JP5046927B2 - 表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔 - Google Patents
表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/40—Metallic substrate based on other transition elements
- B05D2202/45—Metallic substrate based on other transition elements based on Cu
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2350/00—Pretreatment of the substrate
- B05D2350/60—Adding a layer before coating
- B05D2350/65—Adding a layer before coating metal layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
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Description
K 4 P 2 O 7 濃度 50g/l〜400g/l
電解条件 : 液 温 20℃〜50℃
pH 9〜12
電流密度 0.1A/dm2〜2.5A/dm2
攪 拌 あり
K 4 P 2 O 7 濃度 50g/l〜400g/l
電解条件 : 液 温 20℃〜45℃
pH 10〜13
電流密度 0.1A/dm2〜2.0A/dm2
工程b. 前記樹脂組成物を、有機溶剤を用いて溶解し、樹脂固形分10wt%〜40wt%の樹脂溶液とする。
本件発明に係る表面処理銅箔は、絶縁樹脂基材に対する電解銅箔の張り合わせ面に防錆処理層とシランカップリング剤層とを備える表面処理銅箔において、当該防錆処理層は、重量厚さ5mg/m2〜40mg/m2ニッケル層と、重量厚さ5mg/m2〜40mg/m2のスズ層とを順次積層したものであり、当該防錆処理層の表面にシランカップリング剤層を備えることを特徴とするものである。
本件発明に係る表面処理銅箔の製造方法は、電解銅箔(粗化面を備える場合を含む)の絶縁樹脂基材に対する張り合わせ面に、ニッケル層を形成し、当該ニッケル層の上にスズ層を形成し防錆処理層とし、当該スズ層の表面にシランカップリング剤を吸着し、乾燥させてシランカップリング剤層を形成する表面処理銅箔の製造方法において、前記ニッケル層は、以下のニッケル電解液及び電解条件を用いることを特徴としたものである。
本件発明に係る極薄プライマ樹脂層付表面処理銅箔は、本件発明に係る表面処理銅箔の絶縁樹脂基材に対する張り合わせ面上に、完全平面に塗布したときの厚さに換算した厚さが0.5μm〜5μmの極薄プライマ樹脂層を備えたものである。ここで言う表面処理銅箔とは、その張り合わせ面が電解銅箔で言う光沢面でも粗面であっても構わない。特に、それらの面に粗化処理を備えない場合に有用である。
上述してきた本件発明に係る極薄プライマ樹脂層付表面処理銅箔の製造方法に関して説明する。ここでは、まず以下に述べる工程a.、工程b.の手順で極薄プライマ樹脂層の形成に用いる樹脂溶液を調整し、当該樹脂溶液を銅箔のシランカップリング剤層を形成した面に、完全平面に塗布したときの厚さに換算した厚さ0.5μm〜5μm分を塗布し、乾燥させることで半硬化状態とすることを特徴とする製造方法を採用するのである。
この実施例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の粗面(表面粗さRa=0.64μm、Rzjis=3.0μm)の表面に対し、粗化処理、防錆処理シランカップリング剤処理して、表面処理銅箔とした。以下、工程を追って詳細に述べる。
この実施例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の光沢面(表面粗さRa=0.25μm、Rzjis=1.2μm)の表面に対し、防錆処理、シランカップリング剤処理して、表面処理銅箔とした。即ち、粗化処理を省略したのである。以下、工程を追って詳細に述べる。
芳香族ポリアミド樹脂ポリマー 50重量部
フェノール樹脂 18重量部
硬化促進剤 0.1重量部
この実施例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の光沢面(表面粗さRa=0.25μm、Rzjis=1.2μm)の表面に対し、防錆処理、シランカップリング剤処理して、表面処理銅箔とした。即ち、粗化処理を省略したのである。以下、工程を追って詳細に述べる。
ポリエーテルサルホン樹脂 50重量部
硬化促進剤 1重量部
この比較例では、実施例1と同じ18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の粗面(表面粗さRa=0.64μm、Rzjis=3.0μm)の表面に対し、粗化処理、防錆処理(ニッケル層のみ)、シランカップリング剤処理して、表面処理銅箔とした。
この比較例では、実施例1と同じ18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の粗面(表面粗さRa=0.64μm、Rzjis=3.0μm)の表面に対し、粗化処理、防錆処理(スズ層のみ)、シランカップリング剤処理して、表面処理銅箔とした。
この比較例では、実施例1と同じ18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の粗面(表面粗さRa=0.64μm、Rzjis=3.0μm)の表面に対し、粗化処理、防錆処理(ニッケル−スズ合金層)、シランカップリング剤処理して、表面処理銅箔とした。
この比較例では、実施例1と同じ18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の粗面(表面粗さRa=0.64μm、Rzjis=3.0μm)の表面に対し、粗化処理、特許文献2に開示されたと同等の防錆処理(ニッケル−モリブデン−コバルト合金層)、シランカップリング剤処理して、表面処理銅箔とした。
