JP5011048B2 - 脆性材料基板の加工方法 - Google Patents

脆性材料基板の加工方法 Download PDF

Info

Publication number
JP5011048B2
JP5011048B2 JP2007252093A JP2007252093A JP5011048B2 JP 5011048 B2 JP5011048 B2 JP 5011048B2 JP 2007252093 A JP2007252093 A JP 2007252093A JP 2007252093 A JP2007252093 A JP 2007252093A JP 5011048 B2 JP5011048 B2 JP 5011048B2
Authority
JP
Japan
Prior art keywords
cooling
spot
substrate
temperature
beam spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007252093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009083119A5 (cg-RX-API-DMAC7.html
JP2009083119A (ja
Inventor
淳史 井村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2007252093A priority Critical patent/JP5011048B2/ja
Priority to TW097125517A priority patent/TWI406828B/zh
Priority to KR1020080072120A priority patent/KR101135436B1/ko
Priority to CN2008101491908A priority patent/CN101396771B/zh
Publication of JP2009083119A publication Critical patent/JP2009083119A/ja
Publication of JP2009083119A5 publication Critical patent/JP2009083119A5/ja
Application granted granted Critical
Publication of JP5011048B2 publication Critical patent/JP5011048B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP2007252093A 2007-09-27 2007-09-27 脆性材料基板の加工方法 Expired - Fee Related JP5011048B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法
TW097125517A TWI406828B (zh) 2007-09-27 2008-07-07 Method for processing brittle material substrates
KR1020080072120A KR101135436B1 (ko) 2007-09-27 2008-07-24 취성재료기판의 가공방법
CN2008101491908A CN101396771B (zh) 2007-09-27 2008-09-19 脆性材料基板的加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法

Publications (3)

Publication Number Publication Date
JP2009083119A JP2009083119A (ja) 2009-04-23
JP2009083119A5 JP2009083119A5 (cg-RX-API-DMAC7.html) 2010-10-14
JP5011048B2 true JP5011048B2 (ja) 2012-08-29

Family

ID=40515743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007252093A Expired - Fee Related JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法

Country Status (4)

Country Link
JP (1) JP5011048B2 (cg-RX-API-DMAC7.html)
KR (1) KR101135436B1 (cg-RX-API-DMAC7.html)
CN (1) CN101396771B (cg-RX-API-DMAC7.html)
TW (1) TWI406828B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079690A (ja) * 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP5558129B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP5558128B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
TWI400137B (zh) * 2010-12-17 2013-07-01 Ind Tech Res Inst 移除玻璃板材邊緣缺陷之裝置及其方法
CN102643017B (zh) * 2011-03-14 2014-09-10 京东方科技集团股份有限公司 非接触式裂片方法、设备及切割和裂片的方法、设备
DE102012210527A1 (de) * 2012-06-21 2013-12-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Diode und Diode
EP2918558B1 (en) * 2012-11-09 2018-02-21 Nippon Electric Glass Co., Ltd. Initial crack formation method
KR20150084758A (ko) * 2012-11-13 2015-07-22 니폰 덴키 가라스 가부시키가이샤 판 유리의 제조 방법 및 제조 장치
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
JP2016166120A (ja) * 2015-03-06 2016-09-15 三星ダイヤモンド工業株式会社 積層基板の加工方法及びレーザ光による積層基板の加工装置
CN113828941B (zh) * 2021-10-15 2022-05-13 华中科技大学 一种基于复合材料微米级高速识别的加工方法及装置
CN118649750B (zh) * 2024-07-02 2026-06-19 江苏鑫华半导体科技股份有限公司 一种硅料破碎方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300418B1 (ko) * 1999-01-18 2001-09-22 김순택 비금속 재료의 절단방법 및 그 장치
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
JP4390937B2 (ja) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 ガラス板分割方法及び装置
WO2003008352A1 (fr) * 2001-07-18 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procede destines au traçage d'un substrat en materiau fragile
JP2004536759A (ja) * 2001-07-25 2004-12-09 ヴラディミア シュテファノヴィッチ コンドラテンコ もろい非金属材料を切る方法
TWI277612B (en) * 2002-08-09 2007-04-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
JP2005536428A (ja) * 2002-08-21 2005-12-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 脆性基板の切断方法
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
CN1929978A (zh) * 2004-04-27 2007-03-14 三星钻石工业股份有限公司 脆性基板的垂直裂痕形成方法及垂直裂痕形成装置
JP2008503355A (ja) * 2004-06-21 2008-02-07 アプライド フォトニクス，インク． 基板材料の切断、分断または分割装置、システムおよび方法
US20080061043A1 (en) * 2004-10-01 2008-03-13 Masahiro Fujii Scribing Method for Brittle Material and Scribing Apparatus
CN100475419C (zh) 2004-10-25 2009-04-08 三星钻石工业股份有限公司 裂痕形成方法及裂痕形成装置
JP2007055000A (ja) * 2005-08-23 2007-03-08 Japan Steel Works Ltd:The 非金属材料製の被加工物の切断方法及びその装置
JP2007090860A (ja) * 2005-09-01 2007-04-12 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法

Also Published As

Publication number Publication date
TW200914385A (en) 2009-04-01
KR101135436B1 (ko) 2012-04-13
KR20090032949A (ko) 2009-04-01
TWI406828B (zh) 2013-09-01
JP2009083119A (ja) 2009-04-23
CN101396771B (zh) 2013-05-08
CN101396771A (zh) 2009-04-01

Similar Documents

Publication Publication Date Title
JP2009083119A (ja) 脆性材料基板の加工方法
CN102026926B (zh) 脆性材料基板的加工方法
JP5314674B2 (ja) 脆性材料基板の加工方法
JP5193326B2 (ja) 基板加工装置および基板加工方法
KR101190173B1 (ko) 취성 재료 기판의 분단 방법
TWI587959B (zh) Lamination method of substrate and processing device
JP5050099B2 (ja) 脆性材料基板の加工方法
TWI488703B (zh) 脆性材料基板的切割方法及切割裝置
JP2011230940A (ja) 脆性材料基板の割断方法
JP4080484B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
CN1264768C (zh) 脆性材料基片的划线装置以及划线方法
JP2010150068A (ja) 脆性材料基板の割断方法
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
WO2013094059A1 (ja) 脆性材料基板の割断方法
WO2009128315A1 (ja) 脆性材料基板の加工方法
WO2010092964A1 (ja) 脆性材料基板の割断方法
JP2010253752A (ja) 脆性材料の割断装置および脆性材料の割断方法
JP5444158B2 (ja) 脆性材料基板の割断方法
JP5554158B2 (ja) 脆性材料基板の割断方法
KR100408534B1 (ko) 비금속 재료의 절단방법 및 절단장치
JP2023180693A (ja) シリコン基板の基板分断方法および基板分断装置
JP2011201200A (ja) 脆性材料基板のレーザ加工方法

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090904

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100827

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100827

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120330

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120508

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120604

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150608

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees