JP5076557B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP5076557B2 JP5076557B2 JP2007055494A JP2007055494A JP5076557B2 JP 5076557 B2 JP5076557 B2 JP 5076557B2 JP 2007055494 A JP2007055494 A JP 2007055494A JP 2007055494 A JP2007055494 A JP 2007055494A JP 5076557 B2 JP5076557 B2 JP 5076557B2
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- 239000004065 semiconductor Substances 0.000 title claims description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000002184 metal Substances 0.000 claims description 66
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 54
- 239000000243 solution Substances 0.000 claims description 52
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 34
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 32
- 229910017052 cobalt Inorganic materials 0.000 claims description 31
- 239000010941 cobalt Substances 0.000 claims description 31
- 229910052710 silicon Inorganic materials 0.000 claims description 31
- 239000010703 silicon Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 31
- 229910021332 silicide Inorganic materials 0.000 claims description 28
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 28
- 239000010936 titanium Substances 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 23
- 229910052719 titanium Inorganic materials 0.000 claims description 23
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 21
- 229910000510 noble metal Inorganic materials 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- 229910052723 transition metal Inorganic materials 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 150000003624 transition metals Chemical class 0.000 claims description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052735 hafnium Inorganic materials 0.000 claims description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 29
- 238000005530 etching Methods 0.000 description 24
- 230000007547 defect Effects 0.000 description 20
- 239000000126 substance Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 17
- 239000007788 liquid Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising silicides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Description
次いで、ウェル注入、チャネルストップ注入、チャネル注入等のイオン注入を行い、シリコン基板10の活性領域内に所定の導電型のウェル14を形成する(図1(a))。ウェル14は、例えばN型MISFET形成領域であればPウェルとし、例えばP型MISFET形成領域であればNウェルとする。
合金(NiPt)を用いたシリサイド形成においては、シリサイド形成用金属(ニッケル)及び貴金属(プラチナ)のほかに、これら金属よりもイオン化傾向の高い金属(コバルト,チタン)を事前にエッチング液中に溶かしておくことによって、それらの金属元素が式(1)のような金属水和物錯体を形成し、合金の貴金属(プラチナ)を配位するかたちで除去が可能になったものと考えられる。
本発明は上記実施形態に限らず種々の変形が可能である。
12…素子分離膜
14…ウェル
16…ゲート絶縁膜
18…多結晶シリコン膜
20…ゲート電極
22,26…不純物拡散領域
24…側壁絶縁膜
28…ソース/ドレイン領域
30…金属合金膜
32…金属シリサイド膜
40…薬液処理槽
42…薬液
44…半導体基板
46…エッチング液
50…コバルト膜
Claims (9)
- シリコンが部分的に露出した領域を含む半導体基板上に、ニッケル、コバルト、チタン、ジルコニウム、ルテニウム、パラジウム、ハフニウム、タングステン及びタンタルを含む群から選択される金属とプラチナ及び金を含む群から選択される貴金属との合金よりなる金属合金膜を形成する工程と、
熱処理により、前記露出した領域のシリコンと前記金属合金膜とを選択的に反応させ、前記金属及び前記貴金属を含む金属シリサイド膜を前記露出した領域上に形成する工程と、
未反応のまま残存している前記金属合金膜を、前記金属よりもイオン化傾向の高い遷移金属を溶解した、過酸化水素を含有する溶液を用いて除去する工程と
を有することを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記溶液は、硫酸と過酸化水素水との混合液、塩酸と過酸化水素水との混合液又はアンモニアと過酸化水素水との混合液である
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記溶液は、硫酸と過酸化水素水との混合液であり、
前記過酸化水素水の混合比は、10〜30%である
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至3のいずれか1項に記載の半導体装置の製造方法において、
前記溶液中の前記遷移金属の濃度は、0.6〜10ppmである
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至4のいずれか1項に記載の半導体装置の製造方法において、
前記溶液の温度は、70℃以上である
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至5のいずれか1項に記載の半導体装置の製造方法において、
前記溶液中に、前記遷移金属が形成された他の半導体基板を浸漬させることにより、前記遷移金属を前記溶液中に溶解させる工程を更に有する
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至6のいずれか1項に記載の半導体装置の製造方法において、
前記金属は、ニッケルであり、
前記遷移金属は、コバルト又はチタンである
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至6のいずれか1項に記載の半導体装置の製造方法において、
前記金属は、コバルトであり、
前記遷移金属は、チタンである
ことを特徴とする半導体装置の製造方法。 - 請求項1乃至8のいずれか1項に記載の半導体装置の製造方法において、
前記露出した領域は、MISFETのゲート電極又はソース/ドレイン領域である
ことを特徴とする半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007055494A JP5076557B2 (ja) | 2007-03-06 | 2007-03-06 | 半導体装置の製造方法 |
US11/831,234 US8008194B2 (en) | 2007-03-06 | 2007-07-31 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
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JP2007055494A JP5076557B2 (ja) | 2007-03-06 | 2007-03-06 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2008218788A JP2008218788A (ja) | 2008-09-18 |
JP5076557B2 true JP5076557B2 (ja) | 2012-11-21 |
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JP2007055494A Expired - Fee Related JP5076557B2 (ja) | 2007-03-06 | 2007-03-06 | 半導体装置の製造方法 |
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US (1) | US8008194B2 (ja) |
JP (1) | JP5076557B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4759079B2 (ja) * | 2008-12-03 | 2011-08-31 | パナソニック株式会社 | 半導体装置の製造方法 |
JP4749471B2 (ja) * | 2009-01-13 | 2011-08-17 | パナソニック株式会社 | 半導体装置の製造方法 |
WO2021192420A1 (ja) * | 2020-03-24 | 2021-09-30 | 株式会社Ihi | 過給機 |
JP7500088B2 (ja) | 2022-04-11 | 2024-06-17 | 奥野製薬工業株式会社 | 金属剥離剤 |
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JP2861869B2 (ja) * | 1994-10-12 | 1999-02-24 | 日本電気株式会社 | 半導体装置の製造方法 |
JP4101901B2 (ja) * | 1997-04-25 | 2008-06-18 | シャープ株式会社 | 半導体装置の製造方法 |
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JP3006596B1 (ja) | 1998-09-09 | 2000-02-07 | 日本電気株式会社 | 半導体装置の製造方法 |
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JP2001068669A (ja) * | 1999-08-30 | 2001-03-16 | Sony Corp | 半導体装置の製造方法 |
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KR100536593B1 (ko) | 2002-12-05 | 2005-12-14 | 삼성전자주식회사 | 선택적인 막 제거를 위한 세정 용액 및 그 세정 용액을사용하여 실리사이드 공정에서 막을 선택적으로 제거하는방법 |
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JP4799196B2 (ja) * | 2006-01-31 | 2011-10-26 | 株式会社東芝 | 不揮発性半導体記憶装置 |
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