200400863 玖、發明說明： 【發明所屬之技術領域】 本發明係關於用來在大型脆性材料基板上形成劃線之 適合的劃線裝置。 【先前技術】 以玻璃基板等為代表之脆性材料基板之分割，一般所 採用的方法，係包含劃線製程及裂片製程，在劃線製程， 係將從脆性材料基板表面起以既定深度來形成之垂直裂痕 沿所希望的方向延續而形成劃線；在裂片製程，係接續於 sj線製程’藉由對脆性材料基板施加緊壓力，而沿著劃線 製程所形成之劃線將玻璃板予以分割。 分割脆性材料基板時所進行之劃線製程，已知的方法 二吏用超硬s金製或燒結鑽石製的刀輪來形成劃線。然而 —k種使用刀輪的方法，劃線形成中所產生之玻璃屑將附 著於脆丨生材料基板表面，當脆性材料基板使用於顯示裝置 =1夺則成為顯示缺陷的原因。又，在將脆性材料基板予以 f割之裂片製程實施時，可能在脆性材料基板的端面部分 等產生不想要的缺π ’而造成分割後脆性材料基板之 不良。 ' 法十=此問冑’近年來’使用雷射光束來形成劃線的方 :二達實用化。該使用雷射光束來形成劃線的方法，如圖 係'對構成劃、線對象之脆性枋料基板S，照射來自 雷射振#护W , 盈在置61之雷射光束LB。從雷射振盪裝置6i照射 200400863 田射光束LB ’係沿著劃線預定線而在脆性材料基板$ 上形成雷射光.點LS。從雷射振盪裝置61，照射之雷射光束 係在脆性材料基板s上沿著劃線預定線sl而相對於 脆性材料基板進行移動。 又，在脆性材料基板s表面之雷射光束LB照射區域 附近’係以形成劃線的方式，從冷卻噴嘴62 t附冷卻水 等的冷βρ媒體。在照射雷射光束LB之脆性材料基板S表 面’因雷射光| LB之加熱而產生壓縮應力後，藉由喷附 冷卻媒體，而產生拉伸應力。如此般s由於在壓縮應力產 生區域之鄰近區域形成拉伸應力，故在兩區域間，因個別 的應力而產生應力梯度，而在脆性材料基板s，從藉由刀 輪等而預先形成於脆性材料基板s端部之切口 tr沿著劃 線預定線而形成連續的垂直裂痕（盲裂痕）。 像上述使用雷射光束來形成劃線的方法，所產生的玻 璃屬極少，且由於是利用熱變形應力來形成劃線，在實施 裂片製程時並不會在脆性材料基板之端面產生缺口。 【發明内容】 發明所要解決之譯顥 上述採用雷射光束照射之劃線形成方法，主要是適用 於液晶顯示裝置所使用之小型玻璃基板等的劃線情形，而 在實施大型玻璃基板的劃線時’也能以相同的原理來進行 劃線。 大型玻璃基板劃線用的劃線裝置中，用來振盪出既定 200400863 長的雷射光束之雷射振盈器，係設置在偏離大型破璃基 (相對象）的位置，透過透鏡等的傳送系統，而將光束 =能量傳送至大型玻璃基板的劃線形成面上所設置之光 :員。在該光學頭附近設置用來嘴附冷卻媒體之冷卻喷嘴 因，用該劃線裝置來在大型玻璃基板上形成劃線時，在被 :住的大型玻璃基板上’係沿著所希望的劃線方法進行 于碩與冷卻喷嘴之掃描，藉由照射雷射光束所造成之加 …及—來自冷卻喷嘴之冷卻媒體所造成之冷卻，而使垂直裂 痕（首裂很）從預先形成於端部之切口開始進展，以形 希望的劃線。 、、而 > 此般之裝置構成，$ 了在大型玻璃基板上形 ，線，必須使光學頭及冷卻喷嘴在大型玻璃基板上移動 ’因此，伴隨該光學頭及冷卻喷嘴之移動，雷射光束對玻 螭基板面之光路會產生變動，而使玻璃基板面上所形成之 光束形狀產生變動，又冷卻喷嘴所喷出之冷卻媒體的喷附 位置也會變動。因Λ，由於產生如此般的變動，要使劃線 :形成維持穩定會有困#，因此沿著劃線將玻璃基板予以 袈片後，要使玻璃基板的分割面之品質能確保穩定會有困 又上述劃線裝置中，要在同一塊大型玻璃基板上設 置稷數個光學頭會面臨構造上的困難點，同時也有難以縮 短加工處理時間（tact)的問題。 本發明係有鑑於上述事情而構成，其目的係提供一劃 線裝置，在利用雷射光束之照射及冷卻媒體之冷卻來形成 0863 劃線時，對脆性材料基板之劃線形成面之光路完全不致產 生變動，又能設置複數個光學頭，而能縮短加工處理時間 並適用於大型脆性材料基板之劃線。 嚴以解^課題之手殺 、為了解決上述課題，本發明之劃線裝置，係具備：用 來在脆ί生材料基板上形成加熱區域之加熱機構、用來在接 近该加熱區域的位置形成冷卻區域之冷卻機構、用來形成 劃線起點的切口之切口形成機構，利用該加熱區域及冷卻 =間所產生的應力梯度來使垂直裂痕從該切口進展而形 2 劃線；其特徵在於：具備將該加熱機構、冷卻機 2、切口形成機構固定成一體之固定構機，使固定於該固 ==熱機構、冷卻機構、切口形成機構三者與該跪 = 基板，互相以既定的相對速度、在維持一定 位置關係下進行移動^ 上述本發明的劃線裝置較佳為，該加熱機構係具備_· :盧出雷射光束之雷射振里器，用來將雷射振盪器所 Μ出之雷射光束整形成既定形狀並照射至脆性材料基板 上之光學單元，配置於雷射 雷射振盪器所照射之·射光:夕與先學W、用來將 #之田射先束傳送至光學單元之傳送機構 固=ί振產器、光學單元及傳送機構，係和該固定機構 U疋成一體。 ^述本發明之劃線装置較佳為，該冷卻機構及切口形 ::糸隔者加熱機構而分別配設於移動方向兩側，該固 疋喊構相對於跪性材料基板不管朝前進及後退之任 移動均能進行劃線。 上述本發明之劃線農置較佳為， 數個，以在腈# Μ I 4 弋構機係具備複 在脆吐材科基板之複數部位同時形成劃線。 【實施方式】 實施形熊 以下詳細說明本發明之劃線裝置。 (實施形態1) 圖1係顯示實施形態1的劃線裝置1之概略椹… 1(a)為側面圖，圖1(b^ Α ~構成圖 ，…二 圖1(C)為前視圖。以下 使用圖l(a)〜(c)來說明本實施形態i之劃線 該劃線裝置卜係具有平板狀的支持台2:在支持台2 之上面，將用來振盪出具有既定照射能量的雷射之 射振盡器3安裝成和支持台形成—體。支持台2中，在雷 射振盪器3之雷射光束出射侧形成開口部在開"。 下面’將光學單元4安裝成和支持台形成—體，·該光學單 兀4 ’係將雷射振盪器3所照射之雷射光束射入，經整形 成既定形狀後’射出至脆性材料基板（劃線對象）s表面。 又’在支持台2之開口部2a上方，將2個彎曲鏡$安裝成 和支持台形成-體’·該2個彎曲€ 5,係將雷射_ 3 所照射之雷射光束朝開口部2a下面所設之光學單元4方向 反射。 在支持台2下面，於光學單元4附近將冷卻喷嘴6安 裝成和支持台形成一體，該冷卻喷嘴6係將冷卻媒體喷附 200400863 料基板S表面。又，隔著光學單元4 ==目㈣，係設有料在雜材料基^ 形 成㈣起點（起動點）的十刀口之起動機構7。 —冷卻噴嘴6、光學單元4、起動機構7，係 疋線而依序配置於同—直線 -Λ預 係配置Am 卩噴嘴6與光學單元4 婢體所ίΓ ，以使脆性材料基板8上藉由喷附冷卻 =:成之冷卻區域與藉由照射雷射光束所形成的加熱 劃線起·二=近:位置關係。起動機構7 ”、要能形成 所形成I力f…對藉由光學單元4之雷射光束照射 熱區域不管是形成接近或遠離皆可 置可任意選擇。 Aim 又射振i器3、彎曲鏡5、光學單元4、冷卻喷 巴起動機# 7等各構成安裝成一體之支持台2,係藉 由=之驅動機構來沿劃線預定線移動，在形成劃線時 材料美:^係以起動機構7側位於前頭的方向相對於跪性 rmv"行移動。又，藉由該移動機構，能將支持台 ”速又凋整成適合形成劃線的速度。 、盪器3所振盪出之雷射光束，在脆性材料基板 上所形成的加熱區域之加熱溫度，係比脆性材料基板s 之炼融溫度為彳6 ‘、'低以防止脆性材料基板S表面之熔融。亦 即’所使用的昭射台t , J，、、、射此里，係加熱溫度比脆性材料基板s 軟化點低者。这拉 ,. 幻S之種類而丄 會依脆性材料基板(加熱對 鋇而有不同，從雷射振盪器3所振盪出之雷射 束之照射能|，私技# % A 1 匕里車又佳為設定成可依脆性材料基板s之種類 200400863 而進行變更。 在光學單疋4，係將從雷射振盪器3射出而透過2個 二曲鏡5所射入之雷射光束，整形為適合形成劃線之所希 望形狀：例如為長軸沿劃線預定線方向之長圓形。 y 1 +、鳴6所噴出之冷卻媒體，基於容易使用的觀點 係以~部為代表’但也能變更成冷卻⑶2氣體 氣等的氣體狀冷铷拔駚 ^ 體。 7卩媒體，或冷卻有機溶劑等的液狀冷卻媒 起動機構7，.择Μ 士 1 ,仏5又有刀輪等的機械機構，以在脆性材 =，=望位置、例如脆性材料基板s之接近表面 線起點之切口。哕機 藉此形成劃 既定位置以外時當位在跪性材料基板s上的 置乂外時必須不致壓到脆性材料基板s 動機構7中钟古戌斗、 土做s因此在起 )。又，作為跪性材料基板8表面 ^機構（未圖示 機構外，也v 之刀口形成機構，除機械 也此使用YAG雷射等 該光學機構對於脆性材料基板s機構。延時，由於 須設置上下移動機構。 “係形成非接觸，故不 其次，說明使用上$ # # 首先，蔣你, J」踝哀置1之劃線方法。 線F f 對象之龜材料基板S，#行到 線▲置I之位於光學單元4、 i s載置在劃 方之載台。載置丰θ 7喷枭6、起動機構7下 線的* 載置時，疋以脆性材料基板s表 向和劃線裝置I的劃線 4預定 置對準。 致的方式來進行位 200400863 其次，藉由驅動移動機構，而使支持台（將光學單元4 〜卻噴嘴6、起動機構7安裝成一體）2相對於脆性材料 基板S進行移動。當支持台2移動時，首先起動機構7會 到達脆性材料基板S的端部。在該端部位置，將安裝於起 動機構7前端之刀輪等的機械機構緊壓於脆性材料基板§ 表面’藉此在該位置形成劃線起點之切口。 在脆性材料基板S表面形成切口後，為避免在脆性材 料基板S表面不小心產生傷痕等，係使起動機構7前端之200400863 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a suitable scribing device for forming a scribing line on a large brittle material substrate. [Prior technology] The division of brittle material substrates represented by glass substrates, etc., generally uses a scribing process and a split process. In the scribing process, it is formed from the surface of the brittle material substrate at a predetermined depth. The vertical cracks continue in the desired direction to form a scribe line; in the sliver process, it is connected to the sj line process. 