JP5016313B2 - 発光ダイオードパッケージの製造方法 - Google Patents
発光ダイオードパッケージの製造方法 Download PDFInfo
- Publication number
- JP5016313B2 JP5016313B2 JP2007000493A JP2007000493A JP5016313B2 JP 5016313 B2 JP5016313 B2 JP 5016313B2 JP 2007000493 A JP2007000493 A JP 2007000493A JP 2007000493 A JP2007000493 A JP 2007000493A JP 5016313 B2 JP5016313 B2 JP 5016313B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- transparent resin
- resin
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 abstract description 7
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M27/00—Apparatus for treating combustion-air, fuel, or fuel-air mixture, by catalysts, electric means, magnetism, rays, sound waves, or the like
- F02M27/04—Apparatus for treating combustion-air, fuel, or fuel-air mixture, by catalysts, electric means, magnetism, rays, sound waves, or the like by electric means, ionisation, polarisation or magnetism
- F02M27/045—Apparatus for treating combustion-air, fuel, or fuel-air mixture, by catalysts, electric means, magnetism, rays, sound waves, or the like by electric means, ionisation, polarisation or magnetism by permanent magnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/36—Feeding the material on to the mould, core or other substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/50—Shaping under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00019—Production of simple or compound lenses with non-spherical faces, e.g. toric faces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00365—Production of microlenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B51/00—Other methods of operating engines involving pretreating of, or adding substances to, combustion air, fuel, or fuel-air mixture of the engines
- F02B51/04—Other methods of operating engines involving pretreating of, or adding substances to, combustion air, fuel, or fuel-air mixture of the engines involving electricity or magnetism
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Led Device Packages (AREA)
Description
20 発光ダイオード本体
22、122 基部
24、124 リード
26、126 LEDチップ
28、128 ワイヤ
30 透明封止体
36 金型
38 樹脂
40、140 レンズ
42 接着剤
100 発光ダイオードパッケージ
120 発光ダイオードパッケージ本体
130 弾性封止体
134 インジェクタ
136 透明樹脂
138、138b 半球型透明樹脂
150 支持台
Claims (4)
- (イ)上面に凹部が形成された基部にリードを設け、前記リードにLEDチップを装着し電気的に繋がるようにした後、前記凹部に透明な弾性樹脂を満たし発光ダイオード本体を形成する段階と、
(ロ)前記発光ダイオード本体の上部に透明な樹脂を吐出する透明樹脂吐出段階と、
(ハ)前記(ロ)段階で得た構造を逆置きにした状態で、前記透明樹脂を硬化させ前記発光ダイオード本体と一体となったレンズを形成する透明樹脂硬化段階と、
を含み、
前記(ハ)透明樹脂硬化段階は、前記(ロ)段階で得た構造を硬化チャンバーに入れ、内部圧力を大気圧に比べ降下させた状態で行うことで、硬化前の前記透明樹脂よりも下方に膨らんだ半球形の凸レンズを形成し、前記凸レンズは、一定の曲率を有し且つサグが変化するように、前記内部圧力の降下の値が調節されることを特徴とする発光ダイオードパッケージの製造方法。 - 圧力降下の値は、大気圧から0.03以上、0.09Mpa以下であることを特徴とする、請求項1記載の発光ダイオードパッケージの製造方法。
- 前記透明樹脂は、弾性樹脂であることを特徴とする、請求項1又は請求項2に記載の発光ダイオードパッケージの製造方法。
- 前記透明樹脂は、前記発光ダイオード本体の弾性樹脂と同材であることを特徴とする、請求項1から請求項3の何れかに記載の発光ダイオードパッケージの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0001519 | 2006-01-05 | ||
KR1020060001519A KR100665365B1 (ko) | 2006-01-05 | 2006-01-05 | 발광다이오드 패키지 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007184616A JP2007184616A (ja) | 2007-07-19 |
JP5016313B2 true JP5016313B2 (ja) | 2012-09-05 |
Family
ID=37867085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007000493A Expired - Fee Related JP5016313B2 (ja) | 2006-01-05 | 2007-01-05 | 発光ダイオードパッケージの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070155033A1 (ja) |
JP (1) | JP5016313B2 (ja) |
KR (1) | KR100665365B1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100870065B1 (ko) * | 2007-04-11 | 2008-11-24 | 알티전자 주식회사 | 엘이디 패키지용 렌즈 제조방법 |
