JP5025291B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5025291B2 JP5025291B2 JP2007059653A JP2007059653A JP5025291B2 JP 5025291 B2 JP5025291 B2 JP 5025291B2 JP 2007059653 A JP2007059653 A JP 2007059653A JP 2007059653 A JP2007059653 A JP 2007059653A JP 5025291 B2 JP5025291 B2 JP 5025291B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- antenna
- battery
- terminal
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Near-Field Transmission Systems (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007059653A JP5025291B2 (ja) | 2006-03-10 | 2007-03-09 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006066811 | 2006-03-10 | ||
| JP2006066811 | 2006-03-10 | ||
| JP2007059653A JP5025291B2 (ja) | 2006-03-10 | 2007-03-09 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007272882A JP2007272882A (ja) | 2007-10-18 |
| JP2007272882A5 JP2007272882A5 (enExample) | 2010-03-11 |
| JP5025291B2 true JP5025291B2 (ja) | 2012-09-12 |
Family
ID=38509429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007059653A Expired - Fee Related JP5025291B2 (ja) | 2006-03-10 | 2007-03-09 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8854191B2 (enExample) |
| JP (1) | JP5025291B2 (enExample) |
| KR (1) | KR101362954B1 (enExample) |
| CN (2) | CN102360442B (enExample) |
| WO (1) | WO2007105605A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101391816B1 (ko) * | 2013-01-16 | 2014-05-07 | 숭실대학교산학협력단 | 무선 전력 제어 장치 및 이를 이용한 3차원 무선 칩 패키지 |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US8394522B2 (en) | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
| US7993773B2 (en) * | 2002-08-09 | 2011-08-09 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US8404376B2 (en) * | 2002-08-09 | 2013-03-26 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| US8236443B2 (en) | 2002-08-09 | 2012-08-07 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US20070264564A1 (en) | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
| CN101278534B (zh) * | 2005-08-11 | 2011-06-08 | 株式会社半导体能源研究所 | 半导体器件和无线通信系统 |
| US8018323B2 (en) * | 2006-01-30 | 2011-09-13 | Baohua Qi | RFID sensor device based on pulse-processing |
| KR101299932B1 (ko) * | 2006-03-10 | 2013-08-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP2002383B1 (en) | 2006-03-15 | 2012-04-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8013714B2 (en) * | 2006-03-27 | 2011-09-06 | Baohua Qi | RFID sensor using pulse processing |
| US8132026B2 (en) * | 2006-06-02 | 2012-03-06 | Semiconductor Energy Laboratory Co., Ltd. | Power storage device and mobile electronic device having the same |
| US7965180B2 (en) | 2006-09-28 | 2011-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Wireless sensor device |
| US7791012B2 (en) * | 2006-09-29 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising photoelectric conversion element and high-potential and low-potential electrodes |
| US8044813B1 (en) * | 2006-11-16 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Radio field intensity measurement device, and radio field intensity detector and game console using the same |
| JP2008161045A (ja) * | 2006-11-28 | 2008-07-10 | Semiconductor Energy Lab Co Ltd | 半導体装置及び当該半導体装置の充電方法、並びに当該半導体装置を用いた通信システム |
| JP5100355B2 (ja) | 2006-12-22 | 2012-12-19 | 株式会社半導体エネルギー研究所 | 温度制御装置 |
| JP5412034B2 (ja) * | 2006-12-26 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5161552B2 (ja) | 2006-12-26 | 2013-03-13 | 株式会社半導体エネルギー研究所 | 半導体メモリ装置及び半導体装置 |
| JP5210613B2 (ja) * | 2006-12-27 | 2013-06-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8143844B2 (en) * | 2007-01-19 | 2012-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Charging device |
| US8026795B2 (en) * | 2007-02-22 | 2011-09-27 | Baohua Qi | RFID sensor array and sensor group based on pulse-processing |
| US7750852B2 (en) | 2007-04-13 | 2010-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8035484B2 (en) * | 2007-05-31 | 2011-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and IC label, IC tag, and IC card provided with the semiconductor device |
| KR20120102173A (ko) * | 2007-09-13 | 2012-09-17 | 퀄컴 인코포레이티드 | 무선 전력 인가를 위한 안테나 |
| JP2009087928A (ja) * | 2007-09-13 | 2009-04-23 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US8559890B2 (en) | 2007-11-19 | 2013-10-15 | Nxp B.V. | Transceiving circuit for contactless communication |
| US8855343B2 (en) * | 2007-11-27 | 2014-10-07 | Personics Holdings, LLC. | Method and device to maintain audio content level reproduction |
| US9334557B2 (en) | 2007-12-21 | 2016-05-10 | Sapurast Research Llc | Method for sputter targets for electrolyte films |
| US8518581B2 (en) * | 2008-01-11 | 2013-08-27 | Inifinite Power Solutions, Inc. | Thin film encapsulation for thin film batteries and other devices |
| US8207853B2 (en) * | 2008-01-14 | 2012-06-26 | Avery Dennison Corporation | Hybrid sensor/communication device, and method |
| EP2266183B1 (en) | 2008-04-02 | 2018-12-12 | Sapurast Research LLC | Passive over/under voltage control and protection for energy storage devices associated with energy harvesting |
| JP5306705B2 (ja) * | 2008-05-23 | 2013-10-02 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5220507B2 (ja) * | 2008-07-30 | 2013-06-26 | 京セラ株式会社 | 携帯端末装置 |
| CN102119454B (zh) | 2008-08-11 | 2014-07-30 | 无穷动力解决方案股份有限公司 | 具有用于电磁能量收集的一体收集器表面的能量设备及其方法 |
| CN102150185B (zh) * | 2008-09-12 | 2014-05-28 | 无穷动力解决方案股份有限公司 | 具有经由电磁能进行数据通信的组成导电表面的能量装置及其方法 |
| WO2010032602A1 (en) * | 2008-09-18 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010042594A1 (en) | 2008-10-08 | 2010-04-15 | Infinite Power Solutions, Inc. | Environmentally-powered wireless sensor module |
| EP2345145B1 (en) * | 2008-10-08 | 2016-05-25 | Sapurast Research LLC | Foot-powered footwear-embedded sensor-transceiver |
| JP4769972B2 (ja) * | 2009-03-27 | 2011-09-07 | 日本電気株式会社 | 無線通信装置及び無線通信方法 |
| US8599572B2 (en) | 2009-09-01 | 2013-12-03 | Infinite Power Solutions, Inc. | Printed circuit board with integrated thin film battery |
| US20110300432A1 (en) | 2010-06-07 | 2011-12-08 | Snyder Shawn W | Rechargeable, High-Density Electrochemical Device |
| WO2012014787A1 (en) | 2010-07-28 | 2012-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Wireless power feeding system and wireless power feeding method |
| JP5755067B2 (ja) | 2010-07-30 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 無線給電システム、及び無線給電方法 |
| JP5755066B2 (ja) | 2010-07-30 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 無線給電システム、及び無線給電方法 |
| US9391476B2 (en) | 2010-09-09 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding device, wireless power feeding system using the same and wireless power feeding method |
| WO2012070634A1 (en) | 2010-11-26 | 2012-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Power transmission device and wireless power transmission system including the same |
| US9054544B2 (en) | 2010-12-22 | 2015-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding device, power receiving device, and wireless power feed system |
| US9065302B2 (en) | 2010-12-24 | 2015-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Wireless power feeding system |
| KR20120084659A (ko) | 2011-01-20 | 2012-07-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 급전 장치 및 비접촉 급전 시스템 |
| US9325205B2 (en) | 2011-03-04 | 2016-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for driving power supply system |
| JP5780894B2 (ja) | 2011-09-16 | 2015-09-16 | 株式会社半導体エネルギー研究所 | 非接触給電システム |
