JP5073819B2 - 化合物半導体発光素子 - Google Patents
化合物半導体発光素子 Download PDFInfo
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- JP5073819B2 JP5073819B2 JP2010514617A JP2010514617A JP5073819B2 JP 5073819 B2 JP5073819 B2 JP 5073819B2 JP 2010514617 A JP2010514617 A JP 2010514617A JP 2010514617 A JP2010514617 A JP 2010514617A JP 5073819 B2 JP5073819 B2 JP 5073819B2
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- 239000004065 semiconductor Substances 0.000 title claims description 35
- 150000001875 compounds Chemical class 0.000 title claims description 16
- 238000005253 cladding Methods 0.000 claims description 48
- 230000006698 induction Effects 0.000 claims description 21
- 150000004767 nitrides Chemical class 0.000 claims description 13
- 230000000903 blocking effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 2
- 229910002704 AlGaN Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 246
- 230000002269 spontaneous effect Effects 0.000 description 45
- 230000010287 polarization Effects 0.000 description 38
- 238000000034 method Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 11
- 230000007423 decrease Effects 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 235000005811 Viola adunca Nutrition 0.000 description 1
- 240000009038 Viola odorata Species 0.000 description 1
- 235000013487 Viola odorata Nutrition 0.000 description 1
- 235000002254 Viola papilionacea Nutrition 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012067 mathematical method Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02469—Group 12/16 materials
- H01L21/02472—Oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02483—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Description
図3〜図5は、各々、ストレイン制御層(SCL)がない発光素子、ストレイン制御層が1つの発光素子、ストレイン制御層が2つの発光素子を示したものである。表1は、図3〜図5に示された発光素子のストレイン制御層の個数による歪み及び自発分極特性を示したものである。図6は、図3〜図5に示された発光素子のストレイン制御層の個数による自発発光特性を示したものである。
図7〜図10は、各々、ストレイン制御層がない発光素子、単位ストレイン制御層の厚さが12.5nmの発光素子、単位ストレイン制御層の厚さが20nmの発光素子、単位ストレイン制御層の厚さが25nmの発光素子を示したものである。表2は、図7〜図10に示された発光素子のストレイン制御層の厚さによる歪み及び自発分極特性を示したものである。図11は、ストレイン制御層のインジウム(In)含量による自発発光特性を示したものである。前記図7〜図10において単位ストレイン制御層の数は、2である。
図12〜図14は、各々ストレイン制御層がない発光素子、ストレイン制御層を超格子層で構成した発光素子、ストレイン制御層を同質膜で構成した発光素子を示したものである。表3は、図7の発光素子のストレイン制御層の構造による歪み及び自発分極特性を示したものである。前記図13及び図14において単位ストレイン制御層の数は、2である。
Claims (9)
- バッファ層、第1クラッド層、活性層及び第2クラッド層が順次積層された構造を有し、
前記バッファ層と前記第1クラッド層との間に積層されたストレイン制御層と、
該ストレイン制御層と1回以上交差して積層され、前記バッファ層と前記第1クラッド層間に積層され、前記活性層に引加された圧縮歪みを前記ストレイン制御層に分散させて前記活性層に引加された圧縮歪みを減少させる少なくとも1つのストレイン誘導層とを含み、
III−V族窒化物半導体を使用した発光素子であり、
前記バッファ層、前記第1クラッド層、前記活性層及び前記第2クラッド層が各々、InxAlyGa1−x−yN(0≦x≦l、0<y<1)の一般式に含まれる物質で構成され、
前記ストレイン制御層が、InxGa1−xN(0<x<0.33)の一般式に含まれる物質で構成されるか、またはInxGa1−xN/GaN(0<y<0.33)の超格子層が複数個積層された構造で構成され、
前記ストレイン制御層が、2〜10個の単位ストレイン制御層で構成され、
前記ストレイン誘導層が、アルミニウムを含まないIII−V族窒化物半導体からなるとともに、前記ストレイン誘導層と前記単位ストレイン制御層とが交互に配置されることにより2つの隣接する前記単位ストレイン制御層によって挟まれるとともに覆われており、 前記第1クラッド層が、前記活性層に覆われているとともに、アルミニウムを含まないIII−V族窒化物半導体からなり、
前記単位ストレイン制御層の各々の厚さが、10nmを超え30nm以下であることを特徴とする化合物半導体発光素子。 - 前記少なくとも1つのストレイン誘導層の厚さが、10nmを超え30nm以下であることを特徴とする請求項1に記載の化合物半導体発光素子。
- 前記2〜10個のストレイン制御層の各々が、In x Ga 1−x N/GaN(0<x<0.33)の超格子層からなる請求項1または請求項2に記載の化合物半導体発光素子。
