JP5023781B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5023781B2
JP5023781B2 JP2007106386A JP2007106386A JP5023781B2 JP 5023781 B2 JP5023781 B2 JP 5023781B2 JP 2007106386 A JP2007106386 A JP 2007106386A JP 2007106386 A JP2007106386 A JP 2007106386A JP 5023781 B2 JP5023781 B2 JP 5023781B2
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JP
Japan
Prior art keywords
light emitting
metal member
emitting device
wire
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007106386A
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English (en)
Japanese (ja)
Other versions
JP2008147611A (ja
JP2008147611A5 (enExample
Inventor
宏明 宇川
義尚 板東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2007106386A priority Critical patent/JP5023781B2/ja
Publication of JP2008147611A publication Critical patent/JP2008147611A/ja
Publication of JP2008147611A5 publication Critical patent/JP2008147611A5/ja
Application granted granted Critical
Publication of JP5023781B2 publication Critical patent/JP5023781B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Led Device Packages (AREA)
JP2007106386A 2006-11-13 2007-04-13 発光装置 Active JP5023781B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006306996 2006-11-13
JP2006306996 2006-11-13
JP2007106386A JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Publications (3)

Publication Number Publication Date
JP2008147611A JP2008147611A (ja) 2008-06-26
JP2008147611A5 JP2008147611A5 (enExample) 2010-05-20
JP5023781B2 true JP5023781B2 (ja) 2012-09-12

Family

ID=39607406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007106386A Active JP5023781B2 (ja) 2006-11-13 2007-04-13 発光装置

Country Status (1)

Country Link
JP (1) JP5023781B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8710525B2 (en) * 2010-03-15 2014-04-29 Nichia Corporation Light emitting device
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP5941249B2 (ja) * 2011-02-02 2016-06-29 日亜化学工業株式会社 発光装置
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
JP2013004905A (ja) * 2011-06-21 2013-01-07 Mitsubishi Chemicals Corp 半導体発光装置用パッケージ及び半導体発光装置
KR101957884B1 (ko) * 2012-05-14 2019-03-13 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 조명 장치
JP5732619B2 (ja) * 2012-06-27 2015-06-10 パナソニックＩｐマネジメント株式会社 発光装置及びそれを用いた照明装置
CN103904207A (zh) * 2014-04-04 2014-07-02 利亚德光电股份有限公司 晶片电路
DE102017100165A1 (de) 2017-01-05 2018-07-05 Jabil Optics Germany GmbH Lichtemittierende Anordnung und lichtemittierendes System
KR102261288B1 (ko) * 2017-03-14 2021-06-04 현대자동차 주식회사 자동차 외장용 발광다이오드 패키지
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP7054008B2 (ja) * 2019-08-27 2022-04-13 日亜化学工業株式会社 発光装置の製造方法
JP7752009B2 (ja) * 2021-09-24 2025-10-09 スタンレー電気株式会社 発光装置及び発光装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332809B2 (ja) * 1997-07-10 2002-10-07 三洋電機株式会社 光素子
JP3472450B2 (ja) * 1997-09-04 2003-12-02 シャープ株式会社 発光装置
JP3908383B2 (ja) * 1998-05-29 2007-04-25 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
JP2008147611A (ja) 2008-06-26

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