JP5058465B2 - 半導体素子のキャパシタ形成方法 - Google Patents
半導体素子のキャパシタ形成方法 Download PDFInfo
- Publication number
- JP5058465B2 JP5058465B2 JP2005236153A JP2005236153A JP5058465B2 JP 5058465 B2 JP5058465 B2 JP 5058465B2 JP 2005236153 A JP2005236153 A JP 2005236153A JP 2005236153 A JP2005236153 A JP 2005236153A JP 5058465 B2 JP5058465 B2 JP 5058465B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- forming
- etching
- capacitor
- metal nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 108
- 239000003990 capacitor Substances 0.000 title claims description 68
- 239000004065 semiconductor Substances 0.000 title description 8
- 238000005530 etching Methods 0.000 claims description 66
- 238000001020 plasma etching Methods 0.000 claims description 57
- 239000007789 gas Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 150000004767 nitrides Chemical class 0.000 claims description 41
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 22
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 16
- 229910052731 fluorine Inorganic materials 0.000 claims description 15
- 239000011737 fluorine Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 14
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 13
- 229910001882 dioxygen Inorganic materials 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- -1 tungsten nitride Chemical class 0.000 claims description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims 2
- 239000010410 layer Substances 0.000 description 53
- 238000011109 contamination Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 8
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000005596 ionic collisions Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 150000001804 chlorine Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical class 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Description
102 層間絶縁膜
104 コンタクトプラグ
106 エッチング停止層
108 モールド層
110 キャパシタホール
112 下部電極膜
112a 下部電極
114 犠牲絶縁膜
114a 犠牲絶縁パターン
150 工程チャンバ
152 静電チャック
154 プラズマ発生手段
156 ガス注入管
158 排気管
Claims (16)
- フッ素及び酸素を含む環境でシリンダ形態の金属窒化膜をエッチングしてキャパシタ電極を形成する段階を含み、
前記エッチングは、キャパシタホールに充填された前記金属窒化膜対前記キャパシタホールが形成されたモールド層のエッチング選択比が3:1以上であり、
前記エッチングは、600W以下のパワーが供給されるプラズマエッチングであり、
前記金属窒化膜は、窒化チタン、窒化タンタル、または窒化タングステンのうちで選択された少なくとも一つであり、前記モールド層は、シリコン酸化膜である
ことを特徴とするキャパシタの形成方法。 - 前記金属窒化膜はフッ素プラズマを含む環境でプラズマエッチングされる
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記フッ素はCF4及びCHF3のうちで少なくとも一つである
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記金属窒化膜は100W乃至600Wのパワーが供給された環境でプラズマエッチングされる
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記金属窒化膜は1mTorr乃至2mTorrの工程圧力の環境でプラズマエッチングされる
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記金属窒化膜は200℃乃至500℃の工程温度の環境でプラズマエッチングされる
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記金属窒化膜は前記フッ素が前記酸素に比べて少ない量を供給する環境でエッチングされる
ことを特徴とする請求項1に記載のキャパシタの形成方法。 - 前記フッ素対前記酸素の供給比は1:9乃至4:6である
ことを特徴とする請求項7に記載のキャパシタの形成方法。 - 基板上に絶縁膜を形成する段階と、
前記絶縁膜をパターニングしてリセス領域を形成する段階と、
前記絶縁膜上及び前記リセス領域内に金属窒化膜をコンフォーマルに形成する段階と、
前記金属窒化膜上に犠牲膜を形成する段階と、
前記金属窒化膜が露出されるまで前記犠牲膜を平坦化する段階と、
前記露出された金属窒化膜をフッ化炭素及び酸素を含むエッチングガスを使用するプラズマエッチングしてキャパシタ電極を形成する段階とを含み、
前記プラズマエッチングは、キャパシタホールに充填された前記金属窒化膜対前記キャパシタホールが形成された前記絶縁膜のエッチング選択比が3:1以上であり、
前記エッチングは、600W以下のパワーが供給されるプラズマエッチングであり、
前記金属窒化膜は、窒化チタン、窒化タンタル、または窒化タングステンのうちで選択された少なくとも一つであり、前記絶縁膜は、シリコン酸化膜である