'By applying tight pressure on the brittle material substrate, the glass plate is applied along the scribe line formed by the scribe process. segmentation. The scribing process performed when dividing a brittle material substrate is a known method. A scribing wheel made of super-hard s gold or sintered diamond is used to form the scribing. However, for the k-type methods, the glass shavings generated during the scribing will be attached to the surface of the fragile material substrate. When the fragile material substrate is used in the display device = 1, it becomes the cause of display defects. In addition, when the fracturing process for fragile material substrates is carried out, undesired defects π 'may be generated in the end face portions of the fragile material substrates and the like, which may cause defects in the fragile material substrates after division. "Method 10 = This question" In recent years, the use of a laser beam to form a scribe line: Erda is practical. The method of forming a scribing line using a laser beam, as shown in the figure, is to irradiate a laser beam LB from the laser oscillator #protect W, which is at 61, on the brittle material substrate S constituting the scribe and line objects. The 200400863 field laser beam LB 'is irradiated from the laser oscillation device 6i to form a laser light spot LS on the brittle material substrate $ along a predetermined line of the scribing line. From the laser oscillator 61, the irradiated laser beam is moved relative to the brittle material substrate along the predetermined scribe line sl on the brittle material substrate s. In the vicinity of the area irradiated with the laser beam LB on the surface of the brittle material substrate s', a cold βρ medium such as cooling water is attached from the cooling nozzle 62 t so as to form a scribing line. After the surface S of the brittle material substrate S irradiated with the laser beam LB is subjected to compressive stress due to the heating of the laser light | LB, the cooling medium is sprayed to generate tensile stress. In this way, since tensile stress is formed in the adjacent region of the compressive stress generating region, a stress gradient is generated due to individual stress between the two regions, and the brittle material substrate s is previously formed in brittleness by a cutter wheel or the like. The slit tr at the end of the material substrate s forms a continuous vertical crack (blind crack) along a predetermined scribe line. As described above, the method of forming a scribe line using a laser beam generates very few glasses, and since the scribe line is formed by using thermal deformation stress, no chipping is generated on the end face of the brittle material substrate during the slicing process. [Summary of the Invention] The above-mentioned method for forming a scribing line using laser beam irradiation is mainly applicable to the scribing of a small glass substrate used in a liquid crystal display device, and the scribing of a large glass substrate is implemented. Hours can also be underlined by the same principle. The laser scribing device for scoring large glass substrates is used to oscillate a laser beam of a predetermined length of 200,400,863. It is set at a position deviated from the large broken glass substrate (phase object) and transmitted through a lens or the like. System, and transmits the light beam = energy to the light set on the scribe formation surface of the large glass substrate: member. A cooling nozzle is provided near the optical head for attaching a cooling medium. When the scribing device is used to form a scribing line on a large glass substrate, the large glass substrate is held along the desired scribing line. The line method is performed on the scanning of the cooling nozzle and the cooling nozzle, and the vertical cracks (first cracks) are formed in advance at the ends by adding the cooling caused by the laser beam and the cooling caused by the cooling medium from the cooling nozzle. The incision began to progress, marking