JP5084148B2 - 放熱部材およびその製造方法 - Google Patents

放熱部材およびその製造方法 Download PDF

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Publication number
JP5084148B2
JP5084148B2 JP2006026166A JP2006026166A JP5084148B2 JP 5084148 B2 JP5084148 B2 JP 5084148B2 JP 2006026166 A JP2006026166 A JP 2006026166A JP 2006026166 A JP2006026166 A JP 2006026166A JP 5084148 B2 JP5084148 B2 JP 5084148B2
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liquid crystal
replaced
formula
oco
coo
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Japanese (ja)
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JP2006265527A5 (enrdf_load_stackoverflow
JP2006265527A (ja
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孝 加藤
光一 越智
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JNC Corp
JNC Petrochemical Corp
Kansai University
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JNC Corp
JNC Petrochemical Corp
Kansai University
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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2006026166A 2005-02-25 2006-02-02 放熱部材およびその製造方法 Active JP5084148B2 (ja)

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JP2005050505 2005-02-25
JP2006026166A JP5084148B2 (ja) 2005-02-25 2006-02-02 放熱部材およびその製造方法

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JP2006265527A JP2006265527A (ja) 2006-10-05
JP2006265527A5 JP2006265527A5 (enrdf_load_stackoverflow) 2009-05-14
JP5084148B2 true JP5084148B2 (ja) 2012-11-28

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017150587A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 低熱膨張部材用組成物、低熱膨張部材、電子機器、低熱膨張部材の製造方法
WO2017150588A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材用組成物の製造方法、放熱部材の製造方法
WO2017150589A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
CN108884190A (zh) * 2016-03-30 2018-11-23 株式会社大赛璐 热固化性化合物
WO2022092063A1 (ja) 2020-10-30 2022-05-05 Jnc株式会社 低誘電率樹脂形成用組成物、低誘電部材、及びそれを用いた電子機器

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US7785488B2 (en) * 2005-12-08 2010-08-31 Chisso Corporation Lateral oxirane compound and polymer thereof
US7919648B2 (en) 2005-12-08 2011-04-05 Chisso Corporation Lateral α-substituted acrylate compound and polymer thereof
JP5311725B2 (ja) * 2006-07-10 2013-10-09 株式会社Ａｄｅｋａ 重合性組成物
JP4923992B2 (ja) * 2006-12-05 2012-04-25 Ｊｎｃ株式会社 重合性液晶組成物および光学異方性薄膜
JP5020125B2 (ja) * 2008-03-10 2012-09-05 新神戸電機株式会社 積層板の製造法
JP2010196016A (ja) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp 樹脂組成物及び樹脂硬化物
JP2010196015A (ja) * 2009-02-27 2010-09-09 Mitsubishi Electric Corp 樹脂組成物及び樹脂硬化物
JP5468975B2 (ja) * 2010-04-26 2014-04-09 株式会社カネカ 高熱伝導性熱可塑性樹脂製ヒートシンク
JP6086884B2 (ja) * 2014-01-28 2017-03-01 富士フイルム株式会社 重合性化合物、ポリマー、重合性組成物、フィルム、および投映像表示用ハーフミラー
TWI658091B (zh) 2014-05-09 2019-05-01 日商捷恩智股份有限公司 放熱部材、電子機器
WO2016024516A1 (ja) * 2014-08-11 2016-02-18 株式会社アイ．エス．テイ エラストマーの熱伝導性改質剤、熱伝導性改質液晶性エラストマー、液晶性高分子およびその前駆体の使用方法、エラストマーの熱伝導性改質方法、ならびに発熱体および被加熱体
WO2016031888A1 (ja) 2014-08-27 2016-03-03 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
CN105505401B (zh) * 2016-02-26 2018-09-04 江苏和成新材料有限公司 聚合性液晶组合物及其应用
JP6590075B2 (ja) * 2016-09-09 2019-10-16 Dic株式会社 重合性液晶組成物、及び、それを用いた光学フィルム
US20200377795A1 (en) * 2017-08-10 2020-12-03 Sharp Kabushiki Kaisha Liquid crystal display device and method for producing liquid crystal display device
TW202020004A (zh) * 2018-08-31 2020-06-01 日商捷恩智股份有限公司 組成物、硬化物、積層體及電子機器
KR102171692B1 (ko) * 2019-01-30 2020-10-29 전북대학교산학협력단 메조겐의 상 분리 및 상전이 특성을 이용한 열 제어 유기소재
US20240084183A1 (en) * 2021-01-18 2024-03-14 Impressio Inc. Thermal circuits built in liquid crystal elastomers
KR102534225B1 (ko) * 2021-04-27 2023-05-17 경북대학교 산학협력단 복수의 액정 코어를 갖는 다작용기성 에폭시 화합물과 이로부터 제조된 경화물
JP2023035176A (ja) * 2021-08-31 2023-03-13 Jnc株式会社 重合体、低誘電基板用組成物、硬化物、及びそれを用いた電子機器
JP2023047892A (ja) * 2021-09-27 2023-04-06 Jnc株式会社 低誘電率樹脂形成用組成物、低誘電部材、及びそれを用いた電子機器
CN115160734A (zh) * 2022-08-09 2022-10-11 四川大学 一种高强高模席夫碱类环氧树脂及其碳纤维复合材料与用途
CN115181246A (zh) * 2022-08-09 2022-10-14 四川大学 一种高强高模环氧树脂及其合成方法与用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4309072B2 (ja) * 2000-03-13 2009-08-05 富士フイルム株式会社 重合性液晶化合物および光学異方性素子
JP2004175926A (ja) * 2002-11-27 2004-06-24 Polymatech Co Ltd 熱伝導性エポキシ樹脂成形体及びその製造方法
JP4180358B2 (ja) * 2002-11-28 2008-11-12 シャープ株式会社 液晶表示パネルの製造方法
JP3981641B2 (ja) * 2003-02-26 2007-09-26 ポリマテック株式会社 熱伝導性反応硬化型樹脂成形体の製造方法
JP4414674B2 (ja) * 2003-05-07 2010-02-10 ポリマテック株式会社 熱伝導性エポキシ樹脂成形体及びその製造方法
JP2005139298A (ja) * 2003-11-06 2005-06-02 Polymatech Co Ltd 異方性エポキシ樹脂硬化物及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017150587A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 低熱膨張部材用組成物、低熱膨張部材、電子機器、低熱膨張部材の製造方法
WO2017150588A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材用組成物の製造方法、放熱部材の製造方法
WO2017150589A1 (ja) 2016-03-02 2017-09-08 Jnc株式会社 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法
US10752755B2 (en) 2016-03-02 2020-08-25 Jnc Corporation Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member
CN108884190A (zh) * 2016-03-30 2018-11-23 株式会社大赛璐 热固化性化合物
EP3438140A4 (en) * 2016-03-30 2019-10-02 Daicel Corporation HEAT-HARDENING CONNECTION
WO2022092063A1 (ja) 2020-10-30 2022-05-05 Jnc株式会社 低誘電率樹脂形成用組成物、低誘電部材、及びそれを用いた電子機器

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