KR101135436B1 - 취성재료기판의 가공방법 - Google Patents

취성재료기판의 가공방법 Download PDF

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Publication number
KR101135436B1
KR101135436B1 KR1020080072120A KR20080072120A KR101135436B1 KR 101135436 B1 KR101135436 B1 KR 101135436B1 KR 1020080072120 A KR1020080072120 A KR 1020080072120A KR 20080072120 A KR20080072120 A KR 20080072120A KR 101135436 B1 KR101135436 B1 KR 101135436B1
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KR
South Korea
Prior art keywords
cooling
spot
substrate
beam spot
crack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080072120A
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English (en)
Korean (ko)
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KR20090032949A (ko
Inventor
아쓰시 이무라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20090032949A publication Critical patent/KR20090032949A/ko
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Publication of KR101135436B1 publication Critical patent/KR101135436B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
KR1020080072120A 2007-09-27 2008-07-24 취성재료기판의 가공방법 Expired - Fee Related KR101135436B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00252093 2007-09-27
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
KR20090032949A KR20090032949A (ko) 2009-04-01
KR101135436B1 true KR101135436B1 (ko) 2012-04-13

Family

ID=40515743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080072120A Expired - Fee Related KR101135436B1 (ko) 2007-09-27 2008-07-24 취성재료기판의 가공방법

Country Status (4)

Country Link
JP (1) JP5011048B2 (cg-RX-API-DMAC7.html)
KR (1) KR101135436B1 (cg-RX-API-DMAC7.html)
CN (1) CN101396771B (cg-RX-API-DMAC7.html)
TW (1) TWI406828B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079690A (ja) * 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP5558129B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP5558128B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
TWI400137B (zh) * 2010-12-17 2013-07-01 Ind Tech Res Inst 移除玻璃板材邊緣缺陷之裝置及其方法
CN102643017B (zh) * 2011-03-14 2014-09-10 京东方科技集团股份有限公司 非接触式裂片方法、设备及切割和裂片的方法、设备
DE102012210527A1 (de) * 2012-06-21 2013-12-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Diode und Diode
EP2918558B1 (en) * 2012-11-09 2018-02-21 Nippon Electric Glass Co., Ltd. Initial crack formation method
KR20150084758A (ko) * 2012-11-13 2015-07-22 니폰 덴키 가라스 가부시키가이샤 판 유리의 제조 방법 및 제조 장치
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
JP2016166120A (ja) * 2015-03-06 2016-09-15 三星ダイヤモンド工業株式会社 積層基板の加工方法及びレーザ光による積層基板の加工装置
CN113828941B (zh) * 2021-10-15 2022-05-13 华中科技大学 一种基于复合材料微米级高速识别的加工方法及装置
CN118649750B (zh) * 2024-07-02 2026-06-19 江苏鑫华半导体科技股份有限公司 一种硅料破碎方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000051015A (ko) * 1999-01-18 2000-08-16 김순택 비금속 재료의 절단방법 및 그 장치
KR20040064003A (ko) * 2003-01-06 2004-07-16 로체 시스템즈(주) 유리판절단장치
KR100649894B1 (ko) 2002-08-09 2006-11-27 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 스크라이브 장치
KR100821937B1 (ko) 2004-10-25 2008-04-15 미쓰보시 다이야몬도 고교 가부시키가이샤 크랙 형성방법 및 크랙 형성장치

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DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
JP4390937B2 (ja) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 ガラス板分割方法及び装置
WO2003008352A1 (fr) * 2001-07-18 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procede destines au traçage d'un substrat en materiau fragile
JP2004536759A (ja) * 2001-07-25 2004-12-09 ヴラディミア シュテファノヴィッチ コンドラテンコ もろい非金属材料を切る方法
JP2005536428A (ja) * 2002-08-21 2005-12-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 脆性基板の切断方法
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
CN1929978A (zh) * 2004-04-27 2007-03-14 三星钻石工业股份有限公司 脆性基板的垂直裂痕形成方法及垂直裂痕形成装置
JP2008503355A (ja) * 2004-06-21 2008-02-07 アプライド フォトニクス，インク． 基板材料の切断、分断または分割装置、システムおよび方法
US20080061043A1 (en) * 2004-10-01 2008-03-13 Masahiro Fujii Scribing Method for Brittle Material and Scribing Apparatus
JP2007055000A (ja) * 2005-08-23 2007-03-08 Japan Steel Works Ltd:The 非金属材料製の被加工物の切断方法及びその装置
JP2007090860A (ja) * 2005-09-01 2007-04-12 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000051015A (ko) * 1999-01-18 2000-08-16 김순택 비금속 재료의 절단방법 및 그 장치
KR100649894B1 (ko) 2002-08-09 2006-11-27 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 스크라이브 장치
KR20040064003A (ko) * 2003-01-06 2004-07-16 로체 시스템즈(주) 유리판절단장치
KR100821937B1 (ko) 2004-10-25 2008-04-15 미쓰보시 다이야몬도 고교 가부시키가이샤 크랙 형성방법 및 크랙 형성장치

Also Published As

Publication number Publication date
TW200914385A (en) 2009-04-01
KR20090032949A (ko) 2009-04-01
TWI406828B (zh) 2013-09-01
JP2009083119A (ja) 2009-04-23
JP5011048B2 (ja) 2012-08-29
CN101396771B (zh) 2013-05-08
CN101396771A (zh) 2009-04-01

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