JP5106025B2 - 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 - Google Patents
表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 Download PDFInfo
- Publication number
- JP5106025B2 JP5106025B2 JP2007256745A JP2007256745A JP5106025B2 JP 5106025 B2 JP5106025 B2 JP 5106025B2 JP 2007256745 A JP2007256745 A JP 2007256745A JP 2007256745 A JP2007256745 A JP 2007256745A JP 5106025 B2 JP5106025 B2 JP 5106025B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- polymer
- substrate
- metal film
- polymer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007256745A JP5106025B2 (ja) | 2006-10-23 | 2007-09-28 | 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 |
AT09008260T ATE545665T1 (de) | 2006-10-23 | 2007-10-22 | Nitrilgruppen enthaltendes polymer und verfahren zu seiner synthetisierung, zusammensetzung mit nitrilgruppen enthaltendem polymer und laminat |
EP20090008260 EP2105451B1 (en) | 2006-10-23 | 2007-10-22 | Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate |
CN2007800394054A CN101528458B (zh) | 2006-10-23 | 2007-10-22 | 表面金属膜材料及其制造方法、金属模型材料及其制造方法、聚合物层形成用组合物、含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体 |
US12/446,722 US20100003533A1 (en) | 2006-10-23 | 2007-10-22 | Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate |
PCT/JP2007/070545 WO2008050715A1 (en) | 2006-10-23 | 2007-10-22 | Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile polymer and method of synthesizing the same, composition containing nitrile polymer, and layered product |
KR1020097001569A KR101459515B1 (ko) | 2006-10-23 | 2007-10-22 | 표면 금속막 재료와 그 제작방법, 금속패턴 재료와 그 제작방법, 폴리머층 형성용 조성물, 니트릴기 함유 폴리머와 그 합성방법, 니트릴기 함유 폴리머를 사용한 조성물, 및 적층체 |
EP07830279.1A EP2078607B1 (en) | 2006-10-23 | 2007-10-22 | Process for producing a metal film coated material, process for producing a metallic pattern bearing material and use of a composition for polymer layer formation |
CN201310298307.XA CN103588930B (zh) | 2006-10-23 | 2007-10-22 | 含有腈基的聚合物及其合成方法、使用含有腈基的聚合物的组合物及层压体 |
US12/433,034 US8084564B2 (en) | 2006-10-23 | 2009-04-30 | Metal-film-coated material and process for producing the same, metallic-pattern-bearing material and process for producing the same, composition for polymer layer formation, nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006287930 | 2006-10-23 | ||
JP2006287930 | 2006-10-23 | ||
JP2007095760 | 2007-03-30 | ||
JP2007095760 | 2007-03-30 | ||
JP2007146198 | 2007-05-31 | ||
JP2007146198 | 2007-05-31 | ||
JP2007256745A JP5106025B2 (ja) | 2006-10-23 | 2007-09-28 | 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009007662A JP2009007662A (ja) | 2009-01-15 |
JP2009007662A5 JP2009007662A5 (enrdf_load_stackoverflow) | 2011-09-29 |
JP5106025B2 true JP5106025B2 (ja) | 2012-12-26 |
Family
ID=40323031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007256745A Expired - Fee Related JP5106025B2 (ja) | 2006-10-23 | 2007-09-28 | 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、金属パターン材料、及びポリマー層形成用組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5106025B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010239057A (ja) * | 2009-03-31 | 2010-10-21 | Fujifilm Corp | 回路基板の作製方法 |
JP5819619B2 (ja) * | 2010-03-19 | 2015-11-24 | 富士フイルム株式会社 | インクジェットインク、表面金属膜材料及びその製造方法、金属パターン材料及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5226259B2 (enrdf_load_stackoverflow) * | 1973-02-10 | 1977-07-13 | ||
JPS5940846B2 (ja) * | 1975-03-25 | 1984-10-03 | 関西ペイント株式会社 | 非水系不飽和樹脂組成物 |
JPS58196238A (ja) * | 1982-05-13 | 1983-11-15 | Toyo Ink Mfg Co Ltd | 無電解メツキ方法 |
JPS62153340A (ja) * | 1985-12-27 | 1987-07-08 | Showa Highpolymer Co Ltd | 硬化性組成物 |
JPH04259381A (ja) * | 1991-02-14 | 1992-09-14 | Nippon Chem Ind Co Ltd | 表面改質した合成樹脂材料の製造方法 |
JPH07267897A (ja) * | 1994-03-30 | 1995-10-17 | Mitsubishi Rayon Co Ltd | ヒドロキシアルキルモノ(メタ)アクリレートの精製方法 |
JP4096427B2 (ja) * | 1998-11-30 | 2008-06-04 | 日本化成株式会社 | ヒドロキシアルキルアクリレートの製造方法 |
JP4218851B2 (ja) * | 1999-02-25 | 2009-02-04 | 大日本印刷株式会社 | カラーフィルタ保護膜形成用感光性樹脂組成物 |
JP2006057059A (ja) * | 2004-08-23 | 2006-03-02 | Fuji Photo Film Co Ltd | 表面導電性材料の製造方法 |
-
2007
- 2007-09-28 JP JP2007256745A patent/JP5106025B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2009007662A (ja) | 2009-01-15 |
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