the desired line. , And > Such a device configuration, the shape and line on a large glass substrate, the optical head and the cooling nozzle must be moved on the large glass substrate. Therefore, with the movement of the optical head and the cooling nozzle, the laser The light beam changes the light path of the glass substrate surface, and the shape of the light beam formed on the glass substrate surface changes, and the spraying position of the cooling medium sprayed by the cooling nozzle also changes. Because of Λ, due to such a change, it is necessary to make the scribe line: it will be difficult to form a stable #. Therefore, after the glass substrate is chipped along the scribe line, the quality of the divided surface of the glass substrate must be stable. In the above-mentioned scribing device, it is difficult to shorten the processing time (tact) when installing several optical heads on the same large glass substrate. The present invention is structured in view of the above-mentioned matters, and an object thereof is to provide a scribing device, and when a 0863 scribing is formed by irradiation of a laser beam and cooling of a cooling medium, the light path of a scribing formation surface of a brittle material substrate is completely No change is caused, and multiple optical heads can be set, which can shorten the processing time and is suitable for the scribing of large brittle material substrates. In order to solve the problem strictly, in order to solve the above-mentioned problem, the scribing device of the present invention is provided with a heating mechanism for forming a heating region on a substrate made of brittle material, and a heating mechanism for forming a position close to the heating region. The cooling mechanism of the cooling area and the notch forming mechanism for forming the notch at the starting point of the scribe line utilize the stress gradient generated between the heating area and the cooling zone to make a vertical crack progress from the incision to form a 2 scribe line; it is characterized by: Equipped with a fixed structure machine which fixes the heating mechanism, the cooler 2 and the notch forming mechanism into one body, and fixes the three fixed == heating mechanism, cooling mechanism, and notch forming mechanism and the substrate = to each other in a predetermined relative to each other. Speed and movement while maintaining a certain positional relationship ^ The above-mentioned scribing device of the present invention is preferably, the heating mechanism is provided with _ :: a laser vibrator for emitting a laser beam, which is used to connect the laser oscillator The laser beam from the laser beam is shaped into a predetermined shape and irradiates the optical unit on the brittle material substrate. It is arranged in the laser laser oscillator. The transmission mechanism of # 之 田 射 先 束 transmission to the optical unit is fixed. The vibrator, optical unit, and transmission mechanism are integrated with the fixed mechanism U 疋. ^ It is preferable that the scribing device of the present invention is that the cooling mechanism and the notch shape are arranged on both sides of the moving direction separately from the heating mechanism. Any move back can be crossed. The above-mentioned scoring farms according to the present invention are preferably a plurality of scoring lines, and the scoring lines are formed simultaneously on a plurality of locations on the substrate of the fragile sapaceae family. [Embodiment] Embodiment-shaped bear The scribing device of the present invention will be described in detail below. (Embodiment 1) FIG. 1 shows the outline of the scribing device 1 according to Embodiment 1 ... 