JP5084175B2 - 微小構造体、およびその作製方法 - Google Patents

微小構造体、およびその作製方法 Download PDF

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Publication number
JP5084175B2
JP5084175B2 JP2006147338A JP2006147338A JP5084175B2 JP 5084175 B2 JP5084175 B2 JP 5084175B2 JP 2006147338 A JP2006147338 A JP 2006147338A JP 2006147338 A JP2006147338 A JP 2006147338A JP 5084175 B2 JP5084175 B2 JP 5084175B2
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layer
microstructure
structural
polycrystalline silicon
silicon
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JP2006147338A
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Japanese (ja)
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JP2007007845A (ja
JP2007007845A5 (https=
Inventor
真弓 山口
小波 泉
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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  • Micromachines (AREA)
  • Recrystallisation Techniques (AREA)
JP2006147338A 2005-05-31 2006-05-26 微小構造体、およびその作製方法 Expired - Fee Related JP5084175B2 (ja)

Priority Applications (1)

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JP2006147338A JP5084175B2 (ja) 2005-05-31 2006-05-26 微小構造体、およびその作製方法

Applications Claiming Priority (3)

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JP2005160608 2005-05-31
JP2005160608 2005-05-31
JP2006147338A JP5084175B2 (ja) 2005-05-31 2006-05-26 微小構造体、およびその作製方法

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JP2007007845A JP2007007845A (ja) 2007-01-18
JP2007007845A5 JP2007007845A5 (https=) 2009-05-07
JP5084175B2 true JP5084175B2 (ja) 2012-11-28

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1837304A3 (en) 2006-03-20 2012-04-18 Semiconductor Energy Laboratory Co., Ltd. Micromachine including a mechanical structure connected to an electrical circuit and method for manufacturing the same
US7642114B2 (en) 2006-07-19 2010-01-05 Semiconductor Energy Laboratory Co., Ltd. Micro electro mechanical device and manufacturing method thereof
DE102007022715A1 (de) * 2007-05-15 2008-07-10 Siemens Ag Presse

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2791858B2 (ja) * 1993-06-25 1998-08-27 株式会社半導体エネルギー研究所 半導体装置作製方法
JPH097946A (ja) * 1995-06-26 1997-01-10 Toyota Motor Corp 多結晶シリコン膜の製造方法
JPH09246569A (ja) * 1996-03-04 1997-09-19 Toyota Motor Corp シリコン構造体の製造方法とシリコン構造体およびシリコン構造体を備えた加速度センサ
JP3566809B2 (ja) * 1996-08-12 2004-09-15 株式会社豊田中央研究所 多結晶シリコン薄膜の製造方法および多結晶シリコン薄膜構造体素子
JPH1062447A (ja) * 1996-08-19 1998-03-06 Hitachi Ltd 半導体加速度センサおよびその製造方法
JPH10214978A (ja) * 1997-01-30 1998-08-11 Aisin Seiki Co Ltd 半導体マイクロマシン及びその製造方法
JP3592535B2 (ja) * 1998-07-16 2004-11-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6930364B2 (en) * 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US7128783B2 (en) * 2002-04-23 2006-10-31 Sharp Laboratories Of America, Inc. Thin-film crystal-structure-processed mechanical devices, and methods and systems for making
JP2004066606A (ja) * 2002-08-06 2004-03-04 Ricoh Co Ltd 液滴吐出ヘッド及びその製造方法並びにインクジェット記録装置
JP2004177357A (ja) * 2002-11-29 2004-06-24 Hitachi Metals Ltd 半導体加速度センサ
JP4114552B2 (ja) * 2003-06-10 2008-07-09 ソニー株式会社 マイクロマシンの製造方法
JP4519804B2 (ja) * 2005-05-27 2010-08-04 株式会社半導体エネルギー研究所 半導体装置の作製方法

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JP2007007845A (ja) 2007-01-18

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