| CN103022012B (zh) * | 2011-09-21 | 2017-03-01 | 株式会社半导体能源研究所 | 半导体存储装置 |
| JP2013078171A (ja) | 2011-09-29 | 2013-04-25 | Semiconductor Energy Lab Co Ltd | 受電装置及び非接触給電システム |
| JP6016596B2 (ja) | 2011-12-07 | 2016-10-26 | 株式会社半導体エネルギー研究所 | 非接触給電システム |
| TWI613882B (zh) | 2011-12-16 | 2018-02-01 | 半導體能源研究所股份有限公司 | 直流對直流轉換器、受電裝置及供電系統 |
| JP6088234B2 (ja) | 2011-12-23 | 2017-03-01 | 株式会社半導体エネルギー研究所 | 受電装置、無線給電システム |
| US9391674B2 (en) | 2012-04-26 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power feeding system and power feeding method |
| US9390850B2 (en) | 2012-07-13 | 2016-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Power transmitting device, power feeding system, and power feeding method |
| DE102013109221B4 (de) * | 2013-08-26 | 2022-05-19 | Infineon Technologies Ag | Chip-Anordnung, Analysevorrichtung, Aufnahmebehälter, und Aufnahmebehältersystem |
| WO2019048981A1 (ja) | 2017-09-06 | 2019-03-14 | 株式会社半導体エネルギー研究所 | 半導体装置、バッテリーユニット、バッテリーモジュール |
| US12387076B2 (en) * | 2022-02-25 | 2025-08-12 | Onecent Technology (Singapore) Pte. Ltd. | RFID tag with twin IC design for generating omnidirectional radiation pattern without null |
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| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| JPH0869513A (ja) * | 1994-08-30 | 1996-03-12 | Mitsubishi Denki Semiconductor Software Kk | 非接触icカード |
| DE19547684A1 (de) * | 1995-12-20 | 1997-06-26 | Philips Patentverwaltung | Verfahren und Anordnung zum kontaktlosen Übertragen |
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| JP2000090221A (ja) * | 1998-09-09 | 2000-03-31 | Hitachi Maxell Ltd | 非接触型icカード |
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| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
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| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
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| JP4498669B2 (ja) * | 2001-10-30 | 2010-07-07 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、及びそれらを具備する電子機器 |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| CN2552693Y (zh) * | 2002-07-11 | 2003-05-28 | 焦林 | 一种带有绝缘封边的电池标签 |
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| KR101019337B1 (ko) | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
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| KR101358954B1 (ko) | 2005-11-15 | 2014-02-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
| TWI292281B (en) * | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
-
2007
- 2007-03-02 KR KR1020087024818A patent/KR101362954B1/ko not_active Expired - Fee Related
- 2007-03-02 CN CN201110291153.2A patent/CN102360442B/zh not_active Expired - Fee Related
- 2007-03-02 CN CN2007800081238A patent/CN101395617B/zh not_active Expired - Fee Related
- 2007-03-02 WO PCT/JP2007/054605 patent/WO2007105605A1/en not_active Ceased
- 2007-03-09 JP JP2007059653A patent/JP5025291B2/ja not_active Expired - Fee Related
- 2007-03-09 US US11/716,042 patent/US8854191B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101391816B1 (ko) * | 2013-01-16 | 2014-05-07 | 숭실대학교산학협력단 | 무선 전력 제어 장치 및 이를 이용한 3차원 무선 칩 패키지 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101395617B (zh) | 2012-05-30 |
| CN102360442B (zh) | 2015-01-07 |
| CN102360442A (zh) | 2012-02-22 |
| US20070229228A1 (en) | 2007-10-04 |
| KR101362954B1 (ko) | 2014-02-12 |
| KR20080104365A (ko) | 2008-12-02 |
| CN101395617A (zh) | 2009-03-25 |
| JP2007272882A (ja) | 2007-10-18 |
| US8854191B2 (en) | 2014-10-07 |
| WO2007105605A1 (en) | 2007-09-20 |
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| HK1128099B (en) | Semiconductor device |
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