1 (a) is a side view, FIG. 1 (b ^ A ~ composition diagram, ... FIG. 1 (C) is a front view. The following uses FIG. 1 (a) to (c) to explain the scribe line of this embodiment i. The scribe device has a flat support table 2: on the support table 2, it will be used to oscillate with a predetermined irradiation energy. The laser beam stopper 3 is installed to form a body with the support table. In the support table 2, an opening is formed on the laser beam exit side of the laser oscillator 3 to open. "The optical unit 4 is mounted below" Chenghe support platform formation-body, the optical unit 4 'injects the laser beam irradiated by the laser oscillator 3 into a predetermined shape' and emits it to the surface of the brittle material substrate (scribing object) And 'the two curved mirrors are mounted above the opening 2a of the support table 2 to form a support body-the two bends are € 5, which directs the laser beam irradiated by the laser _ 3 toward the opening. The optical unit 4 provided under the portion 2a reflects in the direction. Below the support table 2, a cooling nozzle 6 is installed and supported near the optical unit 4. Forming one body, the cooling nozzle 6 sprays the cooling medium on the surface of the 200400863 material substrate S. In addition, the optical unit 4 == mesh is provided with a material that is formed on a base of miscellaneous materials. Starting mechanism 7. —The cooling nozzle 6, the optical unit 4, and the starting mechanism 7 are arranged sequentially in the same line—the straight line—Λ pre-arranged Am 卩 nozzle 6 and the optical unit 4 ίΓ to make the brittle material The cooling area on the substrate 8 by spraying =: the cooling area formed by the laser beam and the heating scribing line formed by irradiating the laser beam. The second = near: positional relationship. The starting mechanism 7 ”must be able to form the formed I force f ... The laser light beam irradiated by the optical unit 4 can be arbitrarily selected whether it is close to or far away from the hot area. Aim also has a vibrator 3, a curved mirror 5, an optical unit 4, a cooling jet starter # 7, etc. The support table 2 which is integrally installed is moved along the predetermined line by the driving mechanism of =, and the material is beautiful when the line is formed: ^ is relative to the kneeling rmv " in the direction of the starting mechanism 7 side at the front. Line movement. Moreover, with this moving mechanism, The "holding table" speed is then reduced to a speed suitable for forming a scribe line. The heating temperature of the laser beam oscillated by the oscillator 3 on the brittle material substrate is higher than that of the brittle material substrate s. The temperature is 彳 6 ',' is low to prevent the surface of the brittle material substrate S from melting. That is, the used shogun stage t, J ,,,, and here is the heating temperature lower than the softening point of the brittle material substrate s. This pull ,. The type of the magic S depends on the brittle material substrate (the heating is different for barium, the radiation energy of the laser beam oscillated from the laser oscillator 3 |, private technology #% A 1 The vehicle is preferably set to be changed according to the type of the brittle material substrate s200400863. In the optical unit 4, the laser beam emitted from the laser oscillator 3 and transmitted through the two curved mirrors 5 is shaped into a desired shape suitable for forming a scribe line: for example, a long axis is scheduled along the scribe line Oval in the direction of the line. From the viewpoint of ease of use, the cooling medium ejected by y 1 + and Na 6 is represented by ~ ', but it can also be changed to a gaseous cold-drawing body that cools ⑶2 gas. 7 卩 Medium, or liquid cooling medium starting mechanism for cooling organic solvents, etc., 1, 仏 5, and 5 have mechanical mechanisms such as knife wheels, so that the brittle material =, = look position, such as brittle material substrates A cut near the start of the surface line. The hoisting machine is thus formed so that it is not placed on the kneeling material substrate s when it is positioned outside the predetermined position, and it must not be pressed against the brittle material substrate s in the moving mechanism 7. The ancient bucket and the earth do not start.) In addition, as the mechanism of the surface 8 of the kneeling material substrate (not shown), the blade formation mechanism of v is also used. In addition to the machinery, the optical mechanism such as YAG laser is also used for the brittle material substrate s mechanism. Move the mechanism. "The system is non-contact, so it is not next, so use $ # # First, Jiang You, J" Ankle scribe line method 1. Line F f target turtle material substrate S, # 行 到 线 ▲ Position I is located on the optical unit 4 and is placed on the scribe-lined stage. When placing the θ 7 spray nozzle 