この比較例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の光沢面(表面粗さRa=0.25μm、Rzjis=1.2μm)の表面に対し、防錆処理(ニッケル層のみ)、シランカップリング剤処理して、表面処理銅箔とした。即ち、粗化処理を省略した。以下、工程を追って詳細に述べる。
この比較例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の光沢面(表面粗さRa=0.25μm、Rzjis=1.2μm)の表面に対し、防錆処理(スズ層のみ)、シランカップリング剤処理して、表面処理銅箔とした。即ち、粗化処理を省略した。以下、工程を追って詳細に述べる。
この比較例では、18μm厚さの未処理の電解銅箔(以下、単に「未処理箔」と称する。)の光沢面(表面粗さRa=0.25μm、Rzjis=1.2μm)の表面に対し、防錆処理(ニッケル−スズ合金層)、シランカップリング剤処理して、表面処理銅箔とした。即ち、粗化処理を省略した。以下、工程を追って詳細に述べる。
実施例1と比較例1〜比較例4との対比: 最初に、実施例1(試料1−1〜試料1−8)と比較例1〜比較例4(試料1−9〜試料1−14及び試料3)との各試料の防錆処理元素の重量厚さを表2に示す。そして、表3には、当該試料を用いた評価結果を示す。
2 銅箔
3 防錆処理層
4 シランカップリング剤層
5 表面処理銅箔
6 極薄プライマ樹脂層
Claims (11)
- 絶縁樹脂基材に対する電解銅箔の張り合わせ面に防錆処理層とシランカップリング剤層とを備える表面処理銅箔において、
当該防錆処理層は、重量厚さ5mg/m2〜40mg/m2 のニッケル層と、重量厚さ5mg/m2〜40mg/m2のスズ層とを順次積層し、ニッケルとスズとの合計重量厚さが10mg/m 2 〜50mg/m 2 で、且つ、[ニッケル重量]/[スズ重量]=1/3〜3であり、
当該防錆処理層の表面にシランカップリング剤層を備えることを特徴とする表面処理銅箔。 - 前記電解銅箔の張り合わせ面は粗化処理を施したものである請求項1に記載の表面処理銅箔。
- 前記シランカップリング剤層は、アミノ系シランカップリング剤又はエポキシ系シランカップリング剤を用いて形成したものである請求項1又は請求項2に記載の表面処理銅箔。
- 請求項1又は請求項2に記載の表面処理銅箔の絶縁樹脂基材に対する張り合わせ面上に、完全平面に塗布したときの厚さに換算した厚さが0.5μm〜5μmの極薄プライマ樹脂層を備えたことを特徴とする極薄プライマ樹脂層付表面処理銅箔。
- 前記極薄プライマ樹脂層は、硬化剤を含むエポキシ樹脂5重量部〜80重量部と、溶剤に可溶な芳香族ポリアミド樹脂ポリマー又はポリエーテルサルホン20重量部〜95重量部と、必要に応じて適宜量添加する硬化促進剤からなる樹脂組成物を用いて構成したものである請求項4に記載の極薄プライマ樹脂層付表面処理銅箔。
- 前記極薄プライマ樹脂層に用いる芳香族ポリアミド樹脂ポリマーは、芳香族ポリアミドとゴム性樹脂とを反応させることで得られるものである請求項5に記載の極薄プライマ樹脂層付表面処理銅箔。
- MIL規格におけるMIL−P−13949Gに準拠して測定したときのレジンフローが5%以内である樹脂組成物で形成した極薄プライマ樹脂層を備えた請求項4〜請求項6のいずれかに記載の極薄プライマ樹脂層付表面処理銅箔。
- 請求項1に記載の表面処理銅箔の製造方法であって、
電解銅箔の絶縁樹脂基材に対する張り合わせ面に、ニッケル層を形成し、当該ニッケル層の上にスズ層を形成し防錆処理層とし、当該スズ層の表面にシランカップリング剤を吸着させ、乾燥させシランカップリング剤層を形成し、
当該シランカップリング剤層は、1g/l〜10g/l濃度のシランカップリング剤を水又は有機溶媒に分散させた溶液をスズ層の表面に吸着させ、乾燥することで形成したものであることを特徴する表面処理銅箔の製造方法。 - 前記乾燥は160℃〜200℃の温度雰囲気で行うものである請求項8に記載の表面処理銅箔の製造方法。
- 前記乾燥を180℃〜190℃の温度雰囲気で30分〜240分継続し、乾燥と併せてベーキング効果を得るものである請求項8又は請求項9のいずれかに記載の表面処理銅箔の製造方法。
- 請求項4に記載の極薄プライマ樹脂層付表面処理銅箔の製造方法であって、
以下の工程a.、工程b.の手順で極薄プライマ樹脂層の形成に用いる樹脂溶液を調整し、当該樹脂溶液を銅箔のシランカップリング剤層を形成した面に、完全平面に塗布したときの厚さに換算した厚さ0.5μm〜5μm分を塗布し、乾燥させることで半硬化状態とすることを特徴とする極薄プライマ樹脂層付表面処理銅箔の製造方法。
工程a. 硬化剤含むエポキシ樹脂5重量部〜80重量部と、溶剤に可溶な芳香族ポリアミド樹脂ポリマー又はポリエーテルサルホン20重量部〜95重量部と、必要に応じて適宜量添加する硬化促進剤とを混合して樹脂組成物とする。
工程b. 前記樹脂組成物を、有機溶剤を用いて溶解し、樹脂固形分10wt%〜40wt%の樹脂溶液とする。
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WO2023149007A1 (ja) * | 2022-02-07 | 2023-08-10 | 尾池工業株式会社 | 回路基板用導電性フィルム、回路基板用導電性フィルムの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07170064A (ja) * | 1993-08-06 | 1995-07-04 | Gould Electron Inc | 接着性促進層を有する金属箔 |
JP2005053218A (ja) * | 2003-07-22 | 2005-03-03 | Mitsui Mining & Smelting Co Ltd | 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW289900B (ja) * | 1994-04-22 | 1996-11-01 | Gould Electronics Inc | |
