JP5038355B2 - 光半導体装置モジュール - Google Patents

光半導体装置モジュール Download PDF

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Publication number
JP5038355B2
JP5038355B2 JP2009118260A JP2009118260A JP5038355B2 JP 5038355 B2 JP5038355 B2 JP 5038355B2 JP 2009118260 A JP2009118260 A JP 2009118260A JP 2009118260 A JP2009118260 A JP 2009118260A JP 5038355 B2 JP5038355 B2 JP 5038355B2
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JP
Japan
Prior art keywords
heat
optical semiconductor
semiconductor device
electrode pad
device module
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Expired - Fee Related
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JP2009118260A
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English (en)
Japanese (ja)
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JP2010267834A (ja
JP2010267834A5 (enExample
Inventor
英誌 高城
英明 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Priority to JP2009118260A priority Critical patent/JP5038355B2/ja
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Publication of JP2010267834A5 publication Critical patent/JP2010267834A5/ja
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JP2009118260A 2009-05-15 2009-05-15 光半導体装置モジュール Expired - Fee Related JP5038355B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009118260A JP5038355B2 (ja) 2009-05-15 2009-05-15 光半導体装置モジュール

Applications Claiming Priority (1)

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JP2009118260A JP5038355B2 (ja) 2009-05-15 2009-05-15 光半導体装置モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011194740A Division JP5496975B2 (ja) 2011-09-07 2011-09-07 半導体装置モジュール

Publications (3)

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JP2010267834A JP2010267834A (ja) 2010-11-25
JP2010267834A5 JP2010267834A5 (enExample) 2011-09-15
JP5038355B2 true JP5038355B2 (ja) 2012-10-03

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ID=43364553

Family Applications (1)

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JP2009118260A Expired - Fee Related JP5038355B2 (ja) 2009-05-15 2009-05-15 光半導体装置モジュール

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JP (1) JP5038355B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012252078A (ja) 2011-06-01 2012-12-20 Stanley Electric Co Ltd 半導体発光素子およびストロボ装置
JP5869961B2 (ja) * 2012-05-28 2016-02-24 株式会社東芝 半導体発光装置
WO2015016561A1 (en) 2013-07-29 2015-02-05 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and led module having the same
US9847457B2 (en) 2013-07-29 2017-12-19 Seoul Viosys Co., Ltd. Light emitting diode, method of fabricating the same and LED module having the same
KR102091842B1 (ko) * 2013-07-29 2020-03-20 서울바이오시스 주식회사 발광 다이오드 및 그것을 제조하는 방법
JP7007180B2 (ja) * 2017-12-26 2022-01-24 シーシーエス株式会社 発光装置
WO2021106620A1 (ja) * 2019-11-25 2021-06-03 ローム株式会社 放熱チップ
JP7631961B2 (ja) * 2021-03-24 2025-02-19 富士フイルムビジネスイノベーション株式会社 光計測装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582715A (ja) * 1991-09-24 1993-04-02 Hitachi Denshi Ltd チツプ状電子部品
JPH07147467A (ja) * 1993-11-25 1995-06-06 Hitachi Ltd 電子部品の放熱方法
JPH11339924A (ja) * 1998-05-22 1999-12-10 Kondo Denki:Kk サージ吸収素子の製造方法、及びこれによるサージ吸収素子
JP2001120758A (ja) * 2000-10-02 2001-05-08 Sankyo Kk 遊技機の可変表示装置
JP2002246515A (ja) * 2001-02-20 2002-08-30 Mitsubishi Electric Corp 半導体装置
JP4479531B2 (ja) * 2005-02-17 2010-06-09 日立金属株式会社 セラミックス回路基板およびそれを用いた半導体モジュール
JP2007214245A (ja) * 2006-02-08 2007-08-23 Matsushita Electric Ind Co Ltd 基板の製造方法
JP2008182113A (ja) * 2007-01-25 2008-08-07 Idea System Kk 発光ダイオード光源ユニット
JP2008277442A (ja) * 2007-04-26 2008-11-13 Toyota Industries Corp 放熱基板
JP2009065010A (ja) * 2007-09-07 2009-03-26 Toyota Central R&D Labs Inc 半導体装置

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JP2010267834A (ja) 2010-11-25

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