6 and the starting mechanism 7 off the line * When placing, the surface orientation and scribing device I is made of a brittle material substrate s The scribe line 4 is intended to be aligned. The method is to perform the position 200400863. Next, by driving the moving mechanism, the support table (the optical unit 4 to the nozzle 6 and the starting mechanism 7 are integrated) 2 is relatively fragile. The substrate S moves. When the support table 2 moves, the starting mechanism 7 first reaches the end of the brittle material substrate S. At this end position, a mechanical mechanism such as a cutter wheel mounted on the front end of the starting mechanism 7 is pressed against the brittleness. Material substrate § surface ' The position of the starting point of a cut scribe line in the surface of the brittle material substrate S is formed cutout, in order to avoid accidentally scratched the surface of the brittle material substrate S, etc., based front end of the starting mechanism 7
機械機構對於m料基板S表㈣成非接觸狀態後，再 繼續支持自2的移動。接著，當支持台2下面之光學單元 4、冷卻喷嘴6㈣脆性材料基板8表面的切口位置時， 開始驅動雷射振堡H 3’又開始從冷卻喷嘴6喷出冷卻水 等的冷卻媒體。After the mechanical mechanism is in a non-contact state with respect to the surface of the m substrate S, it continues to support the movement from the 2nd. Then, when the optical unit 4 and the cooling nozzle 6 under the support table 2 are cut at the notch position on the surface of the brittle material substrate 8, driving of the laser fort H 3 'is started, and cooling medium such as cooling water is ejected from the cooling nozzle 6 again.
雷射振盈器3被驅動後會振盪出具有既定能量的雷: 光束。所振盪出的雷射光束，被2個彎曲鏡5往形成於 持台2的開…a方向反射，通過開口部2&之雷射光 會射入光學單元4 °在雷射光束所射入之光學單元4,, 射光束整形成長圓形等的既定形狀後，朝跪性材料基板1 表面照射。在脆性材料基板s表面，係對應於所照射之$ 射光束之雷射光點而形成加熱區域。 冷卻喷嘴6 料基板S表面， 形成冷卻區域。 ，係將冷卻水等的冷卻媒 而在照射雷射光束所造成 體喷附於脆性材 之加熱區域附近 在形成於脆性材料基板 S表面之加熱區域會產生壓縮 12 200400863 應力’而在嘴附冷卻媒體的冷卻區域會產生拉伸應力。如 此般使照射雷射光束所產生之壓縮應力 '及形成於其後方 側之冷卻媒體所產生之冷卻區域的拉伸應力形成於脆性材 料基板S之劃線預定線上，而使加熱區域及冷卻區域依序 移動於劃線預定線上，藉此從脆性材料基板S端部所形成 之切口連續生成垂直方向的垂直裂痕（盲裂痕），而形成所 希望的劃線。 ^本實施形態1之劃線裝置i，係將雷射振盪器3、彎曲 鏡5、光學單元4 '冷卻喷嘴6 '起動機構7等形成劃線所 需的所有構件均和支持自2安裝成-體。@此，就算各構 件相對於脆性材料基板S表面產生移動，也能防止雷射光 ^對跪性材料基板s表面之光路產生變動，故跪性材料基 板S,、表面所照射的雷射光束之光束形狀不致產生變動。又 冷部m所贺出之冷卻媒體的喷附位置也不致 動而維持一定。因 Λ 展王支 ,^ b使s彳線的形成維持穩定，劃線形 成後貫施裂片製程而分割之跪性 ! 面品質之穩定。 ㈣基板s ’可·分割 但使脆性材料基板s相對 ' α 2移㈣例子’ (實施形態2) 進行移動亦可。 圖2係顯示本實施形態2 該劃線裝置10,係且有^ —攻扁置1〇之側視圖。 之劃線裝置1大致相同的構成，除斤：的貫施形態】 1的構成外，係將起動機構 e Ί 1之劃線裝置 7及冷卻噴嘴6分別設在光學After the laser oscillator 3 is driven, it will oscillate a lightning: beam with a predetermined energy. The oscillated laser beam is reflected by the two curved mirrors 5 in the opening ... a direction formed on the stage 2. The laser light passing through the opening 2 & enters the optical unit 4 ° where the laser beam enters The optical unit 4 and the light beam are shaped into a predetermined shape such as an oval, and then irradiated toward the surface of the kneeling material substrate 1. On the surface of the brittle material substrate s, a heating area is formed corresponding to the laser light spot of the irradiated $ beam. The nozzle 6 cools the surface of the substrate S to form a cooling area. In the heating area formed on the surface of the brittle material substrate S, a cooling medium such as cooling water is sprayed near the heating area of the brittle material caused by the laser beam, and a compression stress of 12 200400863 is generated in the mouth. Tensile stresses are generated in the cooled area of the media. In this way, the compressive stress' generated by irradiating the laser beam and the tensile stress of the cooling region generated by the cooling medium formed on the rear side thereof are formed on the predetermined scribe line of the brittle material substrate S, so that the heating region and the cooling region By sequentially moving on a predetermined scribe line, a vertical crack (blind crack) in the vertical direction is continuously generated from a cutout formed at the end of the brittle material substrate S to form a desired scribe. ^ The scribing device i of the first embodiment is a laser oscillator 3, a bending mirror 5, an optical unit 4 'cooling nozzle 6', a starting mechanism 7 and the like. -body. @This, even if each component moves relative to the surface of the brittle material substrate S, the laser light can be prevented from changing the light path of the surface