pour sa fabrication, matériau portant un motif métallique et procédé pour sa fabrication, composition pour la formation d'une couche polymère, polymère de nitrile et procédé pour synthétiser ce
EP20090008260 EP2105451B1 (en) 2006-10-23 2007-10-22 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate
AT09008260T ATE545665T1 (de) 2006-10-23 2007-10-22 Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat
KR1020097001569A KR101459515B1 (ko) 2006-10-23 2007-10-22 표면 금속막 재료와 그 제작방법, 금속패턴 재료와 그 제작방법, 폴리머층 형성용 조성물, 니트릴기 함유 폴리머와 그 합성방법, 니트릴기 함유 폴리머를 사용한 조성물, 및 적층체
US12/433,034 US8084564B2 (en) 2006-10-23 2009-04-30 Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2006287930 2006-10-23
JP2006287930 2006-10-23
JP2007095760 2007-03-30
JP2007095760 2007-03-30
JP2007146198 2007-05-31
JP2007146198 2007-05-31
JP2007256745A JP5106025B2 (ja) 2006-10-23 2007-09-28 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物

Publications (3)

Publication Number Publication Date
JP2009007662A JP2009007662A (ja) 2009-01-15
JP2009007662A5 JP2009007662A5 (enExample) 2011-09-29
JP5106025B2 true JP5106025B2 (ja) 2012-12-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007256745A Expired - Fee Related JP5106025B2 (ja) 2006-10-23 2007-09-28 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物

Country Status (1)

Country Link
JP (1) JP5106025B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010239057A (ja) * 2009-03-31 2010-10-21 Fujifilm Corp 回路基板の作製方法
JP5819619B2 (ja) * 2010-03-19 2015-11-24 富士フイルム株式会社 インクジェットインク、表面金属膜材料及びその製造方法、金属パターン材料及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226259B2 (enExample) * 1973-02-10 1977-07-13
JPS5940846B2 (ja) * 1975-03-25 1984-10-03 関西ペイント株式会社 非水系不飽和樹脂組成物
JPS58196238A (ja) * 1982-05-13 1983-11-15 Toyo Ink Mfg Co Ltd 無電解メツキ方法
JPS62153340A (ja) * 1985-12-27 1987-07-08 Showa Highpolymer Co Ltd 硬化性組成物
JPH04259381A (ja) * 1991-02-14 1992-09-14 Nippon Chem Ind Co Ltd 表面改質した合成樹脂材料の製造方法
JPH07267897A (ja) * 1994-03-30 1995-10-17 Mitsubishi Rayon Co Ltd ヒドロキシアルキルモノ（メタ）アクリレートの精製方法
JP4096427B2 (ja) * 1998-11-30 2008-06-04 日本化成株式会社 ヒドロキシアルキルアクリレートの製造方法
JP4218851B2 (ja) * 1999-02-25 2009-02-04 大日本印刷株式会社 カラーフィルタ保護膜形成用感光性樹脂組成物
JP2006057059A (ja) * 2004-08-23 2006-03-02 Fuji Photo Film Co Ltd 表面導電性材料の製造方法

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