JP5063445B2 - 低い熱抵抗を有する発光ダイオードランプ - Google Patents

低い熱抵抗を有する発光ダイオードランプ Download PDF

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Publication number
JP5063445B2
JP5063445B2 JP2008090731A JP2008090731A JP5063445B2 JP 5063445 B2 JP5063445 B2 JP 5063445B2 JP 2008090731 A JP2008090731 A JP 2008090731A JP 2008090731 A JP2008090731 A JP 2008090731A JP 5063445 B2 JP5063445 B2 JP 5063445B2
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JP
Japan
Prior art keywords
top portion
emitting diode
light emitting
diode lamp
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008090731A
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English (en)
Japanese (ja)
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JP2008258620A (ja
Inventor
ジバノフ アレクサンダー
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Seoul Semiconductor Co Ltd
Original Assignee
Seoul Semiconductor Co Ltd
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Publication of JP2008258620A publication Critical patent/JP2008258620A/ja
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Publication of JP5063445B2 publication Critical patent/JP5063445B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2008090731A 2007-03-30 2008-03-31 低い熱抵抗を有する発光ダイオードランプ Expired - Fee Related JP5063445B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0032004 2007-03-30
KR1020070032004A KR101346342B1 (ko) 2007-03-30 2007-03-30 낮은 열저항을 갖는 발광 다이오드 램프

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011170634A Division JP5461487B2 (ja) 2007-03-30 2011-08-04 低い熱抵抗を有する発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JP2008258620A JP2008258620A (ja) 2008-10-23
JP5063445B2 true JP5063445B2 (ja) 2012-10-31

Family

ID=39619220

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008090731A Expired - Fee Related JP5063445B2 (ja) 2007-03-30 2008-03-31 低い熱抵抗を有する発光ダイオードランプ
JP2011170634A Expired - Fee Related JP5461487B2 (ja) 2007-03-30 2011-08-04 低い熱抵抗を有する発光ダイオードランプ
JP2011248929A Expired - Fee Related JP5314108B2 (ja) 2007-03-30 2011-11-14 低い熱抵抗を有する発光ダイオードランプ

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2011170634A Expired - Fee Related JP5461487B2 (ja) 2007-03-30 2011-08-04 低い熱抵抗を有する発光ダイオードランプ
JP2011248929A Expired - Fee Related JP5314108B2 (ja) 2007-03-30 2011-11-14 低い熱抵抗を有する発光ダイオードランプ

Country Status (5)

Country Link
US (1) US8278677B2 (enExample)
EP (1) EP1976032A3 (enExample)
JP (3) JP5063445B2 (enExample)
KR (1) KR101346342B1 (enExample)
TW (1) TWI373152B (enExample)

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* Cited by examiner, † Cited by third party
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US7928462B2 (en) * 2006-02-16 2011-04-19 Lg Electronics Inc. Light emitting device having vertical structure, package thereof and method for manufacturing the same
CN102116829B (zh) * 2010-12-21 2013-02-06 杭州远方光电信息股份有限公司 一种二极管热阻测量方法及装置
USD1087430S1 (en) * 2023-05-22 2025-08-05 Creeled, Inc. Light-emitting diode package
USD1070144S1 (en) * 2023-05-22 2025-04-08 Creeled, Inc. Light-emitting diode package

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Also Published As

Publication number Publication date
JP5461487B2 (ja) 2014-04-02
TW200840102A (en) 2008-10-01
KR101346342B1 (ko) 2013-12-31
JP2012039156A (ja) 2012-02-23
TWI373152B (en) 2012-09-21
EP1976032A2 (en) 2008-10-01
US8278677B2 (en) 2012-10-02
JP5314108B2 (ja) 2013-10-16
EP1976032A3 (en) 2009-11-25
JP2011216919A (ja) 2011-10-27
KR20080089038A (ko) 2008-10-06
US20080237625A1 (en) 2008-10-02
JP2008258620A (ja) 2008-10-23

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