of the kneeling material substrate s. Therefore, the laser beam irradiated by the surface of the kneeling material substrate S, The beam shape does not change. Also, the spraying position of the cooling medium conveyed by the cold section m is kept constant without being activated. Because Λ spreads the king branch, ^ b keeps the formation of the s 彳 line stable, and the scribe line is formed by the subsequent application of the slicing process to split the kneeling! The surface quality is stable. The "substrate s" can be divided. However, the brittle material substrate s can be moved relative to "α 2 shift example" (Embodiment 2). FIG. 2 is a side view of the scribing device 10 according to the second embodiment, which has a flattening device 10. The scribing device 1 has substantially the same structure, except that the structure of the penetrating device] 1 is also provided with the scribing device 7 and the cooling nozzle 6 of the starting mechanism e Ί 1 in the optical system.
13 200400863 單元4的兩側，又將用來 拉〜么+人 動支持口 2之移動機構設成可 在則後方向移動。該書彳線贺 ί Λ丄 相線I置10令，關於與劃線裝置1 相同的構成係附上相同的元件符號。 本實施形態2之書ι|魂护署7 λ , 接—、 由於在光學單元4之前 後兩側分別設置起動機構7 η 7部賀鳴6，在完成1次脆 性材枓基板S的劃線後，移動 蚀m μ炫 腕性材枓基板S的位置，並 使支持σ彺苐1次劃線的反方 劃線。 Π移動，措此即可繼續形成 因此，本實施形態2之劃续 書“…一3 〇，除實施形態1的 -J線裝置1所得的效果外，由 w孓了進仃在復切斷，故 步可謀求加工處理時間之縮短 Α也―告丨& 而適用於大型脆性材料 基板之劃線形成。 在本實施形態2係說明使支持台2移動的例子 脆性材料基板S相對於支持台2進行㈣亦可。 — (實施形態3) 圖3〜圖5係顯示實施形態3的割 』、π 綠裝置20的概略構 成，圖3為側視圖，圖4為俯視 μ 〇马刖視圖。以下 使用圖3〜圖5來說明本實施形態3之劃線裝置 该劃線裝置2G具有平板狀的支持台2ι。在支持台2 的上面，將用來振盪出具有既定 、σ 1 、⑴此里的雷射光束 射振盪器22安裝成和支持台21形成—體。支持二2 ，在雷射振盪器22之雷射光束出射側形成開口 :::1::: 開：部2U下面，將光學單元23安農成和支持：形二 ，該光學單元23，係將雷射振盪器22 一 所照射之雷射光束 14 200400863 射入’經整形成既定形狀後，射出 Τ ®至脆性材料基板（劃線對 象)S表面。又’在支持台21之開口部…上方，將2個 f曲鏡24安裝成和支持台21形成—體；該顯曲鏡μ ，係將雷射振蘯器22所照射之雷射光束朝開口部…下面 所設之光學單元23方向反射。 —在支持台21下面，於光學單元23附近將冷卻喷嘴υ 安裝成和支持台η形成一體，該冷卻噴嘴25係將冷卻媒 體喷附至脆性材料基板s表面。又，隔著光學單元23而 在冷卻喷嘴25之相反倒’係設㈣來在龄㈣基板s 的端部等形成劃線起點（起動點）的切口之起動機構％。 本實施形態3，如此般將雷 #與一” 匕如將雷射振盪器22、資曲鏡24、 光予早7L 23、冷卻喷嘴25、刼叙她4^ ^ 捭士 起動機構26安裝成一體之支 持σ 2 1 ’係设有複數個，對— . , f片脆性材料基板S實施丨_欠 SJ線即可同時在複數部位形成劃線。 亦即，本實施形態3之劃線裝置2〇,係將複 D 21設置在1個移動機構27 抽去 支持 置各支持” i之移移動機構27儀具有用來設 她姐 在该劃線裝置20,在弒缸 機構27之移勳台部28兩 在移動 對導執29,移動“”8 :l，成和劃線預定線平行之- y 秒勒口邵28係置 線移動。該移動台部28，係由 而他沿劃線預定 執29移動。 ，、错由未圖示的驅動機構來沿導 ，，將具備各支持台21之移動台部2” 精由不圖示的移動機構來移動脆 ，而 亦可。 +丞板S U進行劃線 15 200400863 又，設於移動台部28上之各支持台21，如圖4之虛 線所示般，可在移動台部28上沿劃線預定線的正交方向 ，置調整，以在脆性材料基板s表面上之既定位置形 成劃線。 關於雷_器22等的詳細構成，由於和實施形態i 的雷射振里器1等相同’故在此省略其等構成的詳細說明 〇 又，關於使用該劃線裝置2〇之劃線方&，由於和使用 實施形態1的劃線裝置1之劃線方法相同，故省略其詳細 成明。但在本實施形態3中，由於具備雷_器以等 形成劃線所需的構成之支持台21係具備複數個，故對一 片脆性材料基板S實施i次劃線即可同時形成複數條劃線 〇 ±如此般’本實施形態3之劃線裝置20,由於實施！次 Μ線即可同B♦形成複數條劃線，相較於實施形態！之劃線 裝置1可進一步謀求加工處理時間之縮短化。 如此般，本實施形態3之劃線裝置2〇，由於具備雷射 振盪益22等形成劃線所需的構成之支持台21係具備複數 固對片脆性材料基板S實施丨次劃線即可同時形成複 =條劃線’故適用於在大型脆性材料基板上形成多數條劃 又，本實施形態3中，各支持台21係採用和實施形態 ^的劃線裝置之支持台2相同的構成，而僅能進行單方向 劃線，但和實施形態2所說明的劃線裝置10的支持台2 16 構7及冷卻噴嘴…設於光學單“的 ，即可朝前ir能移動於前後方向亦可。依據這種構成 理時間。後兩方向進行劃線’而能更進一步縮短加工處 備將加之本發明的劃線裝置，其特徵在於：係具 卻機構㈣=力:Γ基板上形成加熱區域)、冷 口形成機構= 熱區域的位置形成冷卻區域)、切 構機，藉由該固定機椹，你，為， 成肢心印心 機構使加熱機構、冷卻機構、切口# 關對於該跪性材料基板在維持-定的相對位置 之各構成Γ:多動。本發明之劃線裝置，就算形成劃線所需 戈 目丨於跪性材料基板產生移動，仍能防止加熱區 :::的位置產生變動。因此，能使劃線的形成維 、：…!線形成後實施裂片製程而分割出之脆性材料基 板S，可確保分割面品質之穩定。 又’本發明之另-劃、㈣置，係隔著加熱機構而將冷 ㈣構及切口形成機構分別配設於跪性材料基板之行進方 向兩側’而使該固定機構相對於幻生材料基板朝前進及後 退方向移動均能進行黯材料基板之㈣。藉此， :4不加工處理時間之縮短化，而適用於在大型跪性材料 基板上形成劃線。 又’本發明之其他劃線裝置’係設置複數個固定構機（ 周來將加熱機構、冷卻機構及切口形成機構固定成一體）， 17 並具有可使各固定機構往相 該移動機構之移動以佶 D移動之移動機構，藉由 π傅 < 移動以使各固定機 跪性材料Α Μ矣品 構在相同方向移動，而在 何杆基板表面之複數部位 — 牡 片脆性材料基板，藉由 y ^、· 一藉此，對— .. . τ 1二人劃線即可形成複數條劃線 料其k u 細短化，而適用於在大型脆性;^ 科基板上形成劃線。 i胍/ 生材 【圖式簡單說明】13 200400863 On both sides of unit 4, the moving mechanism used to pull ~ + human support port 2 is set to move in the rear direction. The book 彳 彳 Λ 丄 Phase line I is set to 10 orders, and the same components as those of the scribing device 1 are given the same component symbols. The book of this embodiment 2 | Soul protection department 7 λ, then — Since the starting mechanism 7 η 7 congratulations 6 are provided on the front and back sides of the optical unit 4, respectively, the marking of the brittle material S substrate S is completed once. After that, the position of the base material S of the wrist material etched by the μ m dazzle is moved, and an inverse scribe line that supports σ 彺 苐 primary scribe line is made. Π moves, and measures can continue to be formed. Therefore, the plan of the second embodiment "...