TWI419378B (zh) * | 2009-11-05 | 2013-12-11 | Advanced Optoelectronic Tech | 發光二極體封裝方法及其治具 |
EP2323186B1 (en) * | 2009-11-13 | 2017-07-26 | Tridonic Jennersdorf GmbH | Light-emitting diode module and corresponding manufacturing method |
IT1402806B1 (it) * | 2010-11-29 | 2013-09-18 | St Microelectronics Srl | Dispositivo fotomoltiplicatore incapsulato di materiale semiconduttore, in particolare per l'utilizzo in macchine per l'esecuzione della tomografia ad emissione di positroni. |
JP5923850B2 (ja) * | 2010-11-30 | 2016-05-25 | サンユレック株式会社 | オプトデバイスの製造方法 |
JP5988073B2 (ja) * | 2011-11-01 | 2016-09-07 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
CN103296183A (zh) * | 2013-05-28 | 2013-09-11 | 惠州市大亚湾永昶电子工业有限公司 | 温度与胶量控制的led透镜成型方法 |
KR102227774B1 (ko) | 2014-10-23 | 2021-03-16 | 삼성전자주식회사 | 발광다이오드 패키지 제조방법 |
DE102015107516A1 (de) * | 2015-05-13 | 2016-11-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen einer Linse für eine optoelektronische Leuchtvorrichtung |
CN107452855B (zh) * | 2017-08-17 | 2018-05-29 | 旭宇光电(深圳)股份有限公司 | 贴片led无模封装方法 |
CN109411587B (zh) * | 2018-12-10 | 2020-11-27 | 浙江单色电子科技有限公司 | 一种含硅胶透镜的紫光led生产方法及其紫光led |
EP3792046A1 (de) * | 2019-09-12 | 2021-03-17 | Technische Hochschule Wildau | Verfahren zur herstellung asymmetrischer oder asphärischer linsen sowie leuchteinheit mit einer derart hergestellten linse |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US4034466A (en) * | 1974-09-03 | 1977-07-12 | Motorola, Inc. | Package and method for a semiconductor radiant energy emitting device |
US4304466A (en) * | 1978-09-11 | 1981-12-08 | Vivitar Corporation | Zoom lens |
JPH0677540A (ja) * | 1992-08-24 | 1994-03-18 | Sanyo Electric Co Ltd | 光半導体装置 |
JP3521469B2 (ja) * | 1994-03-08 | 2004-04-19 | 日本板硝子株式会社 | 樹脂製レンズアレイおよびその製造方法 |
JPH08236654A (ja) * | 1995-02-23 | 1996-09-13 | Matsushita Electric Ind Co Ltd | チップキャリアとその製造方法 |
JPH10284646A (ja) * | 1997-04-08 | 1998-10-23 | Mitsubishi Electric Corp | 半導体デバイス及びその製造方法 |
JP2003234511A (ja) * | 2002-02-06 | 2003-08-22 | Toshiba Corp | 半導体発光素子およびその製造方法 |
US7084472B2 (en) * | 2002-07-09 | 2006-08-01 | Toppan Printing Co., Ltd. | Solid-state imaging device and manufacturing method therefor |
EP1484802B1 (en) * | 2003-06-06 | 2018-06-13 | Stanley Electric Co., Ltd. | Optical semiconductor device |
JP4329514B2 (ja) * | 2003-12-02 | 2009-09-09 | 富士ゼロックス株式会社 | マイクロレンズアレイ及びその製造方法 |
US20050281980A1 (en) * | 2004-06-22 | 2005-12-22 | Cruz Jose A | Vacuum pressure bag for use with large scale composite structures |
JP4922555B2 (ja) * | 2004-09-24 | 2012-04-25 | スタンレー電気株式会社 | Led装置 |
WO2006043422A1 (ja) * | 2004-10-19 | 2006-04-27 | Nichia Corporation | 半導体素子 |
CN1815269A (zh) * | 2005-01-31 | 2006-08-09 | 株式会社有泽制作所 | 镜片制造方法 |
JP4667094B2 (ja) * | 2005-03-18 | 2011-04-06 | 富士通株式会社 | 電子装置の製造方法 |
TWI297784B (en) * | 2005-09-22 | 2008-06-11 | Lite On Technology Corp | Optical module having a lens formed without contacting a reflector and method of manufacturing the same |
-
2006
- 2006-01-05 KR KR1020060001519A patent/KR100665365B1/ko not_active IP Right Cessation
-
2007
- 2007-01-05 JP JP2007000493A patent/JP5016313B2/ja not_active Expired - Fee Related
- 2007-01-05 US US11/649,914 patent/US20070155033A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20070155033A1 (en) | 2007-07-05 |
JP2007184616A (ja) | 2007-07-19 |
KR100665365B1 (ko) | 2007-01-09 |
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LAPS | Cancellation because of no payment of annual fees |