JP5074235B2 - 主軸装置 - Google Patents
主軸装置 Download PDFInfo
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- JP5074235B2 JP5074235B2 JP2008048451A JP2008048451A JP5074235B2 JP 5074235 B2 JP5074235 B2 JP 5074235B2 JP 2008048451 A JP2008048451 A JP 2008048451A JP 2008048451 A JP2008048451 A JP 2008048451A JP 5074235 B2 JP5074235 B2 JP 5074235B2
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- 239000002173 cutting fluid Substances 0.000 claims description 72
- 230000002093 peripheral effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Description
また、上述したような主軸装置において、切削部等へ切削液を供給するための切削液回路をドローバーや回転継手の中心等に形成するとともに、工具ホルダが挿入される取付孔内へ圧縮空気を噴出させるためのエアブロー回路をドローバーの周囲等に形成してなるものも考案されている(たとえば、特許文献2)。そして、当該主軸装置においては、ドローバーの後端部と回転継手部との間に、切削液の切削液回路からの漏洩を防止するためのシール部が設けられている。
請求項2に記載の発明は、請求項1に記載の発明において、前記切削液排出路内に、前記ハウジング外部からの異物進入を防止するための逆止弁を設けたことを特徴とする。
また、請求項2に記載の発明によれば、切削液排出路内に、ハウジング外部からの異物進入を防止するための逆止弁を設けているため、排出する切削液の逆流や外部からの水の浸入等を確実に防止することができる。
主軸装置1は、マシニングセンタ等の工作機械に備えられるものであって、ハウジング2の中心に、サーボモータ3により回転する主軸4を軸受5、5・・によって軸支してなる。主軸4の先端(図1における左側)には、工具ホルダ30を挿入可能な取付孔6が形成されているとともに、挿入された工具ホルダ30をクランプ/アンクランプするためのクランプ機構としてのコレット7が内設されている。
さらに、ピストン10の前端面よりも若干後方位置にフランジ部27を設けて、ピストン10によるドローバー8の押圧時にフランジ部27前面とプレート8aとの間に隙間が形成されるようにするとともに、第3エア流路13のプレート8a側の開口をフランジ部27の前方位置まで広く開設することで、空間Sへ圧縮空気を送ることを可能としている。したがって、ピストン10やプレート8a等に空間Sへ圧縮空気を送るための専用の排出エア流路を形成する必要がなく、低コストにて実現することができる。
Claims (2)
- ハウジング内で回転可能に軸支される主軸の先端部に、先端面の取付孔に挿入された工具ホルダをクランプ/アンクランプ可能なクランプ機構を内設し、前記主軸の軸心に、軸方向への前後移動によって前記クランプ機構をクランプ/アンクランプ動作させるドローバーを備える一方、前記ハウジング内部に、外部のエア供給手段からの圧縮空気を前記取付孔内に噴出させるエアブロー回路を形成するとともに、外部から供給される切削液を前記主軸の先端部まで導く切削液回路を形成し、当該切削液回路の一部として前記ドローバー内部に切削液流路を設けてなる主軸装置であって、
前記エアブロー回路に分岐路を設け、当該分岐路を前記ドローバーの後端部が前後移動する空間内へ連通させるとともに、前記ハウジングに、前記空間と前記ハウジング外部とを連通させる切削液排出路を設け、
前記ドローバーの前後移動に伴って前記切削液流路から前記空間内へ漏れ出した切削液を、前記分岐路を介して前記空間内へ送り込まれた圧縮空気により、前記切削液排出路を介して前記ハウジング外部へ排出可能としたことを特徴とする主軸装置。 - 前記切削液排出路内に、前記ハウジング外部からの異物進入を防止するための逆止弁を設けたことを特徴とする請求項1に記載の主軸装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008048451A JP5074235B2 (ja) | 2008-02-28 | 2008-02-28 | 主軸装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008048451A JP5074235B2 (ja) | 2008-02-28 | 2008-02-28 | 主軸装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009202301A JP2009202301A (ja) | 2009-09-10 |
JP5074235B2 true JP5074235B2 (ja) | 2012-11-14 |
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JP2008048451A Expired - Fee Related JP5074235B2 (ja) | 2008-02-28 | 2008-02-28 | 主軸装置 |
Country Status (1)
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JP (1) | JP5074235B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5294777B2 (ja) * | 2008-09-24 | 2013-09-18 | ヤマザキマザック株式会社 | 工作機械のミル主軸 |
JP5980891B2 (ja) * | 2014-12-16 | 2016-08-31 | ファナック株式会社 | 回転ジョイント支持構造部、工作機械の主軸および電動機 |
JP2022115473A (ja) * | 2021-01-28 | 2022-08-09 | Dgshape株式会社 | スピンドルおよびそれを備えた切削加工装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6112660U (ja) * | 1984-06-26 | 1986-01-24 | 株式会社 大隈鐵工所 | 切削液と空気供給機能を有する主軸装置 |
JPH0337880Y2 (ja) * | 1985-03-29 | 1991-08-09 | ||
JPH0370657U (ja) * | 1989-11-08 | 1991-07-16 | ||
JPH11254267A (ja) * | 1998-03-09 | 1999-09-21 | Mori Seiki Co Ltd | 切削油供給装置 |
JP2005249007A (ja) * | 2004-03-02 | 2005-09-15 | Rix Corp | ロータリジョイント |
JP2005271177A (ja) * | 2004-03-26 | 2005-10-06 | Brother Ind Ltd | 工作機械用主軸装置 |
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2008
- 2008-02-28 JP JP2008048451A patent/JP5074235B2/ja not_active Expired - Fee Related
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JP2009202301A (ja) | 2009-09-10 |
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