-30", in addition to the effect obtained by the -J line device 1 of the first embodiment, the w-th line is inserted into the re-cut line. Therefore, it is possible to shorten the processing time A. It is also suitable for the formation of a large-scale brittle material substrate. In the second embodiment, an example in which the support table 2 is moved to support the brittle material substrate S relative to the support is described. The stage 2 can also be used. — (Embodiment 3) FIG. 3 to FIG. 5 show the cut structure of Embodiment 3, and the schematic configuration of the π green device 20. FIG. 3 is a side view, and FIG. The following describes the scribing device of the third embodiment with reference to FIGS. 3 to 5. The scribing device 2G has a flat-shaped support table 2ι. On the support table 2, it will be used to oscillate with a predetermined value, σ 1, ⑴ Here, the laser beam emitting oscillator 22 is installed to form a body with the support table 21. The support 2 is 2 and an opening is formed on the laser beam emitting side of the laser oscillator 22 ::: 1 ::: On: under the 2U , The optical unit 23 Annongcheng and support: Form two, the optical unit 23, will be thunder Oscillator 22 An irradiated laser beam 14 200400863 is incident on 'After being shaped into a predetermined shape, it is emitted to the surface of the brittle material substrate (scribing object) S.' Above the opening of the support table 21, The two f-curvature mirrors 24 are installed to form a body with the support table 21; the curved mirror μ reflects the laser beam irradiated by the laser vibrator 22 toward the openings ... the optical unit 23 provided below. -Below the support table 21, a cooling nozzle υ is installed near the optical unit 23 so as to be integrated with the support table η. The cooling nozzle 25 sprays a cooling medium onto the surface of the brittle material substrate s. The opposite of the cooling nozzle 25 is a starting mechanism which is provided to form a notch starting point (starting point) at the end of the substrate s and the like. In the third embodiment, the ray # 和 一 is used as such. For example, the laser oscillator 22, the asset mirror 24, the light 7A 23, the cooling nozzle 25, and the 4 ^ ^ 捭 捭 starting mechanism 26 are installed into an integrated support σ 2 1 'is provided with a plurality of, —., F pieces of fragile material substrate S can be implemented 丨 _ under SJ line When the scribe line is formed in plural parts. That is, the scribing device 20 of the third embodiment is provided with the complex D 21 in one moving mechanism 27, and the support is removed, and each support is provided. The device 20, the moving table part 28 in the cylinder mechanism 27, and the moving guide 29, moving "" 8: 1, parallel to the predetermined line of the scribe line-y seconds. The mobile station section 28 is intended to move along the scribing line 29. As a guide, it is guided by a drive mechanism (not shown), and the mobile station section 2 "with each support table 21" is not shown. It is also possible to move the mechanism to move the crisp. + 丞 板 SU scribes 15 200400863 Also, as shown by the dotted line in FIG. 4, each support table 21 provided on the mobile station section 28 can be aligned on the mobile station section 28 along the orthogonal direction of the predetermined line. The position adjustment is performed to form a scribe line at a predetermined position on the surface of the brittle material substrate s. The detailed configuration of the laser device 22 and the like are the same as those of the laser resonator 1 and the like of the embodiment i, so detailed descriptions of these structures are omitted here. & Since the scribe method using the scribe device 1 of the first embodiment is the same, the detailed explanation thereof is omitted. However, in the third embodiment, since there are a plurality of support tables 21 having a structure necessary for forming a scribing line, etc., a plurality of scribing lines can be formed at the same time by performing i scribing on a piece of brittle material substrate S. Line 0 ± so 'The implementation of the scribing device 20 of the third embodiment! Sub-M line can form a plurality of scribe lines with B ♦, compared with the implementation form! The scribing device 1 can further reduce the processing time. As described