JP5080117B2 - めっき樹脂成形体 - Google Patents

めっき樹脂成形体 Download PDF

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Publication number
JP5080117B2
JP5080117B2 JP2007088169A JP2007088169A JP5080117B2 JP 5080117 B2 JP5080117 B2 JP 5080117B2 JP 2007088169 A JP2007088169 A JP 2007088169A JP 2007088169 A JP2007088169 A JP 2007088169A JP 5080117 B2 JP5080117 B2 JP 5080117B2
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JP
Japan
Prior art keywords
resin
mass
plating
component
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007088169A
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English (en)
Japanese (ja)
Other versions
JP2008057033A (ja
Inventor
利弘 田井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Polymer Ltd
Original Assignee
Daicel Polymer Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Polymer Ltd filed Critical Daicel Polymer Ltd
Priority to JP2007088169A priority Critical patent/JP5080117B2/ja
Priority to PCT/JP2007/065568 priority patent/WO2008016182A1/ja
Priority to CN2007800290996A priority patent/CN101501245B/zh
Priority to US12/308,609 priority patent/US20100143730A1/en
Priority to KR1020087031912A priority patent/KR20090036089A/ko
Priority to DE112007001651.5T priority patent/DE112007001651B4/de
Publication of JP2008057033A publication Critical patent/JP2008057033A/ja
Application granted granted Critical
Publication of JP5080117B2 publication Critical patent/JP5080117B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18—Homopolymers or copolymers of nitriles
    • C08L33/20—Homopolymers or copolymers of acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2007088169A 2006-08-04 2007-03-29 めっき樹脂成形体 Active JP5080117B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007088169A JP5080117B2 (ja) 2006-08-04 2007-03-29 めっき樹脂成形体
PCT/JP2007/065568 WO2008016182A1 (fr) 2006-08-04 2007-08-02 Corps moulé en résine plaqué
CN2007800290996A CN101501245B (zh) 2006-08-04 2007-08-02 镀覆树脂成型体
US12/308,609 US20100143730A1 (en) 2006-08-04 2007-08-02 Plated Resin Molded Article
KR1020087031912A KR20090036089A (ko) 2006-08-04 2007-08-02 도금 수지 성형체
DE112007001651.5T DE112007001651B4 (de) 2006-08-04 2007-08-02 Plattierter Harzformkörper

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006213256 2006-08-04
JP2006213256 2006-08-04
JP2007088169A JP5080117B2 (ja) 2006-08-04 2007-03-29 めっき樹脂成形体

Publications (2)

Publication Number Publication Date
JP2008057033A JP2008057033A (ja) 2008-03-13
JP5080117B2 true JP5080117B2 (ja) 2012-11-21

Family

ID=38997349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007088169A Active JP5080117B2 (ja) 2006-08-04 2007-03-29 めっき樹脂成形体

Country Status (6)

Country Link
US (1) US20100143730A1 (zh)
JP (1) JP5080117B2 (zh)
KR (1) KR20090036089A (zh)
CN (1) CN101501245B (zh)
DE (1) DE112007001651B4 (zh)
WO (1) WO2008016182A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5162152B2 (ja) * 2007-03-29 2013-03-13 ダイセルポリマー株式会社 めっき樹脂成形体
JP5987573B2 (ja) 2012-09-12 2016-09-07 セイコーエプソン株式会社 光学モジュール、電子機器、及び駆動方法
JP6665422B2 (ja) * 2015-04-21 2020-03-13 セイコーエプソン株式会社 インクジェット記録方法及びインクセット
CN106543564A (zh) * 2016-11-25 2017-03-29 厦门建霖工业有限公司 一种可以用水进行粗化的水电镀材料的制备方法
EP3670698B1 (en) * 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer, method and use thereof
CN111117195A (zh) * 2019-12-30 2020-05-08 上海普利特复合材料股份有限公司 一种低内应力电镀级pc/abs合金材料及其制备方法
CN111933045B (zh) * 2020-07-31 2022-10-11 深圳市艾比森光电股份有限公司 面罩及其制作方法
TW202244173A (zh) * 2021-02-26 2022-11-16 日商電化股份有限公司 Abs樹脂改質劑、樹脂組成物、成型體以及樹脂組成物的製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0699630B2 (ja) 1986-07-08 1994-12-07 東洋紡績株式会社 ポリアミド組成物
US5218069A (en) * 1989-04-20 1993-06-08 Kawasaki Steel Corporation Imidated copolymers and uses thereof
JP2586159B2 (ja) 1990-01-11 1997-02-26 富士電機株式会社 電圧共振型回路
JP3123119B2 (ja) * 1991-06-17 2001-01-09 三菱化学株式会社 ポリアミド樹脂メッキ製品
US5376248A (en) 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
JPH07157623A (ja) * 1993-12-09 1995-06-20 Mitsubishi Rayon Co Ltd 樹脂組成物
JPH10146019A (ja) * 1996-11-06 1998-05-29 Denso Corp 車両用駆動装置
JP3096962B2 (ja) * 1996-05-10 2000-10-10 出光石油化学株式会社 メッキ用樹脂組成物
JP3620614B2 (ja) * 1996-08-01 2005-02-16 出光興産株式会社 メッキ用樹脂組成物
US6331239B1 (en) 1997-04-07 2001-12-18 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive plastic molded products
JP2000026553A (ja) * 1998-05-08 2000-01-25 Toagosei Co Ltd 硬化性組成物
JP4979855B2 (ja) 2001-05-22 2012-07-18 ユーエムジー・エービーエス株式会社 ダイレクトめっき用樹脂組成物、樹脂めっき方法および樹脂めっき製品
JP4593036B2 (ja) 2001-09-11 2010-12-08 ダイセルポリマー株式会社 メッキ樹脂成形体
JP4030754B2 (ja) * 2001-11-28 2008-01-09 ダイセルポリマー株式会社 メッキ樹脂成形体
JP4619625B2 (ja) * 2002-04-03 2011-01-26 ダイセルポリマー株式会社 メッキ樹脂成形体の製造方法
JP2005232338A (ja) * 2004-02-20 2005-09-02 Daicel Polymer Ltd メッキ樹脂成形体
JP4276555B2 (ja) * 2004-02-20 2009-06-10 ダイセルポリマー株式会社 メッキ樹脂成形体

Also Published As

Publication number Publication date
KR20090036089A (ko) 2009-04-13
CN101501245B (zh) 2012-06-06
DE112007001651B4 (de) 2023-02-02
DE112007001651T5 (de) 2009-06-10
US20100143730A1 (en) 2010-06-10
WO2008016182A1 (fr) 2008-02-07
CN101501245A (zh) 2009-08-05
JP2008057033A (ja) 2008-03-13

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