CN101396771B - 脆性材料基板的加工方法 - Google Patents

脆性材料基板的加工方法 Download PDF

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Publication number
CN101396771B
CN101396771B CN2008101491908A CN200810149190A CN101396771B CN 101396771 B CN101396771 B CN 101396771B CN 2008101491908 A CN2008101491908 A CN 2008101491908A CN 200810149190 A CN200810149190 A CN 200810149190A CN 101396771 B CN101396771 B CN 101396771B
Authority
CN
China
Prior art keywords
cooling
beam spot
temperature
substrate
crackle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101491908A
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English (en)
Chinese (zh)
Other versions
CN101396771A (zh
Inventor
井村淳史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN101396771A publication Critical patent/CN101396771A/zh
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Publication of CN101396771B publication Critical patent/CN101396771B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
CN2008101491908A 2007-09-27 2008-09-19 脆性材料基板的加工方法 Expired - Fee Related CN101396771B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-252093 2007-09-27
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法
JP2007252093 2007-09-27

Publications (2)

Publication Number Publication Date
CN101396771A CN101396771A (zh) 2009-04-01
CN101396771B true CN101396771B (zh) 2013-05-08

Family

ID=40515743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101491908A Expired - Fee Related CN101396771B (zh) 2007-09-27 2008-09-19 脆性材料基板的加工方法

Country Status (4)

Country Link
JP (1) JP5011048B2 (cg-RX-API-DMAC7.html)
KR (1) KR101135436B1 (cg-RX-API-DMAC7.html)
CN (1) CN101396771B (cg-RX-API-DMAC7.html)
TW (1) TWI406828B (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079690A (ja) * 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP5558129B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP5558128B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
TWI400137B (zh) * 2010-12-17 2013-07-01 Ind Tech Res Inst 移除玻璃板材邊緣缺陷之裝置及其方法
CN102643017B (zh) * 2011-03-14 2014-09-10 京东方科技集团股份有限公司 非接触式裂片方法、设备及切割和裂片的方法、设备
DE102012210527A1 (de) * 2012-06-21 2013-12-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Diode und Diode
EP2918558B1 (en) * 2012-11-09 2018-02-21 Nippon Electric Glass Co., Ltd. Initial crack formation method
KR20150084758A (ko) * 2012-11-13 2015-07-22 니폰 덴키 가라스 가부시키가이샤 판 유리의 제조 방법 및 제조 장치
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
JP2016166120A (ja) * 2015-03-06 2016-09-15 三星ダイヤモンド工業株式会社 積層基板の加工方法及びレーザ光による積層基板の加工装置
CN113828941B (zh) * 2021-10-15 2022-05-13 华中科技大学 一种基于复合材料微米级高速识别的加工方法及装置
CN118649750B (zh) * 2024-07-02 2026-06-19 江苏鑫华半导体科技股份有限公司 一种硅料破碎方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1414893A (zh) * 1999-10-29 2003-04-30 肖特玻璃厂 快速切割脆性材料制成的工件的方法和装置
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置
CN1525944A (zh) * 2001-07-18 2004-09-01 ������ҵ�ɷ����޹�˾ 脆性材料基片的划线装置以及划线方法
JP2005212473A (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置およびこの装置を用いたスクライブ方法
CN1675021A (zh) * 2002-08-21 2005-09-28 皇家飞利浦电子股份有限公司 折断脆性基材的方法
WO2006002168A1 (en) * 2004-06-21 2006-01-05 Applied Photonics, Inc. Device, system and method for cutting, cleaving or separating a substrate material
EP1741534A1 (en) * 2004-04-27 2007-01-10 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300418B1 (ko) * 1999-01-18 2001-09-22 김순택 비금속 재료의 절단방법 및 그 장치
JP4390937B2 (ja) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 ガラス板分割方法及び装置
JP2004536759A (ja) * 2001-07-25 2004-12-09 ヴラディミア シュテファノヴィッチ コンドラテンコ もろい非金属材料を切る方法
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
WO2004083133A2 (en) * 2003-03-21 2004-09-30 Rorze Systems Corporation Apparatus for cutting glass plate
US20080061043A1 (en) * 2004-10-01 2008-03-13 Masahiro Fujii Scribing Method for Brittle Material and Scribing Apparatus
CN100475419C (zh) 2004-10-25 2009-04-08 三星钻石工业股份有限公司 裂痕形成方法及裂痕形成装置
JP2007055000A (ja) * 2005-08-23 2007-03-08 Japan Steel Works Ltd:The 非金属材料製の被加工物の切断方法及びその装置
JP2007090860A (ja) * 2005-09-01 2007-04-12 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1414893A (zh) * 1999-10-29 2003-04-30 肖特玻璃厂 快速切割脆性材料制成的工件的方法和装置
CN1525944A (zh) * 2001-07-18 2004-09-01 ������ҵ�ɷ����޹�˾ 脆性材料基片的划线装置以及划线方法
WO2004014625A1 (ja) * 2002-08-09 2004-02-19 Mitsuboshi Diamond Industrial Co.,Ltd. 脆性材料基板のスクライブ方法およびスクライブ装置
CN1675021A (zh) * 2002-08-21 2005-09-28 皇家飞利浦电子股份有限公司 折断脆性基材的方法
JP2005212473A (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置およびこの装置を用いたスクライブ方法
EP1741534A1 (en) * 2004-04-27 2007-01-10 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming vertical crack on brittle board and vertical crack forming apparatus
WO2006002168A1 (en) * 2004-06-21 2006-01-05 Applied Photonics, Inc. Device, system and method for cutting, cleaving or separating a substrate material

Also Published As

Publication number Publication date
TW200914385A (en) 2009-04-01
KR101135436B1 (ko) 2012-04-13
KR20090032949A (ko) 2009-04-01
TWI406828B (zh) 2013-09-01
JP2009083119A (ja) 2009-04-23
JP5011048B2 (ja) 2012-08-29
CN101396771A (zh) 2009-04-01

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Granted publication date: 20130508

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