US6579568B2 (en) * | 1999-11-29 | 2003-06-17 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
US6461745B2 (en) * | 2000-04-25 | 2002-10-08 | Nippon Denkai, Ltd. | Copper foil for tape carrier and tab carrier tape and tab tape carrier using the copper foil |
JP3396465B2 (ja) | 2000-08-25 | 2003-04-14 | 三井金属鉱業株式会社 | 銅張積層板 |
JP2004047681A (ja) | 2002-07-11 | 2004-02-12 | Nippon Denkai Kk | プリント配線板用銅箔 |
TW200500199A (en) * | 2003-02-12 | 2005-01-01 | Furukawa Circuit Foil | Copper foil for fine patterned printed circuits and method of production of same |
-
2006
- 2006-06-08 TW TW095120359A patent/TW200704833A/zh unknown
- 2006-06-12 US US11/915,038 patent/US8187723B2/en not_active Expired - Fee Related
- 2006-06-12 CN CN2006800209260A patent/CN101194045B/zh active Active
- 2006-06-12 WO PCT/JP2006/311744 patent/WO2006134868A1/ja active Application Filing
- 2006-06-12 KR KR1020077030588A patent/KR101000342B1/ko active IP Right Grant
- 2006-06-12 EP EP20060766606 patent/EP1911860B1/en active Active
- 2006-06-12 JP JP2007521274A patent/JP5046927B2/ja active Active
- 2006-06-13 MY MYPI20062780A patent/MY152161A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07170064A (ja) * | 1993-08-06 | 1995-07-04 | Gould Electron Inc | 接着性促進層を有する金属箔 |
JP2005053218A (ja) * | 2003-07-22 | 2005-03-03 | Mitsui Mining & Smelting Co Ltd | 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015012327A1 (ja) | 2013-07-23 | 2015-01-29 | Jx日鉱日石金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法 |
EP3046400A2 (en) | 2015-01-16 | 2016-07-20 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board |
EP3048864A2 (en) | 2015-01-21 | 2016-07-27 | JX Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board |
US9839124B2 (en) | 2015-02-06 | 2017-12-05 | Jx Nippon Mining & Metals Corporation | Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board |
EP3232747A1 (en) | 2016-04-15 | 2017-10-18 | JX Nippon Mining & Metals Corp. | Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device |
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US10529992B2 (en) | 2017-02-03 | 2020-01-07 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil |
Also Published As
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TW200704833A (en) | 2007-02-01 |
KR101000342B1 (ko) | 2010-12-13 |
CN101194045A (zh) | 2008-06-04 |
EP1911860B1 (en) | 2013-02-20 |
MY152161A (en) | 2014-08-15 |
TWI339222B (ja) | 2011-03-21 |
US8187723B2 (en) | 2012-05-29 |
EP1911860A1 (en) | 2008-04-16 |
JPWO2006134868A1 (ja) | 2009-01-08 |
EP1911860A4 (en) | 2009-11-11 |
US20090029186A1 (en) | 2009-01-29 |
WO2006134868A1 (ja) | 2006-12-21 |
CN101194045B (zh) | 2010-11-17 |
KR20080015468A (ko) | 2008-02-19 |
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