JP5026112B2 - 半導体装置の製造方法。 - Google Patents

半導体装置の製造方法。 Download PDF

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Publication number
JP5026112B2
JP5026112B2 JP2007058921A JP2007058921A JP5026112B2 JP 5026112 B2 JP5026112 B2 JP 5026112B2 JP 2007058921 A JP2007058921 A JP 2007058921A JP 2007058921 A JP2007058921 A JP 2007058921A JP 5026112 B2 JP5026112 B2 JP 5026112B2
Authority
JP
Japan
Prior art keywords
plate
lead
semiconductor device
semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007058921A
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English (en)
Japanese (ja)
Other versions
JP2008226912A (ja
JP2008226912A5 (https=
Inventor
守 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
On Semiconductor Trading Ltd
Original Assignee
On Semiconductor Trading Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Semiconductor Trading Ltd filed Critical On Semiconductor Trading Ltd
Priority to JP2007058921A priority Critical patent/JP5026112B2/ja
Publication of JP2008226912A publication Critical patent/JP2008226912A/ja
Publication of JP2008226912A5 publication Critical patent/JP2008226912A5/ja
Application granted granted Critical
Publication of JP5026112B2 publication Critical patent/JP5026112B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2007058921A 2007-03-08 2007-03-08 半導体装置の製造方法。 Expired - Fee Related JP5026112B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007058921A JP5026112B2 (ja) 2007-03-08 2007-03-08 半導体装置の製造方法。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007058921A JP5026112B2 (ja) 2007-03-08 2007-03-08 半導体装置の製造方法。

Publications (3)

Publication Number Publication Date
JP2008226912A JP2008226912A (ja) 2008-09-25
JP2008226912A5 JP2008226912A5 (https=) 2010-04-15
JP5026112B2 true JP5026112B2 (ja) 2012-09-12

Family

ID=39845222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007058921A Expired - Fee Related JP5026112B2 (ja) 2007-03-08 2007-03-08 半導体装置の製造方法。

Country Status (1)

Country Link
JP (1) JP5026112B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026113B2 (ja) * 2007-03-08 2012-09-12 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法。
JP5996873B2 (ja) * 2012-01-19 2016-09-21 新電元工業株式会社 半導体装置の製造方法、半導体装置及び接続子

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766357A (ja) * 1993-08-25 1995-03-10 Toshiba Corp リ−ドフレ−ムとその製造方法、及び、このリ−ドフレ−ムを用いた半導体装置
JPH1074793A (ja) * 1996-08-30 1998-03-17 Sony Corp 半導体装置と、半導体装置の製造方法と、半導体製造装置
JP3898459B2 (ja) * 2001-04-18 2007-03-28 加賀東芝エレクトロニクス株式会社 半導体装置の製造方法
JP2006032873A (ja) * 2004-07-22 2006-02-02 Toshiba Corp ストラップボンディング装置及びストラップボンディング方法

Also Published As

Publication number Publication date
JP2008226912A (ja) 2008-09-25

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