ことを特徴とするキャパシタの形成方法。 - 前記プラズマエッチングはCF4ガス及び酸素ガスを含むエッチングガスを70sccmで流入し、10mTorrの工程圧力、300℃の工程温度、300Wのパワー、及びCF4ガス対酸素ガスの供給比が3:7である工程条件で実行する
ことを特徴とする請求項9に記載のキャパシタの形成方法。 - 前記絶縁膜はシリコン酸化膜、USG及びSOGのうちで少なくとも一つで形成し、前記プラズマエッチングによる前記金属窒化膜のエッチング率は前記プラズマエッチングによる前記絶縁膜のエッチング率の3倍より高い
ことを特徴とする請求項9に記載のキャパシタの形成方法。 - 前記フッ素ガスはCF4及びCHF3のうちで少なくとも一つである
ことを特徴とする請求項9に記載のキャパシタの形成方法。 - 前記プラズマエッチングは1mTorr乃至20mTorrの工程圧力の環境で実行される
ことを特徴とする請求項9に記載のキャパシタの形成方法。 - 前記プラズマエッチングは200℃乃至500℃の工程温度の環境で実行される
ことを特徴とする請求項9に記載のキャパシタの形成方法。 - 基板上に絶縁膜を形成する段階と、
前記絶縁膜をパターニングしてリセス領域を形成する段階と、
前記絶縁膜上及び前記リセス領域内に金属窒化膜をコンフォーマルに形成する段階と、
前記金属窒化膜上に犠牲膜を形成する段階と、
前記金属窒化膜が露出されるまで前記犠牲膜を平坦化する段階と、
前記露出された金属窒化膜をフッ化炭素及び酸素を含むエッチングガスを使用するプラズマエッチングしてキャパシタ電極を形成し、前記キャパシタ電極の上部面を前記平坦化された絶縁膜の上部面より低く形成する段階とを含み、
前記プラズマエッチングは、キャパシタホールに充填された前記金属窒化膜対前記キャパシタホールが形成された前記絶縁膜のエッチング選択比が3:1以上であり、
前記エッチングは、600W以下のパワーが供給されるプラズマエッチングであり、
前記金属窒化膜は、窒化チタン、窒化タンタル、または窒化タングステンのうちで選択された少なくとも一つであり、前記絶縁膜は、シリコン酸化膜である
ことを特徴とするキャパシタの形成方法。 - 前記キャパシタ電極の上部面は前記電極内の平坦化された犠牲膜の側壁から前記電極の外の前記絶縁膜の側壁まで平坦である
ことを特徴とする請求項15に記載のキャパシタの形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040064650A KR100560821B1 (ko) | 2004-08-17 | 2004-08-17 | 반도체 소자의 캐패시터 형성 방법 |
KR10-2004-0064650 | 2004-08-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006060220A JP2006060220A (ja) | 2006-03-02 |
JP5058465B2 true JP5058465B2 (ja) | 2012-10-24 |
Family
ID=36107386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005236153A Expired - Fee Related JP5058465B2 (ja) | 2004-08-17 | 2005-08-16 | 半導体素子のキャパシタ形成方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7329574B2 (ja) |
JP (1) | JP5058465B2 (ja) |
KR (1) | KR100560821B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101094960B1 (ko) | 2006-09-26 | 2011-12-15 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 형성방법 |
US11062897B2 (en) * | 2017-06-09 | 2021-07-13 | Lam Research Corporation | Metal doped carbon based hard mask removal in semiconductor fabrication |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0870043A (ja) * | 1994-08-30 | 1996-03-12 | Nkk Corp | 半導体装置の製造方法 |
JP3466851B2 (ja) * | 1997-01-20 | 2003-11-17 | 株式会社東芝 | 半導体装置及びその製造方法 |
KR100483575B1 (ko) * | 1997-08-30 | 2006-05-16 | 주식회사 하이닉스반도체 | 반도체소자의전하저장전극형성방법 |
JPH11214354A (ja) * | 1998-01-20 | 1999-08-06 | Toshiba Corp | 半導体装置の製造方法 |
US5893734A (en) * | 1998-09-14 | 1999-04-13 | Vanguard International Semiconductor Corporation | Method for fabricating capacitor-under-bit line (CUB) dynamic random access memory (DRAM) using tungsten landing plug contacts |
KR20010008672A (ko) * | 1999-07-02 | 2001-02-05 | 김영환 | 커패시터 제조방법 |
US6492222B1 (en) * | 1999-12-22 | 2002-12-10 | Texas Instruments Incorporated | Method of dry etching PZT capacitor stack to form high-density ferroelectric memory devices |
JP2001267561A (ja) * | 2000-03-21 | 2001-09-28 | Sony Corp | 半導体装置の製造方法及び半導体装置 |
JP4011304B2 (ja) * | 2000-05-12 | 2007-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
TW480576B (en) * | 2000-05-12 | 2002-03-21 | Semiconductor Energy Lab | Semiconductor device and method for manufacturing same |
JP3746979B2 (ja) * | 2001-10-03 | 2006-02-22 | 富士通株式会社 | 半導体装置及びその製造方法 |
US6653199B2 (en) | 2001-10-09 | 2003-11-25 | Micron Technology, Inc. | Method of forming inside rough and outside smooth HSG electrodes and capacitor structure |
US6784479B2 (en) * | 2002-06-05 | 2004-08-31 | Samsung Electronics Co., Ltd. | Multi-layer integrated circuit capacitor electrodes |
KR20040001221A (ko) | 2002-06-27 | 2004-01-07 | 주식회사 하이닉스반도체 | 캐패시터 형성 방법 |
KR20040001226A (ko) | 2002-06-27 | 2004-01-07 | 주식회사 하이닉스반도체 | 캐패시터 형성 방법 |
KR20040001951A (ko) * | 2002-06-29 | 2004-01-07 | 주식회사 하이닉스반도체 | 반도체 장치의 형성방법 |
KR100546381B1 (ko) * | 2003-09-22 | 2006-01-26 | 삼성전자주식회사 | 습식식각 공정을 포함하는 반도체 소자의 제조방법 |
KR100546363B1 (ko) * | 2003-08-13 | 2006-01-26 | 삼성전자주식회사 | 콘케이브 형태의 스토리지 노드 전극을 갖는 반도체메모리 소자 및 그 제조방법 |
-
2004
- 2004-08-17 KR KR1020040064650A patent/KR100560821B1/ko not_active IP Right Cessation
-
2005
- 2005-06-16 US US11/154,152 patent/US7329574B2/en not_active Expired - Fee Related
- 2005-08-16 JP JP2005236153A patent/JP5058465B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006060220A (ja) | 2006-03-02 |
US7329574B2 (en) | 2008-02-12 |
KR100560821B1 (ko) | 2006-03-13 |
KR20060016268A (ko) | 2006-02-22 |
US20060040443A1 (en) | 2006-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10692880B2 (en) | 3D NAND high aspect ratio structure etch | |
KR100673015B1 (ko) | 캐패시터를 갖는 반도체 소자 및 그 형성 방법 | |
US8497142B2 (en) | Methods of forming conductive layer patterns using gas phase cleaning process and methods of manufacturing semiconductor devices | |
JP5062969B2 (ja) | 半導体素子のランディングプラグコンタクト形成方法 | |
JP2009021584A (ja) | 高k材料ゲート構造の高温エッチング方法 | |
JP2006140488A (ja) | ストレージキャパシタの製造方法及びストレージキャパシタ | |
KR102171265B1 (ko) | 금속 마스크를 이용한 패터닝 방법 및 그 패터닝 방법을 포함한 반도체 소자 제조방법 | |
KR20060085734A (ko) | 높은 유전율을 갖는 유전체 구조물의 제조 방법 및 이를 포함하는 반도체 소자의 제조 방법 | |
EP1455385B1 (en) | Method for forming ferroelectric memory capacitor | |
US20080038895A1 (en) | Capacitor of semiconductor device and method of manufacturing the same | |
JP5058465B2 (ja) | 半導体素子のキャパシタ形成方法 | |
JP2009218364A (ja) | 半導体装置及びその製造方法 | |
JP2004179226A (ja) | 半導体装置の製造方法 | |
KR20060136191A (ko) | 커패시터 제조 방법 | |
JP2023522165A (ja) | 抵抗変化型メモリ(reram)セルの金属-絶縁体-金属(mim)スタックのその場封止 | |
KR100454255B1 (ko) | 하드마스크를 이용한 캐패시터의 제조 방법 | |
JP2008135670A (ja) | 半導体装置およびその製造方法 | |
TWI278035B (en) | Method for fabricating semiconductor device | |
TWI233160B (en) | Semiconductor device manufacturing method | |
JP2007214353A (ja) | 強誘電体キャパシタの製造方法及び半導体記憶装置の製造方法 | |
KR100677773B1 (ko) | 반도체 소자의 캐패시터 형성방법 | |
JP2006093451A (ja) | 半導体装置 | |
KR100739530B1 (ko) | 큰 종횡비의 콘택홀을 갖는 반도체장치의 제조 방법 | |
KR100875674B1 (ko) | 캐패시터 누설을 방지하는 반도체소자 제조 방법 | |
JP2006135231A (ja) | 半導体装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080409 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100930 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101005 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110913 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111107 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120403 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120611 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120703 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120801 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150810 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |