JP5036096B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5036096B2
JP5036096B2 JP2000238080A JP2000238080A JP5036096B2 JP 5036096 B2 JP5036096 B2 JP 5036096B2 JP 2000238080 A JP2000238080 A JP 2000238080A JP 2000238080 A JP2000238080 A JP 2000238080A JP 5036096 B2 JP5036096 B2 JP 5036096B2
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Japan
Prior art keywords
contact hole
conductive film
film
unit area
contact holes
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Expired - Fee Related
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JP2000238080A
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English (en)
Japanese (ja)
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JP2002050689A5 (enExample
JP2002050689A (ja
Inventor
和宏 塚本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
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Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2000238080A priority Critical patent/JP5036096B2/ja
Publication of JP2002050689A publication Critical patent/JP2002050689A/ja
Publication of JP2002050689A5 publication Critical patent/JP2002050689A5/ja
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Publication of JP5036096B2 publication Critical patent/JP5036096B2/ja
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  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2000238080A 2000-08-07 2000-08-07 半導体装置の製造方法 Expired - Fee Related JP5036096B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000238080A JP5036096B2 (ja) 2000-08-07 2000-08-07 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000238080A JP5036096B2 (ja) 2000-08-07 2000-08-07 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002050689A JP2002050689A (ja) 2002-02-15
JP2002050689A5 JP2002050689A5 (enExample) 2007-09-20
JP5036096B2 true JP5036096B2 (ja) 2012-09-26

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Family Applications (1)

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JP2000238080A Expired - Fee Related JP5036096B2 (ja) 2000-08-07 2000-08-07 半導体装置の製造方法

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JP (1) JP5036096B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7224068B2 (en) * 2004-04-06 2007-05-29 Taiwan Semiconductor Manufacturing Company, Ltd. Stable metal structure with tungsten plug

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148431A (ja) * 1995-11-21 1997-06-06 Nec Corp 半導体装置の製造方法
JP3393436B2 (ja) * 1996-12-03 2003-04-07 ソニー株式会社 配線の形成方法
JP3111924B2 (ja) * 1997-04-11 2000-11-27 日本電気株式会社 半導体装置の製造方法
JP2000003912A (ja) * 1998-06-16 2000-01-07 Hitachi Ltd 半導体装置の製造方法および半導体装置
JP3141939B2 (ja) * 1998-11-26 2001-03-07 日本電気株式会社 金属配線形成方法

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Publication number Publication date
JP2002050689A (ja) 2002-02-15

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