above, the scribing device 20 of the third embodiment has a support table 21 having a structure necessary for forming a scribing line such as a laser oscillator 22 and the like. Simultaneously forming a complex = stripe line is suitable for forming a plurality of stripes on a large brittle material substrate. In the third embodiment, each support table 21 has the same structure as the support table 2 of the scribing device of the embodiment ^. Only one-direction scribing can be performed, but it is the same as the support table 2 16 structure 7 and cooling nozzle of the scribing device 10 described in the second embodiment. Also, according to this constitutional time. The scribing in the last two directions can further shorten the processing place. The scribing device of the present invention is added, which is characterized in that the mechanism has a mechanism ㈣ = force: Γ is formed on the substrate. (Heating area), cold mouth forming mechanism = position of the hot area to form a cooling area), a cutting machine, with this fixing machine, you, the heating mechanism, the cooling mechanism, and the incision for the limb initiation mechanism The kneeling material substrate Each component of a fixed-fixed relative position Γ: Hyperactivity. The scribe device of the present invention can prevent the position of the heating zone ::: from changing even if the substrate required to form the scribe is moved. Therefore, the formation dimension of the scribing line: ...! The brittle material substrate S separated by the slicing process after the formation of the line can ensure the stability of the quality of the divided surface. The cold heading structure and the notch forming mechanism are respectively arranged on both sides of the traveling direction of the kneeling material substrate through the heating mechanism, so that the fixing mechanism can move the material substrate in the forward and backward directions relative to the pseudo-material substrate. In this way,: 4 without shortening the processing time, it is suitable for forming a scribing line on a large kneeling material substrate. Also, the "other scribing device of the present invention" is provided with a plurality of fixed structure machines (Zhoulai The heating mechanism, the cooling mechanism and the notch forming mechanism are fixed into a single body), 17 and the moving mechanism can move each fixing mechanism to the moving mechanism to move the moving mechanism by πF < The stationary machine Α Μ 矣 product structure moves in the same direction, and at a plurality of locations on the surface of the substrate of the rod—a piece of brittle material substrate, with y ^, · this, to-... Τ 1 two people Scribing can form a plurality of scribing materials whose ku is shortened, which is suitable for forming a scribing on a large brittle substrate. Guanidine / raw material [Schematic description]
(—)圖式部分 lr、：係顯示實施形態1的劃線裝置之概略構成， 側視圖，圖1⑻係俯視圖，停1(c)係前視圖。 圖2係顯示實施形態2的劃線震置之側視圖。 圖3係顯示實施形態3的劃線震置之側視圖。 圖4係顯示實施形態3的劃線裝置之俯視圖。 圖5係顯示實施形態3的劃線裝置之前視圖。(-) Schematic section lr: shows the schematic configuration of the scribing device according to Embodiment 1, a side view, FIG. 1 is a top view, and stop 1 (c) is a front view. FIG. 2 is a side view showing the scribing vibration setting of the second embodiment. Fig. 3 is a side view showing the scribing vibration of the third embodiment. Fig. 4 is a plan view showing a scribing device according to a third embodiment. Fig. 5 is a front view showing a scribing device according to a third embodiment.
圖6係用來說明採用雷射光束照射之脆性材料基板 分割方法之示意圖。 (二）元件代表符號 1…劃線裝置 2…支持台 3···雷射振盪器 4，·.光學單元 5…彎曲鏡 6···冷卻噴嘴 18 200400863 7… 起動機構 10. •劃線裝置 20. •劃線裝置 21. •支持台 22. •雷射振盈？§ 23. •光學單元 24· •彎曲鏡 25· •冷卻喷嘴 26. •起動機構 27· •移動機構 28- •移動台部 29· •導軌Fig. 6 is a schematic diagram for explaining a method for dividing a brittle material substrate irradiated with a laser beam. (II) Symbols for component 1 ... Scribing device 2 ... Supporting stand 3 ... Laser oscillator 4, ... Optical unit 5 ... Bending mirror 6 ... Cooling nozzle 18 200400863 7 ... Starting mechanism 10. Scribing Device 20. • Scribing device 21. • Support stand 22. • Laser vibration? § 23. • Optical unit 24 · • Curved mirror 25 · • Cooling nozzle 26. • Starting mechanism 27 · • Moving mechanism 28- • Moving table section 29 · • Guide rail