JP5023734B2 - 圧電振動片の製造方法及び圧電振動素子 - Google Patents
圧電振動片の製造方法及び圧電振動素子 Download PDFInfo
- Publication number
- JP5023734B2 JP5023734B2 JP2007040432A JP2007040432A JP5023734B2 JP 5023734 B2 JP5023734 B2 JP 5023734B2 JP 2007040432 A JP2007040432 A JP 2007040432A JP 2007040432 A JP2007040432 A JP 2007040432A JP 5023734 B2 JP5023734 B2 JP 5023734B2
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- JP
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- Prior art keywords
- piezoelectric
- substrate
- etching
- vibrating piece
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 42
- 238000000034 method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims description 126
- 238000005530 etching Methods 0.000 claims description 51
- 239000010409 thin film Substances 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 description 63
- 239000010453 quartz Substances 0.000 description 52
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- 230000005684 electric field Effects 0.000 description 10
- 230000001133 acceleration Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000154 gallium phosphate Inorganic materials 0.000 description 1
- LWFNJDOYCSNXDO-UHFFFAOYSA-K gallium;phosphate Chemical compound [Ga+3].[O-]P([O-])([O-])=O LWFNJDOYCSNXDO-UHFFFAOYSA-K 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007040432A JP5023734B2 (ja) | 2007-02-21 | 2007-02-21 | 圧電振動片の製造方法及び圧電振動素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007040432A JP5023734B2 (ja) | 2007-02-21 | 2007-02-21 | 圧電振動片の製造方法及び圧電振動素子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008205888A JP2008205888A (ja) | 2008-09-04 |
JP2008205888A5 JP2008205888A5 (enrdf_load_stackoverflow) | 2010-04-02 |
JP5023734B2 true JP5023734B2 (ja) | 2012-09-12 |
Family
ID=39782880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007040432A Expired - Fee Related JP5023734B2 (ja) | 2007-02-21 | 2007-02-21 | 圧電振動片の製造方法及び圧電振動素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5023734B2 (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5347546B2 (ja) * | 2009-02-12 | 2013-11-20 | セイコーエプソン株式会社 | 振動片、振動片の製造方法および振動子 |
JP2010187195A (ja) * | 2009-02-12 | 2010-08-26 | Epson Toyocom Corp | 振動片、振動片の製造方法および振動子 |
JP5786393B2 (ja) * | 2011-03-18 | 2015-09-30 | 株式会社村田製作所 | 水晶デバイスの製造方法 |
JP6110663B2 (ja) * | 2012-12-28 | 2017-04-05 | 京セラクリスタルデバイス株式会社 | 水晶振動子の製造方法 |
JP6004957B2 (ja) * | 2013-01-31 | 2016-10-12 | 京セラクリスタルデバイス株式会社 | 水晶振動子及びその製造方法 |
CN105409119B (zh) * | 2013-07-25 | 2019-04-26 | 日本碍子株式会社 | 复合基板及其制造方法 |
JP6528878B2 (ja) * | 2018-03-22 | 2019-06-12 | セイコーエプソン株式会社 | 電子デバイス、電子機器および移動体 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5866410A (ja) * | 1981-10-16 | 1983-04-20 | Seiko Instr & Electronics Ltd | 音又型屈曲水晶振動子 |
JPH06196963A (ja) * | 1992-10-20 | 1994-07-15 | Matsushita Electric Ind Co Ltd | 圧電フィルタとその製造方法 |
JPH0746072A (ja) * | 1993-08-03 | 1995-02-14 | Matsushita Electric Ind Co Ltd | 水晶振動子の製造方法 |
JPH0750438A (ja) * | 1993-08-04 | 1995-02-21 | Matsushita Electric Ind Co Ltd | 薄板素材の製造方法 |
JPH10308640A (ja) * | 1997-05-07 | 1998-11-17 | Matsushita Electric Ind Co Ltd | 圧電デバイスの製造方法 |
JP3972790B2 (ja) * | 2001-11-27 | 2007-09-05 | 松下電器産業株式会社 | 薄膜微小機械式共振子および薄膜微小機械式共振子ジャイロ |
JP4316903B2 (ja) * | 2003-03-11 | 2009-08-19 | リバーエレテック株式会社 | 屈曲振動子 |
JP4515180B2 (ja) * | 2004-07-20 | 2010-07-28 | Necトーキン株式会社 | 音叉型圧電振動ジャイロ装置 |
US20060255691A1 (en) * | 2005-03-30 | 2006-11-16 | Takahiro Kuroda | Piezoelectric resonator and manufacturing method thereof |
-
2007
- 2007-02-21 JP JP2007040432A patent/JP5023734B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2008205888A (ja) | 2008-09-04 |
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