- 前記In x Ga 1−x N/GaN(0<x<0.33)の超格子層の各層の厚さが、1〜2nmであることを特徴とする請求項3に記載の化合物半導体発光素子。
- 前記2〜10個の単位ストレイン制御層のうち最上位置に位置する単位ストレイン制御層が、前記第1クラッド層と接していることを特徴とする請求項1から請求項4のいずれかに記載の化合物半導体発光素子。
- 前記2〜10個の単位ストレイン制御層の全厚さが、20nm〜100nmであることを特徴とする請求項1から請求項5のいずれかに記載の化合物半導体発光素子。
- 前記少なくとも1つのストレイン誘導層が、GaNからなることを特徴とする請求項1から請求項6のいずれかに記載の化合物半導体発光素子。
- 前記活性層と前記第2クラッド層間に電子遮断層をさらに具備することを特徴とする請求項1から請求項7のいずれかに記載の化合物半導体発光素子。
- 前記電子遮断層が、AlGaNを含むことを特徴とする請求項8に記載の化合物半導体発光素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070066974A KR100864609B1 (ko) | 2007-07-04 | 2007-07-04 | 화합물 반도체를 이용한 발광소자 |
KR10-2007-0066974 | 2007-07-04 | ||
PCT/KR2008/003637 WO2009005245A2 (en) | 2007-07-04 | 2008-06-25 | Compound semiconductor light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010532561A JP2010532561A (ja) | 2010-10-07 |
JP5073819B2 true JP5073819B2 (ja) | 2012-11-14 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010514617A Expired - Fee Related JP5073819B2 (ja) | 2007-07-04 | 2008-06-25 | 化合物半導体発光素子 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20100133532A1 (ja) |
JP (1) | JP5073819B2 (ja) |
KR (1) | KR100864609B1 (ja) |
WO (1) | WO2009005245A2 (ja) |
Families Citing this family (21)
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US8698127B2 (en) * | 2010-01-08 | 2014-04-15 | Sensor Electronic Technology, Inc. | Superlattice structure and method for making the same |
US8993996B2 (en) | 2010-01-08 | 2015-03-31 | Sensor Electronic Technology, Inc. | Superlattice structure |
US9768349B2 (en) | 2010-01-08 | 2017-09-19 | Sensor Electronic Technology, Inc. | Superlattice structure |
CN102136536A (zh) * | 2010-01-25 | 2011-07-27 | 亚威朗(美国) | 应变平衡发光器件 |
JP5388967B2 (ja) * | 2010-08-09 | 2014-01-15 | 株式会社東芝 | 半導体発光素子 |
JP5259660B2 (ja) | 2010-09-06 | 2013-08-07 | 株式会社東芝 | 半導体発光素子 |
KR20120087631A (ko) | 2011-01-28 | 2012-08-07 | 삼성전자주식회사 | 나노 구조화된 음향광학 소자, 및 상기 음향광학 소자를 이용한 광 스캐너, 광 변조기 및 홀로그래픽 디스플레이 장치 |
KR101826740B1 (ko) * | 2011-06-28 | 2018-03-22 | 삼성전자주식회사 | 다층 나노 구조를 갖는 음향광학 소자, 및 상기 음향광학 소자를 이용한 광 스캐너, 광 변조기 및 디스플레이 장치 |
JP5252042B2 (ja) * | 2011-07-21 | 2013-07-31 | 住友電気工業株式会社 | Iii族窒化物半導体発光素子、及びiii族窒化物半導体発光素子を作製する方法 |
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2007
- 2007-07-04 KR KR1020070066974A patent/KR100864609B1/ko not_active IP Right Cessation
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2008
- 2008-06-25 US US12/666,542 patent/US20100133532A1/en not_active Abandoned
- 2008-06-25 JP JP2010514617A patent/JP5073819B2/ja not_active Expired - Fee Related
- 2008-06-25 WO PCT/KR2008/003637 patent/WO2009005245A2/en active Application Filing
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2010
- 2010-10-01 US US12/896,004 patent/US20110017974A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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WO2009005245A2 (en) | 2009-01-08 |
JP2010532561A (ja) | 2010-10-07 |
WO2009005245A3 (en) | 2009-02-26 |
US20110017974A1 (en) | 2011-01-27 |
US20100133532A1 (en) | 2010-06-03 |
KR100864609B1 (ko) | 2008-10-22 |
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